Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Anzeige
Evaluating Ruggedizing Polymers: Insights from Condensing Environmental Conditions
Evaluating the protective efficacy of ruggedizing polymers using condensing environments is an innovative approach that can help simulate real-world conditions. Protective polymers are incre
.. weiterlesen
Achieving Lower Voids with a Novel Preform Flux Technology
Many of today’s advanced electronic devices require the use of solderable preforms in applications, including solder thermal interface materials (TIMs), power module attach, and any other ap
.. weiterlesen
A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint for Single Use and Short Lifetime...
The paper presents the development of an innovative recyclable and biodegradable PCB substrate material created to meet the stringent environmental demands of future electronic products. The
.. weiterlesen
High Density Substrates for Chiplet Technologies
The increasing demands on electronic systems have led to the current trend of using chiplets instead of individual chips. In detail, this means that individual silicon components or function
.. weiterlesen
Implementing IPC-1782 External Traceability for Trusted Material Provenance across the Supply Chain
The IPC-1782 traceability standard is a key part of the IPC Factory of the Future ecosystem, providing a framework for ensuring trusted product and material provenance. The purpose of this s
.. weiterlesen
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II
For many years, metals have been used as thermal interface materials (TIMs), and until recently, the most common type of metal TIM were solder TIMs. Due to their high reliability and thermal
.. weiterlesen
iNEMI Reliability and Loss Properties of Copper Foils for 5G Applications
The advancement of high-frequency applications, especially for 5G technology, demands PCBs endure thermal shock during soldering while preserving signal integrity. Traditional copper foil su
.. weiterlesen
Process Traceability in Hand Soldering, Rework and Repair – The Missing Link.
Since its inception, the electronics manufacturing industry has developed methods to improve the efficiency of its many processes. One of the key methods developed and now a fundamental proc
.. weiterlesen
Robotic Process for Fast and Reliable BGA Re-balling
Enabling re-use of expensive BGA components with fast & high quality of BGA re-balling process can be a cost-effective solution.It fits many electronic segments such as military, aer
.. weiterlesen
The Human Edge in Digital Manufacturing - Beyond Automation the Role of People in Industry 4.0
Industry 4.0 defined a vision for the factory where automation dynamically adjusts and adapts to its operational demands and to the products it is building. What has been overlooked is the c
.. weiterlesen
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) of additive electronics has gained considerable momentum in recent years due to the 3D design creativity that its additive materials provide. However, the
.. weiterlesen
Optimizing SMT Printing: The Impact of Contact Time and Fluid Dynamics on Yield Enhancement
In the quest for perfection within SMT printing, numerous factors such as print speed, blade pressure, and nano-coatings have been meticulously studied. Yet, the solvent delivery system—a cr
.. weiterlesen
Early Defect Detection with a Scalable Broad-Spectrum Test Using Radiofrequency Reflectometry
This work explores radio frequency (RF) reflectometry as an early-stage defect detection technology for electronics. In-circuit testing (ICT) is limited to fully assembled boards, while auto
.. weiterlesen
Tooling Population Effects on Imaging Registration Accuracy for UHDI Substrates
A study of methods for improving direct imaging registration for Ultra High Density Interconnect [UHDI], flex and other challenging constructs using new and existing registration technologie
.. weiterlesen
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gb/s and Beyond
The datacenter continues to demand increasingly higher component data rates to satisfy growing application requirements. Efforts are underway, as illustrated by the IEEE 802.3dj objectives[1
.. weiterlesen
Design Considerations for Sustainable Printed Circuit Boards
In addition to manufacturability, performance, reliability and cost, environmental impact increasingly becomes a design driver for printed circuit boards and assemblies. A prerequisite is th
.. weiterlesen
Alternative Methods in Measuring BGAs for Thermal Warpage
Warpage determination for ball grid array (BGA) packages require measurement of the surface containing solder balls. Balls can be sheared, and the surface painted. Surface damage can alter t
.. weiterlesen
Enhancements in Reliability Achieved through the Integration of Polymer Reinforcement and Solder Alloy Materials
The increasing use of larger Ball Grid Arrays (BGAs), ceramic packages, and Wafer-Level Chip Scale Packages (WLCSP) to enhance device functionality requires improved reliability in challengi
.. weiterlesen
Benefits and Advantages of a Variable Angle Screen Printer Head/Squeegee
A variable angle print head offers significant advantages in screen printing, allowing the user to adjust the squeegee angle of attack with precision to achieve optimal results. This feature
.. weiterlesen
Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow
Metastable solder pastes offer a compelling advancement in low-temperature soldering, providing the capability to form robust metal interconnects at temperatures significantly lower than tho
.. weiterlesen
Electrolytic Nickel Ultra-Thin Gold Finish for PCBs
An electrolytic plate ultra-thin gold (UTG) over 2.5 to 5 microns(μ) pure nickel is an economical and environmentally friendly printed circuit board (PCB) finish, tested over 100,000M2. UTG
.. weiterlesen
Understanding PCB Failure Mechanisms under High Voltage and Condensing Conditions
Miniaturization has exacerbated the issue of electronics failure due to humidity by reducing the spacing between components, increasing the possibility of droplet bridging to create pathways
.. weiterlesen
Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions
Automated optical inspection (AOI) systems are commonly applied for in-line quality control of through hole technology (THT) solder joints. However, these systems usually rely on conventiona
.. weiterlesen
Unlocking the Promise of AI in Electronic Manufacturing
Manufacturing is getting smarter, with most processes and equipment generating vast volumes of data. Dynamic electronics manufacturers are adopting innovative solutions to increase output wh
.. weiterlesen
Thermal Characterization of Top Side Contacts in Ceramic Encapsulation Material for High Power Density Applications
The ever-increasing requirements in terms of power density and reliability of power electronic modules make packaging an ever-increasing challenge. Especially when upcoming vertical gallium
.. weiterlesen
Investigating the Interplay of Ionic Process Contamination and PCBA Component Design on Water Layer Formation and PCBA Humidity Robustness
The presented research is a ground-up investigation of PCBA climatic reliability starting with an insight into surface water layer formation under humid conditions, and progressing to unders
.. weiterlesen
Novel Thermosetting Material with High Thermal Conductivity, High Insulation Reliability and Demonstration of Heat Dissipation Performance of the PCBs
Printed circuit boards (PCBs) for automotive and electrical products are becoming smaller, higher density components, and embedded component technology is progressing. Components mounted on
.. weiterlesen
Futureproof PCBA Test with a Multi-Test Approach for Reduced Takt Time
The increasing complexity of printed circuit board assemblies (PCBA) necessitates more efficient and comprehensive testing methods to meet stringent quality and production targets. This pape
.. weiterlesen
Research and Improvement of Manufacturing Difficulty in Narrow Cap of Rigid-Flex Board
By comparing the design fine milling allowance of different milling tools and the chip removal ability of milling cutters, it is concluded that the design fine milling allowance of tools is
.. weiterlesen
Study on Influencing Factors of Flexibility and Tear Resistance of Flexible Board
In addition to the requirements of good bending performance, in the specific installation process, the flexible plate also needs to have good flexibility and tear resistance to facilitate as
.. weiterlesen
Evaluating Ruggedizing Polymers: Insights from Condensing Environmental Conditions
Evaluating the protective efficacy of ruggedizing polymers using condensing environments is an innovative approach that can help simulate real-world conditions. Protective polymers are incre
.. weiterlesen
Achieving Lower Voids with a Novel Preform Flux Technology
Many of today’s advanced electronic devices require the use of solderable preforms in applications, including solder thermal interface materials (TIMs), power module attach, and any other ap
.. weiterlesen
A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint for Single Use and Short Lifetime...
The paper presents the development of an innovative recyclable and biodegradable PCB substrate material created to meet the stringent environmental demands of future electronic products. The
.. weiterlesen
High Density Substrates for Chiplet Technologies
The increasing demands on electronic systems have led to the current trend of using chiplets instead of individual chips. In detail, this means that individual silicon components or function
.. weiterlesen
Implementing IPC-1782 External Traceability for Trusted Material Provenance across the Supply Chain
The IPC-1782 traceability standard is a key part of the IPC Factory of the Future ecosystem, providing a framework for ensuring trusted product and material provenance. The purpose of this s
.. weiterlesen
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II
For many years, metals have been used as thermal interface materials (TIMs), and until recently, the most common type of metal TIM were solder TIMs. Due to their high reliability and thermal
.. weiterlesen
iNEMI Reliability and Loss Properties of Copper Foils for 5G Applications
The advancement of high-frequency applications, especially for 5G technology, demands PCBs endure thermal shock during soldering while preserving signal integrity. Traditional copper foil su
.. weiterlesen
Process Traceability in Hand Soldering, Rework and Repair – The Missing Link.
Since its inception, the electronics manufacturing industry has developed methods to improve the efficiency of its many processes. One of the key methods developed and now a fundamental proc
.. weiterlesen
Robotic Process for Fast and Reliable BGA Re-balling
Enabling re-use of expensive BGA components with fast & high quality of BGA re-balling process can be a cost-effective solution.It fits many electronic segments such as military, aer
.. weiterlesen
The Human Edge in Digital Manufacturing - Beyond Automation the Role of People in Industry 4.0
Industry 4.0 defined a vision for the factory where automation dynamically adjusts and adapts to its operational demands and to the products it is building. What has been overlooked is the c
.. weiterlesen
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) of additive electronics has gained considerable momentum in recent years due to the 3D design creativity that its additive materials provide. However, the
.. weiterlesen
Optimizing SMT Printing: The Impact of Contact Time and Fluid Dynamics on Yield Enhancement
In the quest for perfection within SMT printing, numerous factors such as print speed, blade pressure, and nano-coatings have been meticulously studied. Yet, the solvent delivery system—a cr
.. weiterlesen
Early Defect Detection with a Scalable Broad-Spectrum Test Using Radiofrequency Reflectometry
This work explores radio frequency (RF) reflectometry as an early-stage defect detection technology for electronics. In-circuit testing (ICT) is limited to fully assembled boards, while auto
.. weiterlesen
Tooling Population Effects on Imaging Registration Accuracy for UHDI Substrates
A study of methods for improving direct imaging registration for Ultra High Density Interconnect [UHDI], flex and other challenging constructs using new and existing registration technologie
.. weiterlesen
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gb/s and Beyond
The datacenter continues to demand increasingly higher component data rates to satisfy growing application requirements. Efforts are underway, as illustrated by the IEEE 802.3dj objectives[1
.. weiterlesen
Design Considerations for Sustainable Printed Circuit Boards
In addition to manufacturability, performance, reliability and cost, environmental impact increasingly becomes a design driver for printed circuit boards and assemblies. A prerequisite is th
.. weiterlesen
Alternative Methods in Measuring BGAs for Thermal Warpage
Warpage determination for ball grid array (BGA) packages require measurement of the surface containing solder balls. Balls can be sheared, and the surface painted. Surface damage can alter t
.. weiterlesen
Enhancements in Reliability Achieved through the Integration of Polymer Reinforcement and Solder Alloy Materials
The increasing use of larger Ball Grid Arrays (BGAs), ceramic packages, and Wafer-Level Chip Scale Packages (WLCSP) to enhance device functionality requires improved reliability in challengi
.. weiterlesen
Benefits and Advantages of a Variable Angle Screen Printer Head/Squeegee
A variable angle print head offers significant advantages in screen printing, allowing the user to adjust the squeegee angle of attack with precision to achieve optimal results. This feature
.. weiterlesen
Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow
Metastable solder pastes offer a compelling advancement in low-temperature soldering, providing the capability to form robust metal interconnects at temperatures significantly lower than tho
.. weiterlesen
Electrolytic Nickel Ultra-Thin Gold Finish for PCBs
An electrolytic plate ultra-thin gold (UTG) over 2.5 to 5 microns(μ) pure nickel is an economical and environmentally friendly printed circuit board (PCB) finish, tested over 100,000M2. UTG
.. weiterlesen
Understanding PCB Failure Mechanisms under High Voltage and Condensing Conditions
Miniaturization has exacerbated the issue of electronics failure due to humidity by reducing the spacing between components, increasing the possibility of droplet bridging to create pathways
.. weiterlesen
Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions
Automated optical inspection (AOI) systems are commonly applied for in-line quality control of through hole technology (THT) solder joints. However, these systems usually rely on conventiona
.. weiterlesen
Unlocking the Promise of AI in Electronic Manufacturing
Manufacturing is getting smarter, with most processes and equipment generating vast volumes of data. Dynamic electronics manufacturers are adopting innovative solutions to increase output wh
.. weiterlesen
Thermal Characterization of Top Side Contacts in Ceramic Encapsulation Material for High Power Density Applications
The ever-increasing requirements in terms of power density and reliability of power electronic modules make packaging an ever-increasing challenge. Especially when upcoming vertical gallium
.. weiterlesen
Investigating the Interplay of Ionic Process Contamination and PCBA Component Design on Water Layer Formation and PCBA Humidity Robustness
The presented research is a ground-up investigation of PCBA climatic reliability starting with an insight into surface water layer formation under humid conditions, and progressing to unders
.. weiterlesen
Novel Thermosetting Material with High Thermal Conductivity, High Insulation Reliability and Demonstration of Heat Dissipation Performance of the PCBs
Printed circuit boards (PCBs) for automotive and electrical products are becoming smaller, higher density components, and embedded component technology is progressing. Components mounted on
.. weiterlesen
Futureproof PCBA Test with a Multi-Test Approach for Reduced Takt Time
The increasing complexity of printed circuit board assemblies (PCBA) necessitates more efficient and comprehensive testing methods to meet stringent quality and production targets. This pape
.. weiterlesen
Research and Improvement of Manufacturing Difficulty in Narrow Cap of Rigid-Flex Board
By comparing the design fine milling allowance of different milling tools and the chip removal ability of milling cutters, it is concluded that the design fine milling allowance of tools is
.. weiterlesen
Study on Influencing Factors of Flexibility and Tear Resistance of Flexible Board
In addition to the requirements of good bending performance, in the specific installation process, the flexible plate also needs to have good flexibility and tear resistance to facilitate as
.. weiterlesen