Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Functional Testing of Complex Circuits with Automatic Test Equipment in Manufacturing and Support
Automatic Test Equipment (ATE) in the form of in-circuit and manufacturing defects analyzers have been used successfully for finding catastrophic flaws that occur during production and assem
.. leer más
A Method to Investigate Printed Circuit Board Supplier Rework Processes and Best Practices
Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an
.. leer más
Testing and Implementation of Direct Imaging and Direct Jetting of Solder Mask
Printed circuit board manufacturers are continually challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. This trend is mot
.. leer más
Detect PCB Stack-up Error with Machine Learning Methods
In manufacturing multilayer printed circuit boards (PCBs), the PCB layer stack-up usually includes multiple plies of various types of prepreg along with the inner layer core material. Most o
.. leer más
The IPC CFX Standard as it Applies to Reflow Soldering
The advent of the Industry 4.0 Revolution and Internet of Manufacturing (IoM) has started to yield Smart factories, intelligent machines and networked processes, that have brought us improve
.. leer más
Optimizing Throughput and Cost with Manufacturing Simulation
Electronics assembly can be delivered at competitive market prices only as long as the manufacturing process is continuously improved. Manufacturing companies are mastering with the help of
.. leer más
Interfacing Machines with Manufacturing Software: What Exactly Does It Entail and Is It Worth the Hassle?
With the ascent of Industry 4.0, the urgency of connecting to equipment on a manufacturing line is increasing. This article focuses on the electronics industry and summarizes what that inter
.. leer más
A Hybrid Sintering Technology for High-power Density Devices Used in Aerospace Applications
Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power
.. leer más
Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat
.. leer más
Oxide Alternative Process Development for High Frequency Bonding Applications
The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid
.. leer más
Innovative Panel Plating for Heterogeneous Integration
The migration to large panel substrates in advanced packaging applications is principally motivated by cost considerations. However, it is occurring at a time when package processing is beco
.. leer más
The Needs for, and Problems Experienced While Developing a Successful Low Palladium Activation System for Electroless Copper Deposition.
The electroless deposition of Copper is widely used within the printed circuit board industry as it offers a simple and reliable method for metallizing holes, which subsequently enable multi
.. leer más
Process Characterization that Results in Acceptable Levels of Flux and Other Residues
Surface Insulation Resistance (SIR) testing is a standard method used to characterize soldering and cleaning processes that result in acceptable levels of flux and other residues. Several di
.. leer más
Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp
.. leer más
Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. leer más
Discrete Event Simulation in Electronics Manufacturing Operations
Every year, billions and billions of products are made and sold across the world. Each of these products, regardless of volume, are made in facilities that follow certain steps to assemble,
.. leer más
Single Device Traceability in Assembly without ECID
Use cases, solutions and standards for single device traceability in the supply chain to enable root case analysis, recall containment, device pairing, yield and reliability improvement and
.. leer más
Bringing AI To The Edge A Collaborative Study Of Defect Detection In Surface Mount Devices
Machine Learning
Edge Computing
Edge AI
Demonstrated using a Case Study on HiP (Head in Pillow) defect detection
.. leer más
Achieving Solder Reliability for LGA Ceramic Image Sensors Through Refinement of SMT Soldering Processes
New product introduction at an Original Equipment Manufacturer (OEM) typically includes reliability testing in the form of thermal cycling. Samplings from the engineering models of a new pro
.. leer más
Temperature Cycling with Bending to Reproduce Typical Product Loads
In automotive applications, electronic products are subject to several loads, among which thermomechanical loads are particularly affecting the product reliability. Temperature cycling tests
.. leer más
System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p
.. leer más
Jet-Dispensed SMT Adhesives for Durable Printed Electronics
Polymer Thick Film(PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry. This pap
.. leer más
Improved Process Yield with Dynamic “real-time” Dual Head Dispensing
Today’s unique assembly challenges are comprised of complex PCB panelization, involving identical PCBs with a goal towards increased production capability, due to a reduced footprint of the
.. leer más
Industrial Beta Deployment of 1st Domestic, High Volume SAP Process for Resolving HDI Technologies Down to 25 Micron Space and...
The drive for miniaturization of both commercial and aerospace/military technologies are not compatible with the current standard United States domestic PCB manufacturing processes at the vo
.. leer más
Advanced Interconnect Process Enables Very High-DensityPCB Structures
The need for increasingly complex electronics combined with the obsolescence of larger component packages is driving innovation to provide alternatives to the traditional subtractive-etch fa
.. leer más
Industry 4.0 - How we transform a Buzzword into Manufacturing Excellence in Electronics: Case Study for Improving the PCB Print...
The competitive pressures that electronics companies experience today are exceptional, even for an industry accustomed to a relentlessly high rate of innovation. Manufacturers are challenged
.. leer más
The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing
The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service o
.. leer más
Optimization of Robotic Soldering Process: A Focus on Solder Spread and Spattering
Robotic soldering is a growing market within the PCB Assembly industry and interest in robotic soldering equipment and applications is increasing every year. This method is more efficient th
.. leer más
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. leer más
Structural Electronics for Automotive Interiors
This paper presents results from a joined R&D project between two companies; Automotive Tier-1 and Technology Provider of structural electronics. Key benefits of structural electronics a
.. leer más
Functional Testing of Complex Circuits with Automatic Test Equipment in Manufacturing and Support
Automatic Test Equipment (ATE) in the form of in-circuit and manufacturing defects analyzers have been used successfully for finding catastrophic flaws that occur during production and assem
.. leer más
A Method to Investigate Printed Circuit Board Supplier Rework Processes and Best Practices
Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an
.. leer más
Testing and Implementation of Direct Imaging and Direct Jetting of Solder Mask
Printed circuit board manufacturers are continually challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. This trend is mot
.. leer más
Detect PCB Stack-up Error with Machine Learning Methods
In manufacturing multilayer printed circuit boards (PCBs), the PCB layer stack-up usually includes multiple plies of various types of prepreg along with the inner layer core material. Most o
.. leer más
The IPC CFX Standard as it Applies to Reflow Soldering
The advent of the Industry 4.0 Revolution and Internet of Manufacturing (IoM) has started to yield Smart factories, intelligent machines and networked processes, that have brought us improve
.. leer más
Optimizing Throughput and Cost with Manufacturing Simulation
Electronics assembly can be delivered at competitive market prices only as long as the manufacturing process is continuously improved. Manufacturing companies are mastering with the help of
.. leer más
Interfacing Machines with Manufacturing Software: What Exactly Does It Entail and Is It Worth the Hassle?
With the ascent of Industry 4.0, the urgency of connecting to equipment on a manufacturing line is increasing. This article focuses on the electronics industry and summarizes what that inter
.. leer más
A Hybrid Sintering Technology for High-power Density Devices Used in Aerospace Applications
Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power
.. leer más
Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat
.. leer más
Oxide Alternative Process Development for High Frequency Bonding Applications
The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid
.. leer más
Innovative Panel Plating for Heterogeneous Integration
The migration to large panel substrates in advanced packaging applications is principally motivated by cost considerations. However, it is occurring at a time when package processing is beco
.. leer más
The Needs for, and Problems Experienced While Developing a Successful Low Palladium Activation System for Electroless Copper Deposition.
The electroless deposition of Copper is widely used within the printed circuit board industry as it offers a simple and reliable method for metallizing holes, which subsequently enable multi
.. leer más
Process Characterization that Results in Acceptable Levels of Flux and Other Residues
Surface Insulation Resistance (SIR) testing is a standard method used to characterize soldering and cleaning processes that result in acceptable levels of flux and other residues. Several di
.. leer más
Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp
.. leer más
Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. leer más
Discrete Event Simulation in Electronics Manufacturing Operations
Every year, billions and billions of products are made and sold across the world. Each of these products, regardless of volume, are made in facilities that follow certain steps to assemble,
.. leer más
Single Device Traceability in Assembly without ECID
Use cases, solutions and standards for single device traceability in the supply chain to enable root case analysis, recall containment, device pairing, yield and reliability improvement and
.. leer más
Bringing AI To The Edge A Collaborative Study Of Defect Detection In Surface Mount Devices
Machine Learning
Edge Computing
Edge AI
Demonstrated using a Case Study on HiP (Head in Pillow) defect detection
.. leer más
Achieving Solder Reliability for LGA Ceramic Image Sensors Through Refinement of SMT Soldering Processes
New product introduction at an Original Equipment Manufacturer (OEM) typically includes reliability testing in the form of thermal cycling. Samplings from the engineering models of a new pro
.. leer más
Temperature Cycling with Bending to Reproduce Typical Product Loads
In automotive applications, electronic products are subject to several loads, among which thermomechanical loads are particularly affecting the product reliability. Temperature cycling tests
.. leer más
System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p
.. leer más
Jet-Dispensed SMT Adhesives for Durable Printed Electronics
Polymer Thick Film(PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry. This pap
.. leer más
Improved Process Yield with Dynamic “real-time” Dual Head Dispensing
Today’s unique assembly challenges are comprised of complex PCB panelization, involving identical PCBs with a goal towards increased production capability, due to a reduced footprint of the
.. leer más
Industrial Beta Deployment of 1st Domestic, High Volume SAP Process for Resolving HDI Technologies Down to 25 Micron Space and...
The drive for miniaturization of both commercial and aerospace/military technologies are not compatible with the current standard United States domestic PCB manufacturing processes at the vo
.. leer más
Advanced Interconnect Process Enables Very High-DensityPCB Structures
The need for increasingly complex electronics combined with the obsolescence of larger component packages is driving innovation to provide alternatives to the traditional subtractive-etch fa
.. leer más
Industry 4.0 - How we transform a Buzzword into Manufacturing Excellence in Electronics: Case Study for Improving the PCB Print...
The competitive pressures that electronics companies experience today are exceptional, even for an industry accustomed to a relentlessly high rate of innovation. Manufacturers are challenged
.. leer más
The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing
The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service o
.. leer más
Optimization of Robotic Soldering Process: A Focus on Solder Spread and Spattering
Robotic soldering is a growing market within the PCB Assembly industry and interest in robotic soldering equipment and applications is increasing every year. This method is more efficient th
.. leer más
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. leer más
Structural Electronics for Automotive Interiors
This paper presents results from a joined R&D project between two companies; Automotive Tier-1 and Technology Provider of structural electronics. Key benefits of structural electronics a
.. leer más