Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Powering The Internet of Things
This Slide Show Utilizes the Cover Paper from the session.
This slide show discusses the use Power harvesting in conjunction with a typical battery and the efforts
.. leer más
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
This slide show discusses inverters and power electronics for Heavy Machinery. There is discussion of Wide Band Gap Powered Devices. The purpose is increased efficiency gains.&nb
.. leer más
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
This Paper utilizes the introduction from the session as its paper then discusses Wide Bandgap Power Electronics
All electronics products need a power source
.. leer más
Packaging and Manufacturability Considerations for Strategic Power Applications
All electronics products need a power source. Thereby power electronics has a fundamental impact on their design and integration, from materials and device up to systems and the applications
.. leer más
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. leer más
TLPS Z-Axis Interconnect Solutions for Thermal Transfer and Electrical Connection in PCBs
The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. New, streamlined and hybrid pac
.. leer más
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. leer más
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. leer más
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. leer más
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. leer más
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. leer más
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. leer más
Emerging Supply Chain Cybersecurity Requirements, Government Acronyms, and Actual Security
Emerging Supply Chain Cybersecurity requirements, government acronyms, and actual security. Learn about the current state of mandates such as Cybersecurity Maturity Model Certification (CMMC
.. leer más
IPC-1791, Cybersecurity Maturity Model Certification (CMMC), and the Printed Circuit Board Design, Fabrication, and Assembly Industry
This paper presents the concerns on trustworthiness for printed circuit board (PrCB) design, fabrication, and assembly sources for national defense systems, specifically products on the Unit
.. leer más
CyberSecurity Concerns for the Printed Circuit Board Industry
This slide show discusses the cybersecurity risks associated with network integration. The supply chain is the most vulnerable, especially sub suppliers. A particular risk is whe
.. leer más
Present Company Not Excluded – New Cybersecurity Regulations Will Affect Your Business (and make it safer)
Current policies and regulations intended to protect supply chains from cyber threats, especially the supply chain to the US DoD, have proven ineffective. Nearly $1 trillion in intellectual
.. leer más
Circuit Board Security Vulnerabilities and Counteractions
Published stories in 2015 of a maliciously altered server motherboard have made clear that the circuit board is vulnerable to hardware attacks. To demonstrate their vulnerability, a circuit
.. leer más
DoD Cybersecurity: Where We Are Now and What Needs to Be Done to Be Compliant
This paper will discuss from an operational perspective what companies are or aren’t doing now and what steps companies can take to secure their overall IT enterprise which will logically he
.. leer más
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. leer más
IPC/IMEC/ESA Microvia TV IST Test Results
This slide show discusses Automation of IST testing. It utilizes Dielectric estimation laminate assessment method (DELAM). The slides utilizes thermo-graphics to locate the failu
.. leer más
Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction
The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly det
.. leer más
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. leer más
Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications
The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig
.. leer más
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. leer más
FIDES, Reliability Assessment of Electronics: A New Approach to the LeadFree Process Factor
The reliability control in airborne electronics products is essential due to safety and business reasons. As users do not have confidence in raw results provided by previous reliability pred
.. leer más
Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products
Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work
.. leer más
Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague
Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. The issue was n
.. leer más
A Framework for Large-Scale AI-Assisted Quality Inspection Implementation in Manufacturing Using Edge Computing
In recent years, neural network based deep learning models has demonstrated high accuracy in object detection and classification in the area of digital image processing. Manufacturing indust
.. leer más
The Case for an Electronics Supply Chain Blockchain
Blockchain technology has a lot of publicity in the electronics industry because of the way it has been used to address issues with sharing data across distributed networks and is recognized
.. leer más
Enriching Test Equipment Analytics with Structured Logging
Automated test equipment plays a large role in the manufacturing process at the Kansas City National Security Campus (KCNSC). Every test run generates data which is used to determine if a pa
.. leer más
Powering The Internet of Things
This Slide Show Utilizes the Cover Paper from the session.
This slide show discusses the use Power harvesting in conjunction with a typical battery and the efforts
.. leer más
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
This slide show discusses inverters and power electronics for Heavy Machinery. There is discussion of Wide Band Gap Powered Devices. The purpose is increased efficiency gains.&nb
.. leer más
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
This Paper utilizes the introduction from the session as its paper then discusses Wide Bandgap Power Electronics
All electronics products need a power source
.. leer más
Packaging and Manufacturability Considerations for Strategic Power Applications
All electronics products need a power source. Thereby power electronics has a fundamental impact on their design and integration, from materials and device up to systems and the applications
.. leer más
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. leer más
TLPS Z-Axis Interconnect Solutions for Thermal Transfer and Electrical Connection in PCBs
The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. New, streamlined and hybrid pac
.. leer más
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. leer más
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. leer más
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. leer más
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. leer más
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. leer más
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. leer más
Emerging Supply Chain Cybersecurity Requirements, Government Acronyms, and Actual Security
Emerging Supply Chain Cybersecurity requirements, government acronyms, and actual security. Learn about the current state of mandates such as Cybersecurity Maturity Model Certification (CMMC
.. leer más
IPC-1791, Cybersecurity Maturity Model Certification (CMMC), and the Printed Circuit Board Design, Fabrication, and Assembly Industry
This paper presents the concerns on trustworthiness for printed circuit board (PrCB) design, fabrication, and assembly sources for national defense systems, specifically products on the Unit
.. leer más
CyberSecurity Concerns for the Printed Circuit Board Industry
This slide show discusses the cybersecurity risks associated with network integration. The supply chain is the most vulnerable, especially sub suppliers. A particular risk is whe
.. leer más
Present Company Not Excluded – New Cybersecurity Regulations Will Affect Your Business (and make it safer)
Current policies and regulations intended to protect supply chains from cyber threats, especially the supply chain to the US DoD, have proven ineffective. Nearly $1 trillion in intellectual
.. leer más
Circuit Board Security Vulnerabilities and Counteractions
Published stories in 2015 of a maliciously altered server motherboard have made clear that the circuit board is vulnerable to hardware attacks. To demonstrate their vulnerability, a circuit
.. leer más
DoD Cybersecurity: Where We Are Now and What Needs to Be Done to Be Compliant
This paper will discuss from an operational perspective what companies are or aren’t doing now and what steps companies can take to secure their overall IT enterprise which will logically he
.. leer más
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. leer más
IPC/IMEC/ESA Microvia TV IST Test Results
This slide show discusses Automation of IST testing. It utilizes Dielectric estimation laminate assessment method (DELAM). The slides utilizes thermo-graphics to locate the failu
.. leer más
Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction
The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly det
.. leer más
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. leer más
Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications
The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig
.. leer más
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. leer más
FIDES, Reliability Assessment of Electronics: A New Approach to the LeadFree Process Factor
The reliability control in airborne electronics products is essential due to safety and business reasons. As users do not have confidence in raw results provided by previous reliability pred
.. leer más
Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products
Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work
.. leer más
Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague
Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. The issue was n
.. leer más
A Framework for Large-Scale AI-Assisted Quality Inspection Implementation in Manufacturing Using Edge Computing
In recent years, neural network based deep learning models has demonstrated high accuracy in object detection and classification in the area of digital image processing. Manufacturing indust
.. leer más
The Case for an Electronics Supply Chain Blockchain
Blockchain technology has a lot of publicity in the electronics industry because of the way it has been used to address issues with sharing data across distributed networks and is recognized
.. leer más
Enriching Test Equipment Analytics with Structured Logging
Automated test equipment plays a large role in the manufacturing process at the Kansas City National Security Campus (KCNSC). Every test run generates data which is used to determine if a pa
.. leer más