Silicon Carbide and Gallium Nitride Play Growing Role in Electronics Design, Manufacturing and Supply-Chain Strategy
Silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding their role in electronics, with implications extending beyond component selection to product design, manufacturing capability and supply-chain planning, according to new research from the Global Electronics Association and Accuris.
Global Electronics Association's ADEPT Council Deepens Taiwan Presence as First Satellite Council Holds Inaugural In-Person Meeting
The Global Electronics Association's Advanced Electronic Packaging Technology (ADEPT) Leadership Council is deepening its presence in Taiwan.
Global Electronics Association Hosts IMPACT 2026 Session on Advanced Electronic Packaging System Integration, with Technical Perspectives from Unimicron, STATS ChipPAC and Wistron
The Global Electronics Association today hosted the session "Advancements in Component to System Integration" at IMPACT 2026, bringing together Unimicron, STATS ChipPAC, Wistron and market research firm TechSearch International.
High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method
High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.
Global Electronics Association Releases IPC-1783-CO2E Standard for Product Carbon Footprint Data
The Global Electronics Association today announced the release of IPC-1783-CO2E, International Standard for Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions for the Electronics Manufacturing Supply Chain, a new global standard designed to bring greater consistency, credibility and comparability to product carbon footprint data across the electronics industry.
Global Electronics Association and Purdue University Establish Strategic Partnership to Advance Electronics Innovation
The Global Electronics Association and Purdue University have signed a memorandum of understanding establishing a strategic partnership to advance innovation, workforce development and industry collaboration across the electronics ecosystem.