Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
IPC-HERMES-9852 Lays the Foundation for Automated Flexible Production
IPC-HERMES-9852 as the smart replacement for the long-used IPC-SMEMA-9851 provides machine-to-machine (M2M) communication that ensures consistency of each PCB and its individual data while t
.. leer más
A Study of Data Driven Quality Management Across EMS Smart Factory
With the advancement of emerging technologies such as AI, Cloud and Block Chain, the electronics manufacturing industry is entering a new era of smart manufacturing. More and more Electronic
.. leer más
SMT Printer Changeover Automation
The Factory of the Future or a Lights out Factory will require significant automation, including many functions that are challenging and are still performed manually due to the complexity an
.. leer más
IPC-CFX Open-Source Hardware Initiative
The IPC Connected Factory Exchange (IPC-CFX) standard provides genuine plug-and-play IIoT data exchange between machines and supervisory systems across the shop floor. To realise the benefit
.. leer más
Single Source of Truth (PathWave Manufacturing Analytics)
With the Industry 4.0 transformation going full steam ahead, analytics have transformed the industry from being process-driven to now data-driven, where data speaks for itself. Conventionall
.. leer más
48V 250A FET PCB Thermal Profile - A Thermal Simulation Using 2D And CFD Airflow Analysis
This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. The goal was for the
.. leer más
Dispensing Performances of Liquid Metal Alloys Containing Organic Compound Additives as Thermal Interface Materials for IC module Applications
Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, includ
.. leer más
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. leer más
Silicone Migration Concerns in Thermal Materials – How Real are They?
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical
.. leer más
Solid Liquid Hybrid TIMs - Part II The Power of Liquid Metal Composites
In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. Those materia
.. leer más
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. leer más
Conformable, Light-Weight Power Harvesting Textiles
Light weight, conformal and portable standalone power solutions are becoming increasingly important for powering wearable electronics including
.. leer más
Wireless Wearable ElectroMyography Monitoring System Utilizing Reduced Graphene Oxide Coated Textiles
Wearable devices for biomedical applications have become more popular due to the increasing demand on health monitoring for both consumer and medical fields. In this work, we describe a nove
.. leer más
Contact and Non-contact Deposition Strategies for Liquid Metal Alloys (LMA)
SINTEC is the project name for a Liquid metal alloy technology with the goal of creating flexible and stretchable electronics. These stretchable electronics are applicable to wearable
.. leer más
Textile Capacitive Touch sensing: Real-Time Localization using Manifold Space Particle Tracking
Textile-based touch sensing offers a novel solution towards creating flexible and robust tactile interfaces that fit within an existing manufacturing ecosystem. Current fabric-based to
.. leer más
Smart Fabrics For Physiological Status Monitoring
The research presented in this slide show utilizes E-Textiles.
The applications include:
Physiological Status Monitoring
Cognitive Status Monitor
.. leer más
The Impacts Of the COVID-19 Pandemic On the US Printed Circuit Board Industry: Lessons From Recent Survey Research
The DoD conducted a survey of PCB companies and the effects of COVID19. The survey results showed that:
Some U.S PrCB manufacturing facilities were significantly impa
.. leer más
Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems
Indiana Integrated Circuits has developed "Quilted" modular PCBs. They consist of multiple small "boardlets" with traces or pads on rough edges of the boards. These rough edges f
.. leer más
DoD Executive Agent for Printed Circuit Board and Interconnect Technology: State of the Industrial Base
The Dod Executive Agent For Printed Circuit Board and Interconnect Technology (PrCB EA) has a vested interest in the state of the electronics industrial base and its ability to sustain and i
.. leer más
Flex PCB Design for Panelization, Early Estimation for Better Utilization
This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the boa
.. leer más
Design Optimization of SI Test Coupon to Achieve Accurate Measurement for 112Gbps/PAM-4 PCB Board
To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decre
.. leer más
Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues
This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives. The component use cases and typical challenges are ex
.. leer más
Provenance and Traceability in the Electronics Supply-Chain A Look at the IPC-1782A Standard and Beyond
The lack of material provenance in today’s supply-chain allows the undetected ingress of counterfeit materials to increase at alarming levels. Chemicals, components, including critical ICs,
.. leer más
The IPC-2551 Digital Twin Standard
One of the most important aspects of the IPC Digital Twin standard, is the enablement of interoperability between many digital twin-based solutions across many facets of the holistic manufac
.. leer más
Conformal Coating Evaluation Test Development
The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. The co
.. leer más
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. leer más
Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques
Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ
.. leer más
Use of Photonic Soldering to Rework Chip Components
Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where
.. leer más
Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
.. leer más
IPC-HERMES-9852 Lays the Foundation for Automated Flexible Production
IPC-HERMES-9852 as the smart replacement for the long-used IPC-SMEMA-9851 provides machine-to-machine (M2M) communication that ensures consistency of each PCB and its individual data while t
.. leer más
A Study of Data Driven Quality Management Across EMS Smart Factory
With the advancement of emerging technologies such as AI, Cloud and Block Chain, the electronics manufacturing industry is entering a new era of smart manufacturing. More and more Electronic
.. leer más
SMT Printer Changeover Automation
The Factory of the Future or a Lights out Factory will require significant automation, including many functions that are challenging and are still performed manually due to the complexity an
.. leer más
IPC-CFX Open-Source Hardware Initiative
The IPC Connected Factory Exchange (IPC-CFX) standard provides genuine plug-and-play IIoT data exchange between machines and supervisory systems across the shop floor. To realise the benefit
.. leer más
Single Source of Truth (PathWave Manufacturing Analytics)
With the Industry 4.0 transformation going full steam ahead, analytics have transformed the industry from being process-driven to now data-driven, where data speaks for itself. Conventionall
.. leer más
48V 250A FET PCB Thermal Profile - A Thermal Simulation Using 2D And CFD Airflow Analysis
This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. The goal was for the
.. leer más
Dispensing Performances of Liquid Metal Alloys Containing Organic Compound Additives as Thermal Interface Materials for IC module Applications
Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, includ
.. leer más
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. leer más
Silicone Migration Concerns in Thermal Materials – How Real are They?
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical
.. leer más
Solid Liquid Hybrid TIMs - Part II The Power of Liquid Metal Composites
In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. Those materia
.. leer más
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. leer más
Conformable, Light-Weight Power Harvesting Textiles
Light weight, conformal and portable standalone power solutions are becoming increasingly important for powering wearable electronics including
.. leer más
Wireless Wearable ElectroMyography Monitoring System Utilizing Reduced Graphene Oxide Coated Textiles
Wearable devices for biomedical applications have become more popular due to the increasing demand on health monitoring for both consumer and medical fields. In this work, we describe a nove
.. leer más
Contact and Non-contact Deposition Strategies for Liquid Metal Alloys (LMA)
SINTEC is the project name for a Liquid metal alloy technology with the goal of creating flexible and stretchable electronics. These stretchable electronics are applicable to wearable
.. leer más
Textile Capacitive Touch sensing: Real-Time Localization using Manifold Space Particle Tracking
Textile-based touch sensing offers a novel solution towards creating flexible and robust tactile interfaces that fit within an existing manufacturing ecosystem. Current fabric-based to
.. leer más
Smart Fabrics For Physiological Status Monitoring
The research presented in this slide show utilizes E-Textiles.
The applications include:
Physiological Status Monitoring
Cognitive Status Monitor
.. leer más
The Impacts Of the COVID-19 Pandemic On the US Printed Circuit Board Industry: Lessons From Recent Survey Research
The DoD conducted a survey of PCB companies and the effects of COVID19. The survey results showed that:
Some U.S PrCB manufacturing facilities were significantly impa
.. leer más
Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems
Indiana Integrated Circuits has developed "Quilted" modular PCBs. They consist of multiple small "boardlets" with traces or pads on rough edges of the boards. These rough edges f
.. leer más
DoD Executive Agent for Printed Circuit Board and Interconnect Technology: State of the Industrial Base
The Dod Executive Agent For Printed Circuit Board and Interconnect Technology (PrCB EA) has a vested interest in the state of the electronics industrial base and its ability to sustain and i
.. leer más
Flex PCB Design for Panelization, Early Estimation for Better Utilization
This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the boa
.. leer más
Design Optimization of SI Test Coupon to Achieve Accurate Measurement for 112Gbps/PAM-4 PCB Board
To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decre
.. leer más
Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues
This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives. The component use cases and typical challenges are ex
.. leer más
Provenance and Traceability in the Electronics Supply-Chain A Look at the IPC-1782A Standard and Beyond
The lack of material provenance in today’s supply-chain allows the undetected ingress of counterfeit materials to increase at alarming levels. Chemicals, components, including critical ICs,
.. leer más
The IPC-2551 Digital Twin Standard
One of the most important aspects of the IPC Digital Twin standard, is the enablement of interoperability between many digital twin-based solutions across many facets of the holistic manufac
.. leer más
Conformal Coating Evaluation Test Development
The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. The co
.. leer más
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. leer más
Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques
Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ
.. leer más
Use of Photonic Soldering to Rework Chip Components
Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where
.. leer más
Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
.. leer más