IPC Hosts Advanced Packaging Symposium in Tokyo
The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.
Sharp Decline in European Electronics Manufacturing Jeopardizes Strategic EU Priorities
A new report by IPC, reveals Europe’s growing dependency on other regions for electronics manufacturing in critical and strategic sectors including aerospace and defence. Despite the adoption of the European Chips Act, the “Securing EU’s Electronics Ecosystem” report finds the EU’s market share in critical electronics components beyond chips, including printed circuit boards (PCBs), electronic manufacturing services (EMS) and advanced packaging, will decline to 15 percent by 2035.
IPC Issues Call for Participation for IPC APEX EXPO 2025
IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2025. The technical conference will be held March 18-20 and professional development courses will take place March 16-17 and 20, 2025 at the Anaheim Convention Center in Anaheim, Calif.
IPC Adds Nimonik as New Global Standards Subscription Distributor
Effective June 1, 2024, IPC entered into a distribution agreement with Nimonik, a regulatory and standards compliance software company. Nimonik is now able to offer IPC standards products in hard-copy and electronic media format through their online retail store or via an annual subscription.
James Will to Lead USPAE as New Executive Director
Effective May 28, 2024, James Will joined the U.S. Partnership for Assured Electronics (USPAE) as the association’s new executive director.
North American PCB Industry Sales Up 9.4 Percent in April
IPC announced today the April 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.06.