Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. leer más
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. leer más
Boundary-Scan Project Phase 3:Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. leer más
Boundary-Scan Project Phase 3: Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. leer más
Board-Assist Built-In Self-Test (BA-BIST),Short-Term and Long-Term Strategies for Use Case Standardization
This iNEMI program's focus is on a “Chip” Built-in Self-Test (BIST) study and its promotion for board and system-level applications. In this case,This study has 2 strategic focus areas – short
.. leer más
Good Product Quality Comes From Good Design for Test Strategies
Product quality can be improved through proper application of design for test (DFT) strategies. With today’s shrinking product sizes and increasing functionality,it is difficult to get good tes
.. leer más
Advanced Printing for Microelectronic Packaging
Using micro-dispensing with exceptional volume control it is possible to print in 3D space a wide variety of materials and including solders,epoxies,conductive adhesives and ceramic filled poly
.. leer más
Substrates: Polyester Film for the Flexible Electronics Industry
Polyester film substrates have been widely used in making flexible / printed electronic devices for over 30 years. However the early 2000’s brought about an explosion of interest in “additive”
.. leer más
Digitally Printed Battery: Transitioning from a Traditional Coated Battery Design to a Digitally Printed Battery; Advantages,Challenges and Successes
The company is a producer of thin film batteries of less than 0.45mm in thickness. Battery operated devices have grown
smaller and smaller while energy demands have increased as the need for in
.. leer más
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. leer más
Semi Quantitative Method for Assessing the Reworkability of Different Underfills
The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul
.. leer más
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. leer más
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. leer más
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. leer más
Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the
testing and data is related to high-strain energy thermal cycling experime
.. leer más
Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. leer más
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. leer más
What is Kelvin Test?
The PCB industry is ever changing and adapting to new technologies. OEM specifications and requirements have also advanced due to these technologies. In some cases the OEMs are asking for a low
.. leer más
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h
.. leer más
Preparing for Increased Electrostatic Discharge Device Sensitivity
With the push for ever improving performance on semiconductor component I/O interfaces,semiconductor components are being driven into a realm which makes them more sensitive to electrostatic di
.. leer más
Electrostatic Discharge (ESD),Factory Issues,Measurement Methods and Product Quality – Roadmaps and Solutions for 2025 to 2030
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So,it is necessary for everyone,who handles electrostatic sensitive devices (ESDS),to know
.. leer más
Specialized Materials for Printed Electronics
In the area of Printed Electronics,there are a number of functional materials that can include conductors,Semi-conductors,dielectrics,barriers,and adhesives. There are also a smaller subset of
.. leer más
The Total Environmental Solution For Any-Layer HDI Production
Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple
.. leer más
The Perfect Copper Surface
In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean
.. leer más
Final Finish Specifications Review IPC Plating Sub-committee 4-14
An IPC specification is a consensus document that specifies attributes relevant to the plated surface. Plating specifications are designed to be applicable to a wide range of products types. A
.. leer más
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. leer más
Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting
The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s
.. leer más
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. leer más
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. leer más
Boundary-Scan Project Phase 3:Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. leer más
Boundary-Scan Project Phase 3: Investigation into Challenges of using .BSDL Files
The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor
.. leer más
Board-Assist Built-In Self-Test (BA-BIST),Short-Term and Long-Term Strategies for Use Case Standardization
This iNEMI program's focus is on a “Chip” Built-in Self-Test (BIST) study and its promotion for board and system-level applications. In this case,This study has 2 strategic focus areas – short
.. leer más
Good Product Quality Comes From Good Design for Test Strategies
Product quality can be improved through proper application of design for test (DFT) strategies. With today’s shrinking product sizes and increasing functionality,it is difficult to get good tes
.. leer más
Advanced Printing for Microelectronic Packaging
Using micro-dispensing with exceptional volume control it is possible to print in 3D space a wide variety of materials and including solders,epoxies,conductive adhesives and ceramic filled poly
.. leer más
Substrates: Polyester Film for the Flexible Electronics Industry
Polyester film substrates have been widely used in making flexible / printed electronic devices for over 30 years. However the early 2000’s brought about an explosion of interest in “additive”
.. leer más
Digitally Printed Battery: Transitioning from a Traditional Coated Battery Design to a Digitally Printed Battery; Advantages,Challenges and Successes
The company is a producer of thin film batteries of less than 0.45mm in thickness. Battery operated devices have grown
smaller and smaller while energy demands have increased as the need for in
.. leer más
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. leer más
Semi Quantitative Method for Assessing the Reworkability of Different Underfills
The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul
.. leer más
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. leer más
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. leer más
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. leer más
Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the
testing and data is related to high-strain energy thermal cycling experime
.. leer más
Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. leer más
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. leer más
What is Kelvin Test?
The PCB industry is ever changing and adapting to new technologies. OEM specifications and requirements have also advanced due to these technologies. In some cases the OEMs are asking for a low
.. leer más
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h
.. leer más
Preparing for Increased Electrostatic Discharge Device Sensitivity
With the push for ever improving performance on semiconductor component I/O interfaces,semiconductor components are being driven into a realm which makes them more sensitive to electrostatic di
.. leer más
Electrostatic Discharge (ESD),Factory Issues,Measurement Methods and Product Quality – Roadmaps and Solutions for 2025 to 2030
The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So,it is necessary for everyone,who handles electrostatic sensitive devices (ESDS),to know
.. leer más
Specialized Materials for Printed Electronics
In the area of Printed Electronics,there are a number of functional materials that can include conductors,Semi-conductors,dielectrics,barriers,and adhesives. There are also a smaller subset of
.. leer más
The Total Environmental Solution For Any-Layer HDI Production
Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple
.. leer más
The Perfect Copper Surface
In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean
.. leer más
Final Finish Specifications Review IPC Plating Sub-committee 4-14
An IPC specification is a consensus document that specifies attributes relevant to the plated surface. Plating specifications are designed to be applicable to a wide range of products types. A
.. leer más
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. leer más
Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting
The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s
.. leer más