Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Non-Destructive Real-time Optical Metrology of OSP Coatings on Production PCBs
Organic Solderability Preservative (OSP) coatings feature among the leading surface finish options in the printed circuit board (PCB) industry because of their excellent solderability,lead-free
.. leer más
Calculated Shear Stress Produced by Silicone and Epoxy Thermal Interface Materials (TIMs) During Thermal Cycling
Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo
.. leer más
Application Research of Snap Curing CSP Underfill
CSP underfill commonly acts to protect solder bumps of fine pitch CSP and enhances the reliability. This paper presents four snap curing underfills (=2min@150?or=5min@120?),tested on SnPb assem
.. leer más
Implementation of Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. leer más
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. leer más
Process Development with Temperature Sensitive Components in Server Applications
As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu
.. leer más
The Evaluation of CAF property for narrow TH pitch PCB
To better evaluate CAF (Conductive Anodic Filament) growth we have developed a Test Printed circuit board (PCB) with narrow pitch through holes. (THs) This test PCB can evaluate anti-CAF proper
.. leer más
A Case for Multiple Sheet Resistivities for Thin Film Embedded Resistor Packaging Applications
Designers of high performance electronics continue to have system requirements that necessitate the implementation of embedded resistors in microelectronic package and multilayer printed circui
.. leer más
The Embedded Passives Journey
When planning a trip for the first time there is usually a significant amount of planning and preparation involved. First,the destination is chosen that meets the objective (e.g. Las Vegas for
.. leer más
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. leer más
Laser Micromachining of Barium Titanate (BaTiO3)-Polymer Nanocomposite Based Flexible/Rollable Capacitors
This paper discusses laser micromachining of thin films. In particular,recent developments on high capacitance,large area,thin,flexible/rollable embedded capacitors are highlighted. A variety o
.. leer más
Optimising Rheology for Package-on-Package Flux Dip Processes
The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of
.. leer más
Ultra-Thin 3D Package Development and Qualification Testing
The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable
handset markets. Consumers? expectations are that each new generation of pr
.. leer más
Process and Assembly Methods for Increased Yield of Package on Package Devices
Increased functionality and smaller devices are significant drivers in innovative packaging designs. One of the newer package types to be introduced into the market place in the past few years
.. leer más
New Technology to Meet Challenging Reflow Requirements
New packaging technologies are making higher demands on components and also jointing techniques. The application of
polymer electronics as well as the integration of optical components into the
.. leer más
Cool It! Quickly Take Your Oven from Lead-Free to Leaded
Mixed leaded and lead-free processing requires that reflow ovens change temperature. Cooling a modern oven can take a long time,even longer than an older oven because modern ovens are more insu
.. leer más
Flux Collection and Self-Clean Technique in Reflow Applications
The flux management system for a reflow oven is highly critical to the quality,cost,and yield of a reflow process. Flux accumulation and dripping inside the oven not only requires frequent main
.. leer más
Fluid Flow Mechanics: Key to Low Standoff Cleaning
In recent years,various studies have been issued on cleaning under low standoff components; most however,with incomplete
information. It is essential to revisit and describe the latest challeng
.. leer más
An Analytical Model for an Inline Counter Flow Processor
One of the most popular pieces of equipment in the PCB fabrication industry is the inline processor. These machines are used for a variety of tasks including resist removal,etching and cleaning
.. leer más
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. leer más
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. leer más
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. leer más
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. leer más
Embedded Passives Predictability,As-Received and In-Service
Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other
components and enabling tailored interconnect topology. This technology needs
.. leer más
Nano- and Micro-Filled Conducting Adhesives for Z-axis Interconnections
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles for z-axis interconnections,
especially as it relates to package level fabrication,integration,and
.. leer más
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. leer más
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. leer más
Design of Flexible RFID Tag and Rectifier Circuit using Low Cost Screen Printing Process
Flexible electronics is the future trend of the worldwide electronic industry. The RFID tag is one of the main applications in flexible electronics currently. This paper presents a flexible HF
.. leer más
Peel Strength of Deposited Adhesiveless FCCL,or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed
.. leer más
Screen Printing Process for High Density Flexible Electronics
A series of advanced screen-printing processes have been developed to build functional high density flexible electronic circuits. Not only do the single layer circuits have fine conductor trace
.. leer más
Non-Destructive Real-time Optical Metrology of OSP Coatings on Production PCBs
Organic Solderability Preservative (OSP) coatings feature among the leading surface finish options in the printed circuit board (PCB) industry because of their excellent solderability,lead-free
.. leer más
Calculated Shear Stress Produced by Silicone and Epoxy Thermal Interface Materials (TIMs) During Thermal Cycling
Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo
.. leer más
Application Research of Snap Curing CSP Underfill
CSP underfill commonly acts to protect solder bumps of fine pitch CSP and enhances the reliability. This paper presents four snap curing underfills (=2min@150?or=5min@120?),tested on SnPb assem
.. leer más
Implementation of Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. leer más
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. leer más
Process Development with Temperature Sensitive Components in Server Applications
As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu
.. leer más
The Evaluation of CAF property for narrow TH pitch PCB
To better evaluate CAF (Conductive Anodic Filament) growth we have developed a Test Printed circuit board (PCB) with narrow pitch through holes. (THs) This test PCB can evaluate anti-CAF proper
.. leer más
A Case for Multiple Sheet Resistivities for Thin Film Embedded Resistor Packaging Applications
Designers of high performance electronics continue to have system requirements that necessitate the implementation of embedded resistors in microelectronic package and multilayer printed circui
.. leer más
The Embedded Passives Journey
When planning a trip for the first time there is usually a significant amount of planning and preparation involved. First,the destination is chosen that meets the objective (e.g. Las Vegas for
.. leer más
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. leer más
Laser Micromachining of Barium Titanate (BaTiO3)-Polymer Nanocomposite Based Flexible/Rollable Capacitors
This paper discusses laser micromachining of thin films. In particular,recent developments on high capacitance,large area,thin,flexible/rollable embedded capacitors are highlighted. A variety o
.. leer más
Optimising Rheology for Package-on-Package Flux Dip Processes
The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of
.. leer más
Ultra-Thin 3D Package Development and Qualification Testing
The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable
handset markets. Consumers? expectations are that each new generation of pr
.. leer más
Process and Assembly Methods for Increased Yield of Package on Package Devices
Increased functionality and smaller devices are significant drivers in innovative packaging designs. One of the newer package types to be introduced into the market place in the past few years
.. leer más
New Technology to Meet Challenging Reflow Requirements
New packaging technologies are making higher demands on components and also jointing techniques. The application of
polymer electronics as well as the integration of optical components into the
.. leer más
Cool It! Quickly Take Your Oven from Lead-Free to Leaded
Mixed leaded and lead-free processing requires that reflow ovens change temperature. Cooling a modern oven can take a long time,even longer than an older oven because modern ovens are more insu
.. leer más
Flux Collection and Self-Clean Technique in Reflow Applications
The flux management system for a reflow oven is highly critical to the quality,cost,and yield of a reflow process. Flux accumulation and dripping inside the oven not only requires frequent main
.. leer más
Fluid Flow Mechanics: Key to Low Standoff Cleaning
In recent years,various studies have been issued on cleaning under low standoff components; most however,with incomplete
information. It is essential to revisit and describe the latest challeng
.. leer más
An Analytical Model for an Inline Counter Flow Processor
One of the most popular pieces of equipment in the PCB fabrication industry is the inline processor. These machines are used for a variety of tasks including resist removal,etching and cleaning
.. leer más
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. leer más
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. leer más
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. leer más
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. leer más
Embedded Passives Predictability,As-Received and In-Service
Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other
components and enabling tailored interconnect topology. This technology needs
.. leer más
Nano- and Micro-Filled Conducting Adhesives for Z-axis Interconnections
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles for z-axis interconnections,
especially as it relates to package level fabrication,integration,and
.. leer más
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. leer más
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. leer más
Design of Flexible RFID Tag and Rectifier Circuit using Low Cost Screen Printing Process
Flexible electronics is the future trend of the worldwide electronic industry. The RFID tag is one of the main applications in flexible electronics currently. This paper presents a flexible HF
.. leer más
Peel Strength of Deposited Adhesiveless FCCL,or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed
.. leer más
Screen Printing Process for High Density Flexible Electronics
A series of advanced screen-printing processes have been developed to build functional high density flexible electronic circuits. Not only do the single layer circuits have fine conductor trace
.. leer más