Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
ABILITY OF INDUSTRY RELIABILITY METHODOLOGIES TO PREDICT LIFECYCLE APPLICATION FIELD FAILURES
Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. As consumers dem
.. leer más
An Overview of Revision B of GEIA-STD-0005-1
In 2017, the Society of Automotive Engineers (SAE) G-24 committee approved revision activity for GEIA-STD-0005-1A, “Standard for Managing the Risks of Pb-free Solders and Finishes in ADHP El
.. leer más
A Multiphase Model of Intermittent Contact in Lubricated Sliding Electrical Contacts
Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. T
.. leer más
Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium
This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and othe
.. leer más
FIDES Reliability: New Approach to the ‘Process Factor’ During Product Development
The FIDES guide 2009 (Edition A) proposes a methodology for the reliability assessment of electronic to evaluate and control product reliability progress throughout life cycle. The reliabili
.. leer más
Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. leer más
Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method
The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte
.. leer más
Corrosion Failure Risk Assessment of SMT LEDs to Sulfur Bearing Gas Environments
Light emitting diodes (LEDs) are widely used throughout the electronics industry due to their high efficiency, lumen output, and expected lifetime. LEDs are semiconductor devices that are co
.. leer más
Ammonia Gas Effect on Metal Corrosion of PCB Surface Finish-in Acid-Gases Based Mixed Flowing-Gas Test
The proliferation of Artificial Intelligence (AI), big data, 5G, electric vehicles, Internet of Things (IoT), Edge Computing,High Performance Computing (HPC) and Electric Vehicle (EV) in rec
.. leer más
Anti-Slump SiP Solder Paste Enables Further Miniaturization
In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p
.. leer más
Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs
Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for the
.. leer más
Active Alignment Adhesive Technology
The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignme
.. leer más
Printed Circuit Structures: Past, Present, and Future
Printed Circuit Structures (PCSs) have the potential to revolutionize next generation printed circuit boards (PCBs) and electronics packaging. Almost every product available today contains s
.. leer más
Digital and Environmental Circuit Board Manufacturing Based on Continuous Laser Assisted Deposition
In the LIFT (Laser Induced Forward Transfer) technology, a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This
.. leer más
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. leer más
Recrystallisation and the Resulting Crystal Structures in Plated Microvias
Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile
.. leer más
Evaluation of Transient Phase Conductive Material and Copper PCB Construction
Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv
.. leer más
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. leer más
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. leer más
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. leer más
Functional Test on RF And High-Speed Connectors on PCBA's And Cable Harness Assemblies for Automotive Applications
This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. In almost any modern vehicle there are numerous hi
.. leer más
Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues
In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as
.. leer más
Application of Dielectric Spectroscopy (Ds) for Quality Control of Solvent-Borne Conformal Coatings
The viscosity of conformal coatings is critical in producing consistent and reliable applications of coating onto a printed circuit board (PCB). A conformal coating that has experienced mois
.. leer más
Comprehensive SIR Testing for Platform Release in the Automotive Industry
A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive
.. leer más
A Critical Analysis of CAF Testing-- Temperature, Humidity, and the Reality of Field Performance
As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented,
.. leer más
Using Machine Learning for Anomaly Pattern Recognition in Manufacturing Processes
As the manufacturing sector is under constant pressure to satisfy customers’ demands in a competitive market by applying complex processes to meet manufacturing cost and schedule goals, the
.. leer más
Towards Artificial Intelligence in SMT inspection processes
To ensure the highest possible quality standards in automotive electronics production, an extensive implementation of testing and inspection systems throughout production is mandatory. In SM
.. leer más
AI for Electronics Manufacturing – An Industry 4.0 Architecture and ConditionMonitoring Framework for Printed Circuit Board Assemblies
The key challenge for industry in adopting AI into their manufacturing processes surrounds the accessibility of their data. Many manufacturing industries, especially electronics manufacturin
.. leer más
AI Model Benchmarking at the Edge for Quality Inspection in Manufacturing
Neural network based deep learning models increasingly demonstrates high accuracy in object detection and image classification in digital image processing. The manufacturing industry is adap
.. leer más
In-Line Implementation of Photonic Soldering
Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidus temperature using radiati
.. leer más
ABILITY OF INDUSTRY RELIABILITY METHODOLOGIES TO PREDICT LIFECYCLE APPLICATION FIELD FAILURES
Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. As consumers dem
.. leer más
An Overview of Revision B of GEIA-STD-0005-1
In 2017, the Society of Automotive Engineers (SAE) G-24 committee approved revision activity for GEIA-STD-0005-1A, “Standard for Managing the Risks of Pb-free Solders and Finishes in ADHP El
.. leer más
A Multiphase Model of Intermittent Contact in Lubricated Sliding Electrical Contacts
Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. T
.. leer más
Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium
This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and othe
.. leer más
FIDES Reliability: New Approach to the ‘Process Factor’ During Product Development
The FIDES guide 2009 (Edition A) proposes a methodology for the reliability assessment of electronic to evaluate and control product reliability progress throughout life cycle. The reliabili
.. leer más
Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. leer más
Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method
The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte
.. leer más
Corrosion Failure Risk Assessment of SMT LEDs to Sulfur Bearing Gas Environments
Light emitting diodes (LEDs) are widely used throughout the electronics industry due to their high efficiency, lumen output, and expected lifetime. LEDs are semiconductor devices that are co
.. leer más
Ammonia Gas Effect on Metal Corrosion of PCB Surface Finish-in Acid-Gases Based Mixed Flowing-Gas Test
The proliferation of Artificial Intelligence (AI), big data, 5G, electric vehicles, Internet of Things (IoT), Edge Computing,High Performance Computing (HPC) and Electric Vehicle (EV) in rec
.. leer más
Anti-Slump SiP Solder Paste Enables Further Miniaturization
In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p
.. leer más
Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs
Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for the
.. leer más
Active Alignment Adhesive Technology
The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignme
.. leer más
Printed Circuit Structures: Past, Present, and Future
Printed Circuit Structures (PCSs) have the potential to revolutionize next generation printed circuit boards (PCBs) and electronics packaging. Almost every product available today contains s
.. leer más
Digital and Environmental Circuit Board Manufacturing Based on Continuous Laser Assisted Deposition
In the LIFT (Laser Induced Forward Transfer) technology, a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This
.. leer más
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. leer más
Recrystallisation and the Resulting Crystal Structures in Plated Microvias
Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile
.. leer más
Evaluation of Transient Phase Conductive Material and Copper PCB Construction
Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv
.. leer más
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. leer más
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. leer más
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. leer más
Functional Test on RF And High-Speed Connectors on PCBA's And Cable Harness Assemblies for Automotive Applications
This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. In almost any modern vehicle there are numerous hi
.. leer más
Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues
In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as
.. leer más
Application of Dielectric Spectroscopy (Ds) for Quality Control of Solvent-Borne Conformal Coatings
The viscosity of conformal coatings is critical in producing consistent and reliable applications of coating onto a printed circuit board (PCB). A conformal coating that has experienced mois
.. leer más
Comprehensive SIR Testing for Platform Release in the Automotive Industry
A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive
.. leer más
A Critical Analysis of CAF Testing-- Temperature, Humidity, and the Reality of Field Performance
As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented,
.. leer más
Using Machine Learning for Anomaly Pattern Recognition in Manufacturing Processes
As the manufacturing sector is under constant pressure to satisfy customers’ demands in a competitive market by applying complex processes to meet manufacturing cost and schedule goals, the
.. leer más
Towards Artificial Intelligence in SMT inspection processes
To ensure the highest possible quality standards in automotive electronics production, an extensive implementation of testing and inspection systems throughout production is mandatory. In SM
.. leer más
AI for Electronics Manufacturing – An Industry 4.0 Architecture and ConditionMonitoring Framework for Printed Circuit Board Assemblies
The key challenge for industry in adopting AI into their manufacturing processes surrounds the accessibility of their data. Many manufacturing industries, especially electronics manufacturin
.. leer más
AI Model Benchmarking at the Edge for Quality Inspection in Manufacturing
Neural network based deep learning models increasingly demonstrates high accuracy in object detection and image classification in digital image processing. The manufacturing industry is adap
.. leer más
In-Line Implementation of Photonic Soldering
Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidus temperature using radiati
.. leer más