North American EMS Industry Up 7.1 Percent in May

IPC releases EMS industry results for May 2023

IPC announced today the May 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.24.

Total North American EMS shipments in May 2023 were up 7.1 percent compared to the same month last year. Compared to the preceding month, May shipments decreased 5.2 percent.

EMS bookings in May increased 0.8 percent year-over-year and increased 4.4 percent from the previous month.

“This month we saw a small reversal in the trend we have been seeing this year,” said Shawn DuBravac, IPC’s chief economist. “New orders rose on a year-over-year basis for the first time since October 2022. Shipments fell slightly compared to last month but continue to show a positive trend.”

May 2023 EMS book to bill ratio

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

IPC President and CEO Dr. John W. Mitchell Releases New Book, “Fire Your Hiring Habits”

Content provides an in-depth look at the shift in today’s hiring practices

Fire Your Hiring Habits: Building an Environment that Attracts Top Talent in Today's Workforce, by IPC President and CEO Dr. John W. Mitchell has been published by Forbes Books and is now available. Proceeds from the book will go to the IPC Education Foundation (IPCEF) to support careers in the electronics manufacturing industry.

In Fire Your Hiring Habits, Mitchell shakes up the hiring status quo with his views on the changing hiring landscape, and how businesses can attract and retain top talent today. Using real-world examples culled from Mitchell’s career, his book tackles relevant workforce issues such as recruiting and onboarding, talent pipelines, upskilling, corporate culture and more.

Within the book, Mitchell reframes The Great Resignation as a Great Reprioritization on the part of workers, and perhaps more importantly, a Great Reimagining for leaders, noting that employers are missing the key factors that motivate good people to stay, and the reasons why they leave in today’s business environment.

"How we structure our organizations, how we acquire talent, and how we interact with staff will determine the long-term viability of our companies,” explains Mitchell. “This book is all about helping leaders that are anxious about their long-term hiring prospects and embracing new ways of retaining talent.”

Fire Your Hiring Habits: Building an Environment that Attracts Top Talent in Today's Workforce is available on Amazon, Barnes & Noble, and Audible. To learn more about Mitchell’s book, visit  https://johnwmitchell.com/book/.

IPC Launches Three Cutting-edge Online Instructor-led Courses to Empower Electronics Industry Professionals

IPC announces the launch of three new online courses designed to equip professionals with valuable knowledge and skills in the rapidly evolving electronics sector. Available on IPC’s online education platform, IPC EDGE, these new courses will provide industry experts and enthusiasts with opportunities for growth and development.

  • Top Lead-Free Production Defects and Issues: Causes, Remedies, and Prevention: This course offers participants an in-depth exploration of the challenges and solutions related to lead-free production. Developed by Dr. Jennie Hwang, this course is ideal for manufacturers, engineers, and quality assurance personnel seeking to enhance their understanding of lead-free assembly processes, minimize defects, and optimize production efficiency. With a comprehensive curriculum and interactive learning modules, participants will gain the expertise required to overcome common challenges in lead-free production.
  • HDI Enabling Technology: Advanced Packaging: This course is a necessity for professionals looking to deepen their knowledge of high-density interconnect (HDI) technology. Developed by Mike Carano, this course explores cutting-edge techniques and emerging trends in HDI, enabling them to leverage advanced packaging technologies effectively. This course is perfect for design engineers, manufacturing professionals, and technology enthusiasts seeking to stay ahead in the rapidly evolving electronics landscape.
  • Introduction to PCB Design Engineering: Designed as an introductory course, "Introduction to PCB Design Engineering" equips individuals with the fundamental principles of printed circuit board (PCB) design. Fil Arzola instructs participants on industry-standard software and teaches best practices for designing efficient and reliable PCB layouts. Whether you are a novice designer or an experienced professional seeking to refresh your skills, this course will enhance your understanding of PCB design and empower you to create cutting-edge electronic devices.

Each of these courses is delivered by an industry expert providing participants with a flexible and interactive learning experience. "We are thrilled to unveil these three exceptional courses as part of IPC's commitment to fostering knowledge, innovation, and professional growth within the electronics industry," said Carlos Plaza, senior director of education development at IPC. "These courses have been meticulously designed to address the evolving needs of industry professionals, equipping them with the skills and expertise required to excel in their careers."

By enrolling in these courses, participants will have the opportunity to:

  • Gain insights from industry experts and thought leaders.
  • Master the latest techniques and technologies in the electronics industry.
  • Boost their professional credentials and advance their careers.
  • Network and collaborate with fellow professionals and experts in the field.
  • Stay updated with the latest industry standards and best practices.

For more information about these courses or to enroll, visit https://education.ipc.org.

IPC to Host 2nd Annual Integrated Electronics Manufacturing & Interconnections (IEMI) Event

Electronics manufacturers to gather in Chennai August 1 and Pune, India, August 3

In 2022, IPC celebrated a decade of successful support to India’s electronics manufacturing industry and launched a series of activities including member networking events and skill challenge competitions throughout India, culminating in the inaugural Integrated Electronics Manufacturing & Interconnections (IEMI) event in New Delhi and Bengaluru last August. Based on the success of last year’s event, IPC will once again play host to IEMI events in Chennai on August 1 and in Pune on August 3.

The event will bring together designers, manufacturers, traders, suppliers, service providers and technical experts to explore new business partnerships, gain technical knowledge and source products and services. IPC India has partnered with several in-country chambers of commerce and trade associations to arrange international delegate visits from Singapore, Malaysia, Thailand, Sri Lanka, South Africa, Middle East and Israel.

Event highlights include a welcome address from State Ministers, keynote addresses from industry leaders and experts, panel discussions, a vendor development program, business-to-business meetings with country delegates, skills challenge competition, standards development meetings, an exhibition, an awards ceremony and networking lunch. IEMI Chennai will focus on the aerospace and defense market sector and IEMI Pune will focus on the EV automotive sector.

Exhibiting companies include: JBC, HTL, Ray-Q, Indium, Mectronics, Advance Tech, Prodigy, Japan Unix, Zeiss, Vinrox, Signum, Static Systems, Miracle, Sumitron/Hakko, Nanotech, Biometric Cables and more.  

“We are expecting 1,000+ visitors from India and an additional 10 countries to this year’s event,” said John Mitchell, IPC president and CEO. “India is a dynamic market for the global manufacturing industry, and iEMI proves that. I am confident that IEMI 2023 will help attendees expand their business prospects and forge new strategic partnerships while there!”

“One of the major attractions of IEMI 2023 will be a Vendor Development Program/Sourcing Meet,” said Gaurab Majumdar, executive director of IPC India. “With the objective of promoting the growth and development of Indian SMEs by improving their market access, IPC is committed to working with Indian and global OEMs, to help them meet potential EMS and wire harness suppliers.”  

For more information on Integrated Electronics Manufacturing & Interconnections (IEMI), visit  www.ipc.org/ipc-india-iemi or contact Majumdar at GaurabMajumdar@ipc.org.

IPC APEX EXPO 2024

Event Website
Date
-

Discover the newest innovations and hear from the best minds in the electronics manufacturing industry. IPC APEX EXPO 2024 will be our industry’s largest event in North America featuring a world-class trade show, professional development courses taught by industry experts, non-stop networking and more! IPC APEX EXPO 2024 will also host the Electronic Circuits World Convention 16 (ECWC16) Technical Conference featuring cutting-edge technical presentations. Join us in Anaheim, California, April 6-11, 2024.

Event Website

IPC Issues Call for Participation for the Electronic Circuits World Convention 16 (ECWC16) and IPC APEX EXPO 2024

IPC is now accepting abstracts for technical paper presentations and technical posters for the Electronic Circuits World Convention 16 (ECWC16) at IPC APEX EXPO 2024, and professional development courses at IPC APEX EXPO 2024. The technical conference will be held April 9-11, and professional development courses will take place April 7-8, and 11, 2024, at the Anaheim Convention Center in Anaheim, Calif.

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers, and executives from all segments of the industry worldwide.

The Electronic Circuits World Convention (ECWC16) is an international PCB symposium held every three years, in different cities worldwide. ECWC provides a valuable platform to encourage knowledge sharing about the latest information on global PCB demand, PCB manufacturing processes, and to promote the domestic PCB industry in every country and every region.

To recognize exceptional achievement, the IPC Technical Program Committee (TPC) will select the top qualifying papers and one top poster for awards. Awards include “Best of Conference,” “NextGen Best Paper,” “Best Student Research Paper,” and “Best Technical Poster.” 

“IPC is proud to be the host of ECWC16,” said Julia Gumminger, manager, IPC professional development and events. “We look forward to seeing the exciting new work from our colleagues in the global electronics manufacturing industry. Attendees of technical sessions will benefit from a broader perspective on what’s next in electronics manufacturing. Our professional development courses remain one of the strongest offerings at IPC APEX EXPO, where experts from all areas of the industry, including design, materials, assembly, processes, equipment, and Industry 4.0 share their expertise.”

For technical conference paper presentations and posters, ECWC16 and IPC seek abstracts that describe significant results from research experiments, highlight new techniques or materials, and/or discuss cutting-edge trends and challenges facing the electronics manufacturing industry. All submissions must be non-commercial, summarizing original and previously unpublished work covering case histories, research, and discoveries. Conference speakers are entitled to a free one-day conference pass for the day of their presentations. Papers will be published in a proceedings document, and both paper and poster presentations will be delivered in person at ECWC16 at IPC APEX EXPO 2024 in Anaheim. Deadline for abstract submissions is September 18, 2023.

For professional development courses, IPC seeks abstracts for three-hour sessions of live instruction covering all aspects of electronics manufacturing. Courses can be offered as one 3-hour session or two 3-hour sessions (offered as Part 1 & Part 2 for a total of 6 hours). Honoraria and travel expense stipends are offered to professional development instructors. Professional development abstracts are due August 28, 2023.          

To submit an abstract, visit www.ipcapexexpo.org/CFP. For more information on IPC APEX EXPO 2023, visit www.ipcapexexpo.org.

IPC Rolls out Red Carpet for Standards A-Team Volunteers at Annual Golden Globe Awards Ceremony at IPC SummerCom

Seven new awards categories announced

The third annual Golden Gnome Awards ceremony was held on May 16, 2023, at IPC SummerCom. The awards recognize the outstanding and creative work of IPC A-Teams, dedicated groups of volunteers within IPC standards working groups who take on a significant amount of work on behalf of their groups. A highly sought-after award, each Golden Gnome Award trophy is created using one of IPC’s resident 3D printers and then hand-painted by an IPC staff liaison.    

“The Golden Gnome Awards dinner is a unique and creative way to honor our A-Team members,” said Teresa Rowe, IPC senior director, assembly and standards technology, “and the celebration gets more exciting and elaborate every year. We added new awards this year and provided a red-carpet entry and Golden Gnome photo op for attendees, giving everyone a chance to celebrate their gnome enthusiasm.”  A gallery of photos from the event can be found on IPC’s Flickr page. 

The 2023 Golden Gnome Award winners are:

  • A-Team Name of the Year Award: Looks Like a Hangover. This award, which is selected by a vote of the IPC Committee Chair Council, goes to the A-Team with the most creative name.
  • Best Visual Effects Artist: Robert Cooke, NASA Johnson Space Center. This award goes to an A-Team member who has provided significant support to the development of graphics for their team’s standard. Support can include drawing illustrations or securing images for the standard. Open to all A-Team members, this award can be won more than once.
  • Designer Top Contributor Award: The Creeps. This award recognizes an A-Team or an individual from an A-Team for outstanding design-related contributions to IPC standards development.
  • Emerging Engineer Award: Tyler Siebert, Lockheed Martin Missiles & Fire Control.  This award is presented to one emerging engineer A-Team member who has shown a high level of active participation on one or more A-Teams.
  • Editor of the Year Award: Scott Meyer, Collins Aerospace. This award recognizes outstanding work in editing documents as part of the A-Team.
  • Globetrotter Award: Tiberiu Baranyi, Flextronics Romania SRL; Michael Schleicher, Semikron Elektronik GmbH Co. KG. This award recognizes A-Team members who have demonstrated leadership and initiative in working with individuals and teams from outside their country for the benefit of their A-Team.
  • Gnoble Gnome Award: Jim Blanche, NASA Marshall Space Flight Center (posthumous) This award recognizes the lifetime or long-term achievement of A-Team members who have demonstrated dedicated A-Team participation or leadership over multiple years and/or have shaped the way A-Teams work in developing IPC standards.
  • Gnome’s Choice Award: Randy Bremner, Northrop Grumman. This award goes to the favorite A-Team member in attendance at IPC SummerCom selected by IPC SummerCom attendees through Roman Ballot. Open to all A-Team members, it can be won more than once.
  • Gnome Spirit Award: Joe Geiger, Bally Ribbon Mills; Milea Kammer, Honeywell International. This award is presented to A-Team members who have exemplified through their A-Team activity the spirit of being an A-Team member.
  • Gnometastic Award – Christina Rutherford, Honeywell Aerospace. This award goes to a volunteer who is an active participant on the most A-Teams. Staff liaisons will verify active participation on each roster. Open to all A-Team members, it can be won more than once.
  • Guardianome Award: Symon Franklin, Custom Interconnect Ltd.; Garry McGuire, NASA Marshall Space Flight Center. This award goes to the A-Team member who went over and beyond in helping to prepare a proposed standard for ballot during the eligibility period. This person will have provided a staff liaison with special support in the preparation of proposed standard for ballot documentation. Open to all A-Team members, this award can be won more than once.
  • High-Five Award: Michael Ford, Aegis Software UK; Symon Franklin, Custom Interconnect Ltd.; Jan Pedersen, NCAB Group AB; Ekaterina Stees, Lockheed Martin-Missiles & Fire Control; Debbie Wade, Advanced Rework Technology. These awards go to the five A-Team members who posted the most original content to IPC Works during the eligibility period. This award is open to all A-Team members and can be won more than once.
  • Innovator Gnome: 5-26a A-Team. This award recognizes the creative or innovative activity of an A-Team member that led to a new standard or significant change to an existing standard. Open to all A-Team members, this award can be won more than once.
  • IPC Works Leaderboard Award: Tiberiu Baranyi, Flextronics Romania SRL wins this award for the second year in a row. This award recognizes A-Team members with the most activity on IPC Works, IPC’s standards development community’s collaboration, and networking intranet.
  • Outstanding A-Team Member of the Year: Tim Pearson, Collins Aerospace. This award is presented to an A-Team member who has gone above and beyond in their A-Team participation. 
  • Rookie of the Year – Xu Liu, Apple. This award goes to one new A-Team member during an eligibility period, who has made provided significant support to their A-Team. This award goes to an individual who became an A-Team member for the first time during the eligibility period. This award can only be won once.
  • Worker Bees of the Year Award: The Terminators. This award is presented to A-Teams that have shown the most activity in IPC Works in the development of their standard.

For more information on IPC’s Golden Gnome Awards, contact Teresa Rowe, IPC senior director of assembly and standards technology, at TeresaRowe@ipc.org. For industry members interested in joining an IPC standards development committee and charting a path to their own Golden Gnome Award, visit www.ipc.org/ipc-standards.

IPC and TEEMA Sign MoU to Support the Electronics Manufacturing Industry’s Digital Transformation

On May 17, 2023, IPC and Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA) signed a Memorandum of Understanding (MoU) at the Electrical Wire Processing Technology Expo (EWPTE) in Milwaukee, Wis., USA. The MoU aims to promote the adoption and use of IPC-2591, Connected Factory Exchange, the plug-and-play industry standard for factory communication which sets the baseline for companies to achieve Industry 4.0.

The MoU marks the two organizations’ joint efforts and commitment in promoting the digital transformation of the electronics manufacturing industry. Through cooperation, IPC and TEEMA have agreed to promote global acceptance and adoption of IPC’s international standards, raise the industry's awareness of IPC-2591, and encourage enterprises to accelerate the pace of digital transformation to adapt to changing market demands and technology development.

“IPC and TEEMA share a mutual goal of supporting the electronics industry’s digital transformation,” said IPC President and CEO John W. Mitchell. “TEEMA has played a very important role in promoting the implementation of the IPC CFX standard. We firmly believe that the partnership between IPC and TEEMA and our joint efforts to promote the electronics industry’s digital transformation will certainly propel industry through the next industrial revolution.”

Added Sydney Xiao, president, IPC Asia, “I am confident that the strength of our partnership and commitment to serve the needs of our members will be the cornerstone of IPC and TEEMA’s cooperative efforts. We look forward to actively driving the digital transformation of the industry, which in turn drives the competitive excellence and financial success of our member companies.”

B2B Meeting Registration for Pune Event

Date
- (Aug 2, 2023 | 11:00pm - Aug 3, 2023 | 5:00am CDT)

.

Please Provide Below Details

Sorry...This form is closed to new submissions.

Companies @ B2B Meeting
blank image
blank image
blank image
blank image
Thank you for registering for the B2B meetings in Pune. Our regional team will contact you and inform you of your meeting time.

 

 

 

 

 

Event Location Pune

Senapati Bapat Road
Pune 411053
Maharashtra
India

Event Venue Website
https://www.marriott.com/en-gb/hotels/travel/pnqmc-jw-marriott-hotel-pune/

Event Location Pune

Event Location Pune
Senapati Bapat Road
Pune, MH 411053
India

Electronics Industry Leaders Call on Congress to Support $100M in PCB Sector Funding

Funds would help ensure success of the CHIPS Act and Biden’s “Presidential Determination” on PCBs

Senior executives of 26 electronics manufacturing companies from across the United States are calling on the U.S. Congress to support robust funding for reinvigorating the printed circuit board (PCB) manufacturing sector.

In a pair of letters sent to the heads of the Appropriations Committees and Defense Appropriations Subcommittees in the House and Senate, the executives urged that $100 million be allocated in Fiscal 2024 to implement President Biden’s recent “presidential determination” under Title III of the Defense Production Act that rebuilding the PCB sector is critical to U.S. national security.

The funding also would advance the goals of the CHIPS and Science Act, which aims to ensure the autonomy and resiliency of the U.S. supply chain for semiconductors and advanced electronics. 

“An FY 2024 appropriation of $100 million from the Defense Production Act account would represent a meaningful first step in addressing the industrial base vulnerabilities related to PCB fabrication and semiconductor packaging. Making these investments is critical to the technological edge that is the hallmark of the U.S. defense industrial base,” the letters say.

PCBs are as integral to electronics as semiconductor chips, their better-known partners. They are the physical platform upon which microelectronic components such as chips and capacitors are mounted and interconnected. Electronic systems cannot function without PCBs. 

However, according to “Leadership Lost,” a report published by IPC, the United States “has lost its historic dominance in the PCB sector.” Since 2000, the U.S. share of global PCB production has fallen from over 30% to just 4%, with China now dominating the sector at around 50%. Any loss of access to non-domestic sources of PCBs would be “catastrophic,” the report said.

A 2022 report by the Commerce Department noted, “PCBs are essential for the electronic functions of ICT hardware as well as for a wide array of automotive, defense, and medical devices. [But] In the past 20 years China has overtaken the U.S. as the global leader in PCB manufacturing and sales.” A 2018 Commerce Department report characterized the PCB sector as “dying on the vine.”

The companies and states represented on the letters are:

  • Advanced Circuitry International, Duluth, GA
  • American Standard Circuits, Inc., West Chicago, IL
  • APCT, Inc., Santa Clara, CA
  • Arc-Tronics, Inc., Elk Grove Village, IL
  • Aurora Circuits, Aurora, IL
  • Bay Area Circuits, Fremont, CA
  • Calumet Electronics Corp., Calumet, MI
  • Data I/O, Redmond, WA
  • DR Circuits, Simi Valley, CA
  • Epoch, Fremont, CA  
  • Eptac, Manchester, NH
  • Fusion-EMS, Hillsboro, OR
  • Innovative Circuits, Alpharetta, GA
  • Isola Group, Chandler, AZ
  • liloTree, Redmond, WA
  • National Technology Inc., Rolling Meadows, IL
  • PPSI, Houston, TX
  • Sanmina, San Jose, CA
  • Silicon Forest Electronics, Vancouver, Wash.
  • Solderability Testing and Solutions, Inc., Richmond, KY
  • STI Electronics, Madison, AL
  • STRAC Institute, Providence, RI
  • Summit Interconnect, Anaheim, CA
  • Sunstone Circuits Mulino, OR
  • TTM Technologies, Costa Mesa, CA
  • Worthington Assembly, South Deerfield, MI
Subscribe to