Global Electronics Association Announces New Board Members at APEX EXPO 2026

Board additions reinforce expertise across the electronics ecosystem

At the 69th Global Electronics Association Annual Meeting on March 17, held in conjunction with APEX EXPO 2026, the Association’s Board of Directors announced new officers and first-term members.

IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing

On March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.

Global Electronics Association and MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem

The Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.

2026 IPC Masters Competition China Kicks Off in Shanghai, Advancing Industry Excellence Through Standards and Talent

The 2026 IPC Masters Competition China officially opened today at productronica China in Shanghai.

John Luddy Named Interim Executive Director of U.S. Partnership for Assured Electronics (USPAE)

Veteran national security and defense policy leader will guide USPAE’s work strengthening the U.S. defense electronics industrial base

North American PCB Market Jumps 17.6% in February, Strong Shipments Offset Mixed Booking Trends

The Global Electronics Association releases PCB industry results for February 2026

The Global Electronics Association announced today the February 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.08.