John Deere Electronic Solutions Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing Recertification

IPC's Validation Services Program announces that John Deere Electronic Solutions, a manufacturer of custom, integrated electronics components based in Fargo, N.D., has become the first OEM company to be recertified a third time to the IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML). John Deere Electronic Solutions achieved the QML certification nine years ago and this year successfully demonstrated the Class 3 level work required for recertification on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

“Their dedication to high reliability and meeting the requirements of Class 3 level work was demonstrated during the audit process,” stated Randy Cherry, IPC director of Validation Services.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize John Deere Electronics Solutions for continuing to be a member of IPC's network of trusted QML suppliers."

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.   

IPC Hand Soldering Competition - Regional & World Championship - productronica 2023

Date
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Join Regional Qualification for the IPC Hand Soldering Competition (HSC) being held at productroonica – Munich, Germany - Hall #A4, IPC Booth #A4-502 - on 14-17 November 2023.

Skilled soldering experts (F/M) will be competing for 60 minutes on a complex circuit board assembly in the regional competition (14-15 November 2023) to win the 2023 Regional title, earn a cash prize and a coveted spot at the IPC Hand Soldering World Championship.  (HSC World Final to take place on 16-17 November 2023 at productronica in Munich, Germany).

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes in accordance with IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality of the assembly as well as the speed at which the assembly was produced.

Prizes for Professionals

Cash prizes will be awarded to the professionals: the winner and two runners-up.

  • 1st place – 300€
  • 2nd place – 200€
  • 3rd place – 100€

IPC Hand Soldering World Championship: The winner at the regional competition at prouctronica will be invited to take part in the HSC World Finals, 16-17 November 2023, IPC booth #A4-502.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

You will receive a confirmation email specifying your date and time to compete.

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org)

Delivering Engaging Presentations

Date
- (12:00 - 1:00pm CDT)

This webinar is for anyone giving or even contemplating giving a verbal presentation with associated slides. Specific topics will include: personal aspects, the venue, preparing the presentation, giving the presentation and dealing with questions.

Bev Christian October 31

Speaker Bio

Dr. Christian in his 30+ years in the electronics industry has worked for Nortel, BlackBerry and the University of Maryland (CALCE).  He currently works for the HDPUG consortium as a project facilitator.  He has received several awards including three Nortel President’s Awards for his environmental work, SMTA’s Member of Technical Distinction and International Leadership Awards, RIM’s Americas Environmental Champion and the Dieter Bergman IPC Fellowship Award.  Dr Christian has over 50 published papers.  His specific areas of interest include solderability, corrosion and environmental compliance.  Bev also sits on standards committees of the IPC and the IEC.  

Highlights of IPC’s 2023 PCB Technology Trends Study

Date
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Michael Carano, IPC’s technical consultant, will present some of the key findings from IPC’s latest PCB Technology Trends study, published this past October. The study covers OEMs’ use of emerging technologies and PCB requirements today and projected out five years, along with PCB fabricators’ current and anticipated technical capabilities. The findings provide guidance to the electronics supply chain in meeting the current and future needs of OEMs, and the outlook for circuit board technology development through 2028.

During the webinar, Mike will present:

• industry’s current state of circuit board technology
• assessment on aspects of board design, performance, operating environment, capabilities, materials, special structures, and new technologies
• a brief outlook on future PCB technology developments through 2028

IPC’s PCB Technology Trends Report Details How PCB Manufacturers Meet Current and Future Technology Demands

PCB Technology Trends 2023, IPC’s biennial global study, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2028 that will affect the whole industry. Based on data from 60 companies worldwide, the 48-page report presents data on PCB technology and OEMs’ PCB requirements as of 2023, as well as OEMs’ use of emerging technologies. Predictions from both industry segments indicate what these measurements are expected to be five years into the future.

This report covers five main focus areas: higher density, design concerns/signal integrity, change in processing/manufacturing techniques, technical business challenges, and compliance/environmental issues.

Data from report indicate:

  • HDI (high density interconnect) usage/fabrication has increased from 37.5% to just over 49% in five years. In addition, the median has shifted from 35% present day to 50% in five years. This indicates more of the respondents predict even greater usage/specification of HDI boards in five years.
  • In terms of PCB design limitations, heat dissipation is a major concern based on the respondents’ answers. The majority of the respondents (71%) indicated thermal vias are the primary method to manage heat dissipation.
  • Respondents indicated that there will be continued use of a variety of solderable finishes. The consensus that there is no universal finish (one that meets everyone’s needs) is prevalent.
  • Respondents face a wide variety of business challenges:  achieving better yields, moving up the technology curve, workforce training and finding competent personnel are key levers needed to drive business.
  • Respondents overwhelmingly are losing sleep over workforce development, lack of staff’s basic engineering skills, supply chain lead times and product overregulation.

PCB Technology Trends 2023 is available to IPC members for $595 and $995 for nonmembers. For more information or to purchase the report, visit IPC’s Online Store.

As EU Reviews Risk Assessments of Critical Technologies, IPC Stresses Need for Industrial Policy Approach to Include Complete Electronics Ecosystem

The following is a statement by Alison James, IPC senior director of European government relations:

“IPC urges the European Commission to address the alarming strategic dependencies in European electronics manufacturing as part of and independently of the risk assessments on critical technologies announced yesterday. Electronics manufacturing is central to the four critical technologies highlighted in the Commission’s proposal although key segments of electronics manufacturing in Europe have atrophied, undermining the region’s resiliency, security, and economic competitiveness.   

“IPC recently led a collaboration of more than 100 companies across the electronics industry to produce a report for the European Commission. The report establishes the strategic importance of a robust electronics manufacturing industry, including globally competitive component manufacturers, electronics assemblers (EMS), and printed circuit board (PCB) fabricators, as well as their equipment and materials suppliers.  

“The industry stakeholders that produced the report agreed that Europe must strengthen the electronics manufacturing industry to remain on the forefront of technological innovation, compete in the global economy, and bolster resiliency against future supply chain disruptions.  As a follow up to the report, IPC is leading the industry’s efforts to engage policy makers and produce new economic research that underscores the risks of a weakened electronics manufacturing ecosystem to Europe.”

View the comprehensive report, including a list of collaborating companies.

 

USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics

In a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.

The experimental DBX program brings together the electronics industry expertise of USPAE with the DoD’s Manufacturing, Capability Expansion, and Investment Prioritization Directorate (MCEIP) to award funding through a process meant to accelerate solution development and improve the longevity of suppliers providing those solutions.

Together, USPAE and DoD will award up to $10 million in unique government funding for companies to commercialize technologies. The program will test whether such awards can achieve better results by focusing first on commercialization so that the agency can then leverage technology as dual-use. By focusing on commercialization up front, the DBX accelerator program is focused on improving product innovation that benefits both national security and the companies supporting it.

“This experiment is an important effort for the electronics technologies industry,” said Nathan J. Edwards, USPAE’s executive director. “If we prove it successful, we can radically change the funding process so that it encourages innovation and participation from a broader range of companies.”

DBX will conduct an open solicitation for proposals, describing the selection criteria for qualified electronics technologies and materials. Proposals will be reviewed and ranked.

Top finalists will be invited to the Defense TechConnect Innovation Summit & Expo conference in November to pitch a panel of industry, government, and investment experts. A review panel of subject matter experts will select the awardees who will each receive between $500,000 and $2 million.   

The DBX process flips the current model for how DoD typically awards contracts, where funding usually focuses on a DoD solution with hopes that the solution will be commercialized so that DoD can buy it again and again. Unfortunately, the current model often does not work, necessitating DoD reinvestment.

To execute DBX, USPAE is partnering with ATI, which leads federal technology R&D collaborations, and specifically ATI’s TechConnect Division, a global research and innovation organization connecting funders and emerging technologies. In addition, USPAE is employing the company Fluent to provide a “fluency score” to quantitatively measure the success of this new way for the DoD to advance technologies.

"We have witnessed firsthand in the private sector how commercialization programs leveraging crowd-sourced, non-traditional technologies have significantly expedited their development while enhancing the strength and capability of the Department of Defense," said Matt Laudon, vice president of the TechConnect Division at ATI.

"We are enthusiastic about partnering with USPAE to extend this successful model to the public sector, eagerly anticipating the force multiplying effect that the infusion of $10 million in prize money, in parallel to related partnering and industry exposure will have on accelerating early-stage innovation," Laudon added.

“Innovative technological ideas span companies of all sizes, but not all companies can afford the traditional process to work with the public sector,” said Christopher Zember, senior fellow for Industrial Base Resilience, who is supporting DoD as the architect and lead for this project. “DBX is a program that can open doors for more companies by providing the seed funding to grow their ideas.”

Interested parties can sign up for updates and learn about DBX on TechConnect’s website, where they can also find more information under https://events.techconnect.org/DTCFall/DBX/.

North American PCB Industry Sales Down 26 Percent in August

IPC Releases PCB Industry Results for August 2023

IPC announced today the August 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00.

Total North American PCB shipments in August 2023 were up 26.4 percent compared to the same month last year. Compared to the preceding month, August shipments were down 35.7 percent.

PCB bookings in August were down 29 percent compared to the same month last year. August bookings were down 36.8 percent compared to the preceding month.

“August PCB results were weak, with both orders and shipments failing,” said Shawn DuBravac, IPC’s chief economist. “While the book-to-bill remains balanced, levels are well below the recent trend.”

August 2023 PCB book to bill ratio chart 1
August 2023 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Up 2.9 Percent in August

IPC Releases EMS Industry Results for August 2023

IPC announced today the August 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.27.

Total North American EMS shipments in August 2023 were up 2.49 percent compared to the same month last year. Compared to the preceding month, August shipments increased 8.9 percent.

EMS bookings in August increased 13.7 percent year-over-year and increased 8.2 percent from the previous month.

“The EMS industry saw good growth in both orders and bookings this month which kept the book-to-bill in line with recent months,” said Shawn DuBravac, IPC’s chief economist.

August 2023 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.