Global Electronics Association Names Dominik Grau Vice President of Europe
The Global Electronics Association today announced that Dominik Grau has joined the Association as vice president of Europe.
Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027
The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, Calif.
May EMS Shipments Rise as North American Book-to-Bill Signals Ongoing Strength
The Global Electronics Association announced today the May 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.36
North American PCB Market Gains Momentum with 1.60 Book-to-Bill Ratio in May
The Global Electronics Association announced today the May 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.60.
From Prototype to Production: New Guideline Helps Industry Design, Integrate and Scale Reliable E-Textile Systems
The Global Electronics Association announces Fundamentals and Best Practices for E-Textile System Development, a new next-generation guideline that provides a structured framework for the design, testing and deployment of e-textiles systems.
Global Electronics Association Releases IPC-1401B ESG Management System Standard
The Global Electronics Association has released IPC-1401B, Environmental, Social and Governance (ESG) Management System Standard, an updated industry standard that gives manufacturers a practical, scalable framework to demonstrate ESG performance to customers, investors, and regulators.