Global Electronics Association Names Jason Palmi Chief Financial Officer

Manufacturing executive and finance leader brings growth, operational expertise, and global financial discipline to support the Association’s next chapter

The Global Electronics Association today announced that Jason Palmi has joined the organization as Chief Financial Officer.

IPC Standards Support Professional Assessment for the Electronics Competition at WorldSkills Shanghai 2026

The 48th WorldSkills Competition was held in Shanghai from September 22 to 27. According to the official competition results, Wu Tong of China won the gold medal in the Electronics competition, marking China’s fourth consecutive gold medal in this category.

North American EMS Orders Outpace Shipments in August as Bookings Rise 53.5% Year-Over-Year

The Global Electronics Association releases EMS industry results for August 2026

The Global Electronics Association announced today the August 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.39.

North American PCB Shipments Jump 23.5% in August, Extending Strong 2026 Growth

The Global Electronics Association releases PCB industry results for August 2026

The Global Electronics Association announced today the August 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.29.

MIT’s Yossi Sheffi to Headline Global Electronics Association APEX EXPO 2027

Largest North American electronics trade fair welcomes Dr. Sheffi to drive conversations on AI, resilience, geopolitics and their impact on current and future state of electronics

The Global Electronics Association today announced Yossi Sheffi, Ph.D., best-selling author, entrepreneur and Massachusetts Institute of Technology (MIT) professor, will deliver the opening keynote address at APEX EXPO 2027 on Tuesday, April 6, focused on the forces reshaping the global electronics industry.

Global Electronics Association and Fraunhofer Group for Microelectronics Sign MoU to Support Advanced Packaging Industrial Adoption

MoU will connect APECS pilot line innovation with the guidelines, standards, training and digital tools needed for industry adoption

The Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing.