IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers
A new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.
Electronics Industry Sentiment Drops Sharply in September Following Brief August Rebound
Industry sentiment in the electronics sector declined significantly in September due to rising cost concerns and weakening demand according to IPC’s September Sentiment of the Global Electronics Manufacturing Supply Chain Report.
North American PCB Industry Sales Up 35 Percent in August
IPC announced today the August 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.
North American EMS Industry Shipments Down 4.4 Percent in August
IPC announced today the August 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.27.
Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
In conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”