Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Round-Robin,Predictor Models for T-Cycle life
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product
.. leer más
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. leer más
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. leer más
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. leer más
Manufacture and Performance of a Z-interconnect HDI Circuit Card
More and more circuit board designs require signals paths that can handle multi-gigahertz frequencies. The challenges for organic circuit boards,in meeting these electrical requirements,include
.. leer más
Towards a PCB Production Floor Metric for Go/No Go Testing of Lossy High Speed Transmission Lines
As designers strive to extract ever more performance from high speed transmission lines on FR4 substrates and their high speed derivatives,a requirement has arisen for a practical and robust “G
.. leer más
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. leer más
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. leer más
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. leer más
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. leer más
Thermoplastic Substrates: Performance of Materials to Meet WEEE
Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach
.. leer más
Printable Nanocomposites for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technolog
.. leer más
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. leer más
The Path to Robust Electronics - Preventing Corrosion of PCB Assemblies
All things corrode,and the rate of corrosion among electronics devices is accelerating. Electronic devices are being used in more places than ever before. They are finding more uses,they're mor
.. leer más
Contamination of Hydrocarbon Ceramic Dielectric
Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f
.. leer más
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize
solder joint integrity. Many standards exist to evaluate the long ter
.. leer más
Atmospheric Plasma – A New Surface Treatment Technology for Cleaning PCBs
Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream
converting operations; therefore,the benefits of plasma treatment are well r
.. leer más
Engineered Cleaning Fluid and Mechanical Impingement Optimization Innovations
The complexity of the electronic assembly manufacturing environment increases with the miniaturization,low standoff components,and solder alloy advancements. Past history suggests that the clea
.. leer más
Cleaning a No-Clean Flux on Contaminated Hardware as a Recovery Plan
There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the
fluxes are not fully complexed (not fully heat activated) there
.. leer más
Defluxing of Eutectic and Lead-Free PCBs in a Single Cleaning Application
As the entire electronic manufacturing industry braced for the July 1,2006 deadline,it has been reevaluating the entire production process. Likewise,the precision cleaning industry must also
.. leer más
Solving the Metric Pitch BGA & Micro BGA Dilemma
Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common
.. leer más
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
.. leer más
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
.. leer más
Round-Robin,Predictor Models for T-Cycle life
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product
.. leer más
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. leer más
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. leer más
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. leer más
Manufacture and Performance of a Z-interconnect HDI Circuit Card
More and more circuit board designs require signals paths that can handle multi-gigahertz frequencies. The challenges for organic circuit boards,in meeting these electrical requirements,include
.. leer más
Towards a PCB Production Floor Metric for Go/No Go Testing of Lossy High Speed Transmission Lines
As designers strive to extract ever more performance from high speed transmission lines on FR4 substrates and their high speed derivatives,a requirement has arisen for a practical and robust “G
.. leer más
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. leer más
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. leer más
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. leer más
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. leer más
Thermoplastic Substrates: Performance of Materials to Meet WEEE
Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach
.. leer más
Printable Nanocomposites for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technolog
.. leer más
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. leer más
The Path to Robust Electronics - Preventing Corrosion of PCB Assemblies
All things corrode,and the rate of corrosion among electronics devices is accelerating. Electronic devices are being used in more places than ever before. They are finding more uses,they're mor
.. leer más
Contamination of Hydrocarbon Ceramic Dielectric
Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f
.. leer más
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize
solder joint integrity. Many standards exist to evaluate the long ter
.. leer más
Atmospheric Plasma – A New Surface Treatment Technology for Cleaning PCBs
Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream
converting operations; therefore,the benefits of plasma treatment are well r
.. leer más
Engineered Cleaning Fluid and Mechanical Impingement Optimization Innovations
The complexity of the electronic assembly manufacturing environment increases with the miniaturization,low standoff components,and solder alloy advancements. Past history suggests that the clea
.. leer más
Cleaning a No-Clean Flux on Contaminated Hardware as a Recovery Plan
There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the
fluxes are not fully complexed (not fully heat activated) there
.. leer más
Defluxing of Eutectic and Lead-Free PCBs in a Single Cleaning Application
As the entire electronic manufacturing industry braced for the July 1,2006 deadline,it has been reevaluating the entire production process. Likewise,the precision cleaning industry must also
.. leer más
Solving the Metric Pitch BGA & Micro BGA Dilemma
Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common
.. leer más
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
.. leer más
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
.. leer más