Test Methods to Validate Acceptable Levels of Flux and Other Process Residues on Production Assemblies

Date
- (12:00 - 1:00pm CST)

Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.

This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.

Mike Bixenman, DBA

Speaker Bio

Dr. Mike Bixenman, Chief Technology Officer (CTO) and co-founder of KYZEN Corp. and Magnalytix, LLC, has over 30 years of experience designing electronic assembly cleaning materials and process integration. Sharing his research, knowledge, and expertise is Mike’s passion. He believes in the power of collaboration by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA).

B2B Meeting Registration, India (Bengaluru)

Date
- (Jul 28, 2024 | 11:00pm - Jul 29, 2024 | 5:00am CDT)

This Form is for Indian Companies only

Please Provide Below Details

Status message

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Venue : Taj Yeshwantpur, Bengaluru
B2B Meeting Venue - Direction click here

 

Registrations are closed,
For more information,
Please contact Mr. Abhishek K. Upadhyay
contact no +91 9313224509

 

International Companies @ B2B Meeting

 

IPC

Printed Circuit Board Assemblies and Box Build Assemblies

 

IPC

Integrated Solutions for mobile devices

 

IPC

Industrial hazardous waste with  (ESM) facility

IPC

Manufacturing high technology Flexible PCBs (FPC) & IC substrates 

 

IPC

 

UAE Space Agency 

IPC

The #1 electronics supply chain AI-powered suite for EMS and OEMs

 

IPC

 

Electronics Manufacturing Services & PCB manufacturer  

IPC

Electronic consumables, wide range of machinery and materials to the PCB, Semiconductor, SMT, Robotics 

IPC

 

Soldering Products & Solutions 

IPC

 

Wire Harness, Material process, Engineering Support 

IPC

Production and distribution of metal jointing materials for electronics (solder, flux, brazing alloys, etc.) 

IPC

Printed circuit assembly (Sensor, box building, power, module, hermatic module), PCB manufacturer, Chip & wire bonding  

IPC

CNC, Tooling Design & Moulding Fabrication, Plastic Injection Moulding, Aluminium Die Casting 

IPC

 

Film Capacitors, CPM - Probes,  EEMB Battery, E-Xing - Probes, M&E Connectors 

 

IPC

ODM of Custom-Embedded Electronic Components and Products 

IPC

 

Cleaning Chemistry Manufacturer 

IPC

 

Repair service 

IPC

Distributor and Supplier - Electronics Components & Supplies  

IPC

 

Design Manufacturing of Cable, Wire Harnesses 

IPC

 

Soldering Robots 

IPC

 

Electronics Manufacturing Services

IPC

Industrial Quality Solutions, Research Microscopy Solutions, Medical Technology, Vision Care and Sports & Cine Optics 

IPC

 

Soldering Stations 

IPC

 

Soldering station, Rework station, Hand tools, ESD & Electronics supplies  

IPC

PCB Design and Embedded Technology  

IPC

Robotic Soldering Machine 

IPC

Manufacturing of Wire and Cable Harnesses 

IPC

 

Exporting and Investing in Australia

IPC

Producing Soldering Materials for Electronics Manufacturers 

IPC

 

Capacitor Applications 

B2B Meeting Registration, Penang ( MALAYSIA )

Date
- (Jul 23, 2024 | 9:00pm - Jul 24, 2024 | 3:30am CDT)

This Form is for Malaysian Companies only

Please Provide Below Details

Status message

Sorry...This form is closed to new submissions.

Venue : Setia Spice Convention Centre, Penang
B2B Meeting Venue - Direction click here

International Companies @ B2B Meeting

IPC Producing Soldering Materials for Electronics Manufacturers

IPC

Die Casting, Conduit Nuts, Pipe Plugs and Connectors

IPC

Distributor of Electronic Components - MLCC

IPC

 

Electronic Manufacturing Services, PCB assembly

IPC

 

Fluid Dispensing and UV Curing technology provider

IPC

Vision Technologies, processors, cameras, lens, lighting, and accessories

IPC

Surface treatment & nano-coating solutions; bonding, painting, printing or coating

IPC

 

Provide Advanced Gas Purification Technologies

IPC

 

Semiconductor Equipment Solutions

IPC

 

Distributor Electronics components

IPC

 

Electronics Tool Suppliers

IPC

Fabless chip design companies, Software Platform, Invests in high technology

IPC

Electronic Manufacturing Services, PCB assembly

IPC

 

Ultrasonic Cleaner

IPC

Soldering System with a complete tooling range. Rework any size of SMD components

IPC

Electronics tool suppliers Ultrasonic, Microbubble Device

IPC

 

Flux Chemicals

IPC

Manufacture Custom Printed Circuit Boards (PCB)

IPC

Robotic Soldering and Laser Soldering

IPC

Manufacturer in the Wire and Cable industry

IPC

 

Repair Solutions

IPC

Lead in innovative software solutions for the financial services industry

IPC

Manual Visual Inspection of complex semiconductor substrates, laminates and lead frames

IPC

 

Comprehensive Lighting Solutions

IPC

Fabless semiconductor company specializing in Reference Clocks and Timing ICs

IPC

 

Computer Communications

IPC

 

Innovative partner for customised solutions

 

IPC

 

EMS Companies 

Vacuum pads and holders, nozzles for electronics

 

 

 

Materials Costs Continue to Improve but Labor Costs Remain a Pain Point for Electronics Manufacturers

IPC Releases November Global Sentiment of the Electronics Supply Chain Report

Electronics industry sentiment improved during November with demand sentiment also taking a solid step up over the last 30 days per IPC’s November 2023 Global Sentiment of the Electronics Supply Chain Report.

And though materials costs continue to improve, labor costs remain a pain point. Three-fifths (62 percent) of electronics manufacturers say they are currently experiencing rising labor costs.

“In this month’s survey, we asked a special question about PCB and EMS production growth,” noted Shawn DuBravac IPC chief economist. “Electronics manufacturers believe the U.S. should adopt strong goals for production growth.” For the PCB sector, roughly 85 percent of respondents reported the five-year goal should be above current levels and the average suggested goal was 9.3 percent of global production. For the EMS sector, roughly 70 percent of respondents indicated a five-year goal above current levels. On average, respondents indicated the EMS industry should target 12.9 percent of global production by 2028 and 17.4 percent of production by 2033.  

Additional survey data show:

  • The New Order Index rose five points to 105 after hitting the lowest level for this index.
  • The Materials Cost Index fell to another new low, dropping four points to 118. The Labor Costs Index rose one point to 130 after declining for two consecutive months.
  • Shipments, orders, capacity utilization, backlogs and profit margins are expected to rise over the next six months, while all other key business indicators are expected to remain relatively stable.

For the report, IPC surveyed hundreds of companies from around the world, including a wide range of company sizes representing the full electronics manufacturing value chain.

View full report.

U.S. Partnership for Assured Electronics Awards Nearly $10 Million to 7 Microelectronics Firms

Seven microelectronics firms received nearly $10 million in combined funding to commercialize technologies of interest to the U.S. military services as winners of the Defense Business Accelerator (DBX) Microelectronics Challenge. This groundbreaking initiative is funded by the Department of Defense (DoD) and led by the U.S. Partnership for Assured Electronics (USPAE).

The challenge aims to revolutionize how the DoD drives the development of dual-use technology, which can be used for both civilian and military applications. The challenge is testing the hypothesis that the DoD can accelerate growth of a robust domestic industrial base by focusing its resources on commercialization of early-stage, hardware-intensive technologies and then scaling them into resilient businesses in partnership with private capital.

The DBX Microelectronics Challenge offered an unprecedented opportunity for advanced technology innovators to vie for funding of up to $2 million each to further commercialize their emerging technologies. The winning companies also will receive commercialization support through an ongoing accelerator program, which includes one-on-one coaching, access to resources and more. The accelerator program’s goal is to not only mature the technology but also scale the domestic business to fill critical gaps in the microelectronics supply chain.

After rigorous evaluation of 279 submissions received via an open solicitation, 25 finalists pitched their groundbreaking ideas at the Defense TechConnect Innovation Summit on November 28. A distinguished panel of industry experts, investors and a DoD representative judged the presentations, selecting the following seven challenge winners for a combined $9.6 million in funding:

  • Freedom Photonics LLC ($1,500,000)
  • Gigantor Technologies ($2,000,000)
  • Momentum Optics ($1,675,000)
  • Mosaic Microsystems ($1,000,000)
  • PseudolithIC, Inc. ($1,000,000)
  • SiliconCore Technology, Inc. ($1,675,000)
  • Soctera, Inc. ($750,000)

“Typically, the timeline from selection to contract award and receipt of funding is several months. DBX leverages the flexibility of Other Transactions Authority (OTA), along with some innovative structuring of the OTA agreement, to enable awardees to receive funding within 48 hours of their selection at the pitch event,” said Christopher Zember, senior fellow for Industrial Base Resilience who is supporting DoD as the architect and lead for this project.

The collaboration between USPAE, a non-profit organization with members spanning the electronics ecosystem, and the DoD’s Manufacturing Capability Expansion & Investment Prioritization Directorate (MCEIP) has been instrumental in driving this initiative forward. Tactical support from Advanced Technology International (ATI), and specifically its TechConnect division, has further fortified the success of the DBX Microelectronics Challenge. To help awardees advance their efforts, Fluent is providing each with key metrics from commercialization assessments and tools for business development.

“We’re honored to move the area of microelectronics forward with this funding and the ongoing accelerator program that we’ll make available to the winners over the next eighteen months,” said Nathan Edwards, executive director of USPAE. “The outcome will be faster access to dual-use technologies for which the military services already have a validated interest.”

WHMA Announces Call for Nominations for Recognition Awards

The Wiring Harness Manufacturer’s Association (WHMA) is accepting nominations for three recognition awards — Hall of Builders, Hall of Fame and Volunteer Excellence. The Hall of Fame and Volunteer Excellence awards will be presented at WHMA’s Annual Global Leadership Summit in February, and the Hall of Builders award will be presented at the Electrical Wire Processing Technology Expo (EWPTE) in May. Nominations require a candidate’s first and last name, company name, award category and reason for nomination.

The WHMA Hall of Builders award honors individuals from WHMA-member companies who have made significant contributions toward advancing the cable and wire harness industry. Hall of Builders inductees are industry veterans, leaders and mentors who are retiring from active service/employment, but whose legacies live on in wire and cable industry today.

The WHMA Hall of Fame is bestowed upon an individual in recognition of extraordinary contributions with broad significance to the cable and wire harness industry and distinguished service to WHMA. The nominee must support the advancement of the industry, consistent with the goals and mission of WHMA. This is the highest level of recognition WHMA can give to a member and is based on exceptional merit over the long term.

The WHMA Volunteer Excellence Award honors individuals from WHMA-member companies who have demonstrated ongoing leadership in WHMA activities and have contributed significant time and talent to the association and the cable and wire harness industry.

Submit your nominations online by December 21, 2023, at https://whma.org/recognition. For more information/questions on nomination requirements, email contact.us@whma.org

WHMA’s Annual Global Leadership Summit Offers Technical Education Workshop on Strategic Practices for Success

Participants will learn how to benefit from lucrative federal programs

Tyler Noesser, senior technical director at alliantgroup, a tax and business consultancy, will present a technical education workshop, “Strategic Practices for Success: Outpacing Competitors, Optimizing Bids and Nurturing Top Talent,” on February 13, 2024, from 3:00-5:00 pm, at WHMA's Annual Global Leadership Summit in Myrtle Beach, S.C.

Noesser will lead an interactive discussion on trends in the industry and provide practical advice on practices that manufacturers can implement immediately. He will detail recent legislative updates to powerful credits and incentives that have helped WHMA members claim millions in federal funds. Noesser will explain how these changes apply to wire harness manufacturers and how they can benefit from these lucrative federal programs.

“In today's competitive market, businesses must be strategic in their approach to remaining competitive, lowering bids, and retaining skilled workers,” said David Bergman, WHMA executive director. “We look forward to learning how the alliantgroup, can help company owners in the cable and wire harness industry take full advantage of federal and state tax credits, incentives, and deductions in order to successfully compete both in the U.S. and abroad.”

For more information on the leadership summit including schedule, exhibition, speaker profiles, sponsorship opportunities, or to register for event, visit https://annualconference.whma.org.

Statement of Support from IPC for New Actions to Strengthen America’s Supply Chains, Lower Costs for Families, and Secure Key Sectors

Statement attributed to Chris Mitchell, IPC Vice President of Global Government Relations

IPC welcomes the actions outlined today by the U.S. Government “to strengthen supply chains critical to America’s economic and national security.”

The COVID-era disruptions experienced by the U.S. electronics manufacturing industry spotlight the extent to which the United States has outsourced its industrial base impacting everything from automobiles to aircraft to consumer products. The investments being made under the CHIPS and Science Act, Defense Production Act, and Inflation Reduction Act must cover more than just a few key products such as semiconductors – they also need to include the full electronics manufacturing system that enables semiconductor chips to function including printed circuit boards (PCBs) and integrated circuits (IC) substrates.

We are pleased to see today’s actions complementing last week’s announcement of a National Advancing Packaging Strategy. In addition, IPC welcomes the creation of a Cabinet-level Council on Supply Chain Resilience and a new quadrennial review process to ensure a comprehensive approach to this vital issue. We also applaud the actions to solidify the U.S. defense industrial base and the emphasis on international cooperation.

 

North American PCB Industry Sales Up 3.9 Percent in October

IPC releases PCB industry results for October 2023

IPC announced today the October 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.97.

Total North American PCB shipments in October 2023 were up 3.9 percent compared to the same month last year. Compared to the preceding month, October shipments were up 6.3 percent.

PCB bookings in October were up 14.9 percent compared to the same month last year. October bookings were down 8.7 percent compared to the preceding month.

“PCB shipments for October were slightly better than expectations,” said Shawn DuBravac, IPC’s chief economist. “Weaker orders for the month suppressed the book-to-bill. Orders over the last three months are 20 percent below last year's levels.”

October PCB book to bill chart 1
October 2023 PCB book to bill ratio 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.