Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. leer más
BGA and QFN Repair Process
Repairing a PCB with a defective BGA,uBGA,or QFN is often a difficult and tedious task. The conventional method is to remove the defective device from the PCB; clean the pads on the PCB,then pr
.. leer más
Reducing Defects in Hand Soldering Operations
Wire soldering operations are still widely accepted in the electronics assembly industry. When a product or the parts within cannot withstand the heat of oven reflow,the localized heat provided
.. leer más
INEMI Rework Machine Temperature Tolerance and Repeatability Study
Currently little data exists on temperature repeatability of BGA/CSP rework machine equipment. This is an issue especially for lead-free rework as the temperatures during lead-free BGA/CSP rewo
.. leer más
Understanding EuP and REACH
There has been a global trend towards legislation meant to encourage sustainable manufacturing and minimize the environmental impact of product manufacturing. In the global economy,with its dis
.. leer más
EU RoHS VS. CHINA RoHS
Companies not only need to understand the reliability issues with environmental compliance,but also how to comply with the various regulations from the business end. China is the second jurisdi
.. leer más
Understanding the IPC 175X Data Model
More and more political bodies (countries,states,and unions) are enacting legislation designed to protect the environment from the impact of manufacturing. One category of restrictive legislati
.. leer más
High Uniformity PCB Processing with Vacuum Gas Plasma
Emerging technologies in the printed circuit board industry including smaller holes,higher aspect ratios,three-dimensional features,fine pitch,blind via holes,and new lead free materials contin
.. leer más
Recovery of Copper Metal in the Continuous Regeneration of Cupric Chloride Etchant
An electrochemical device has been developed that deposits non adherent copper metal powder at the cathode,and generates chlorine gas at the anode. The chlorine is contained within the system,a
.. leer más
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. leer más
Changing the Methodology for DFM Moving from Design-Checker to Interactive,Informed Design Methodologies
The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial
.. leer más
The Importance of Being Grounded
The proper grounding of all conductive items in the production workplace is an essential element of ESD (electrostatic discharge) management. ESD damage to components and assemblies in manufact
.. leer más
RoHS and Green Compliance in IC Packaging
In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag
.. leer más
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. leer más
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. leer más
Tin Allotropic Transformation ~ Tin Pest
It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% [1,2] volume increase,and in appearance turns from a bright shiny m
.. leer más
High Phosphorus Electroless Nickel for Selective ENIG (SENIG)
Concerns
There are some areas that must be accepted if planning to run the newest SENIG process:
- Slower plating rate in nickel (to get 150µ“ it will take 20 minutes)
- It works better at hig
.. leer más
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. leer más
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. leer más
Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process
For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo
.. leer más
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. leer más
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. leer más
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. leer más
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. leer más
01005 Assembly Process – From the Board Design to the Reflow Process
The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable
.. leer más
How to Achieve 40 Microns (1.6 Mil) Placement Spacing with E01005/M0402
When trying to achieve 40 microns of placement spacing,bridges and tombstones may occur due to the variation of the component dimensions,equipment accuracy and pickup position variations.
Hawse
.. leer más
Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. leer más
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. leer más
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. leer más
"Behind the Scenes" of Effective OSP Protection in Pb-free Processing
Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa
.. leer más
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. leer más
BGA and QFN Repair Process
Repairing a PCB with a defective BGA,uBGA,or QFN is often a difficult and tedious task. The conventional method is to remove the defective device from the PCB; clean the pads on the PCB,then pr
.. leer más
Reducing Defects in Hand Soldering Operations
Wire soldering operations are still widely accepted in the electronics assembly industry. When a product or the parts within cannot withstand the heat of oven reflow,the localized heat provided
.. leer más
INEMI Rework Machine Temperature Tolerance and Repeatability Study
Currently little data exists on temperature repeatability of BGA/CSP rework machine equipment. This is an issue especially for lead-free rework as the temperatures during lead-free BGA/CSP rewo
.. leer más
Understanding EuP and REACH
There has been a global trend towards legislation meant to encourage sustainable manufacturing and minimize the environmental impact of product manufacturing. In the global economy,with its dis
.. leer más
EU RoHS VS. CHINA RoHS
Companies not only need to understand the reliability issues with environmental compliance,but also how to comply with the various regulations from the business end. China is the second jurisdi
.. leer más
Understanding the IPC 175X Data Model
More and more political bodies (countries,states,and unions) are enacting legislation designed to protect the environment from the impact of manufacturing. One category of restrictive legislati
.. leer más
High Uniformity PCB Processing with Vacuum Gas Plasma
Emerging technologies in the printed circuit board industry including smaller holes,higher aspect ratios,three-dimensional features,fine pitch,blind via holes,and new lead free materials contin
.. leer más
Recovery of Copper Metal in the Continuous Regeneration of Cupric Chloride Etchant
An electrochemical device has been developed that deposits non adherent copper metal powder at the cathode,and generates chlorine gas at the anode. The chlorine is contained within the system,a
.. leer más
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. leer más
Changing the Methodology for DFM Moving from Design-Checker to Interactive,Informed Design Methodologies
The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial
.. leer más
The Importance of Being Grounded
The proper grounding of all conductive items in the production workplace is an essential element of ESD (electrostatic discharge) management. ESD damage to components and assemblies in manufact
.. leer más
RoHS and Green Compliance in IC Packaging
In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag
.. leer más
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. leer más
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. leer más
Tin Allotropic Transformation ~ Tin Pest
It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% [1,2] volume increase,and in appearance turns from a bright shiny m
.. leer más
High Phosphorus Electroless Nickel for Selective ENIG (SENIG)
Concerns
There are some areas that must be accepted if planning to run the newest SENIG process:
- Slower plating rate in nickel (to get 150µ“ it will take 20 minutes)
- It works better at hig
.. leer más
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. leer más
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. leer más
Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process
For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo
.. leer más
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. leer más
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. leer más
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. leer más
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. leer más
01005 Assembly Process – From the Board Design to the Reflow Process
The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable
.. leer más
How to Achieve 40 Microns (1.6 Mil) Placement Spacing with E01005/M0402
When trying to achieve 40 microns of placement spacing,bridges and tombstones may occur due to the variation of the component dimensions,equipment accuracy and pickup position variations.
Hawse
.. leer más
Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. leer más
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. leer más
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. leer más
"Behind the Scenes" of Effective OSP Protection in Pb-free Processing
Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa
.. leer más