The Global Electronics Association is urging the European Commission to expand the scope of the EU Chips Act, warning that the current focus on semiconductor fabrication alone leaves Europe exposed to significant supply chain vulnerabilities for critical European industries. In its contribution to the Commission’s review of the Chips Act, the Association stresses that Europe cannot achieve technological resilience without rebuilding the full electronics value chain, including system level packaging, especially Printed Circuit Boards (PCBs), PCB Assemblies (PCBAs), and final assembly and test.

The Association notes that Europe’s capability to manufacture these essential technologies has eroded dramatically over the past two decades, creating critical dependencies on non-EU suppliers. This trend undermines Europe’s economic security and threatens the competitiveness of industries such as defence, automotive, AI data centres, and industrial automation—sectors that rely heavily on high-performance, trusted electronics systems. While the Chips Act has stimulated progress in semiconductor fabrication, it has not addressed the downstream capabilities needed to translate chips into finished, deployable technologies.

To reverse this decline, the Global Electronics Association is calling for a broader, silicon-to-systems strategy that complements the existing Act. This includes dedicated EU funding for system level packaging, especially PCB, PCBA, and final assembly and test; simplified financial support for small and mid-sized electronics manufacturers; and the creation of a permanent dialogue between industry and policymakers to identify gaps and coordinate action. The Association is also urging the EU to introduce a comprehensive European Electronics Strategy aligned with defence readiness and economic security objectives.

The Chips Act was an important first step, but Europe must now address the full electronics ecosystem. Without strengthening system-level manufacturing capacity, the EU risks building world-class chips that cannot be integrated into systems made in Europe—limiting resilience, innovation, and strategic autonomy. 

View full position and recommendations.

For further information contact Alison James, senior director, European Government Relations and for technical expertise, Dr, Peter Tranitz, senior director, Technology Solutions.

by Chris Mitchell, chief advocacy officer 

As the 2026 review of the U.S.–Mexico–Canada Agreement (USMCA) approaches, U.S. policymakers have a rare chance to reinforce a North American partnership that drives our shared competitiveness, resilience, and long-term growth.

Yesterday, I had the privilege of delivering that message on behalf of Global Electronics Association members at a public hearing of the U.S. International Trade Commission in Washington. I was proud to represent the interests of our 1,700 North American member companies — leaders, innovators, and manufacturers whose work powers modern life. The Association has also formally submitted comments to the U.S. Trade Representative and shared our perspective broadly across agencies and stakeholders.

At its core, my message was simple:

• We are “all in” on the USMCA, or any comparable or improved successor pact, because predictable, rules-based trade is good for our members, good for North America, and good for the world.
• Under USMCA, the growth of electronics manufacturing in Mexico and Canada has strengthened U.S. electronics production by creating a deeply integrated regional supply base in which all three countries play essential roles. Those connections are real and measurable.
• Collaboration among companies across countries constitutes the backbone of how our companies design, build, and deliver advanced technologies every day.

Our recent report, Why Mexico Matters to U.S. Manufacturing, illustrates this clearly. In electronics, 67% of U.S. imports from Mexico and 48% of U.S. exports to Mexico are intra-firm. That means real companies moving real components across borders in coordinated production systems. Aerospace, defense, motor vehicles, medical devices, semiconductors—they all rely on this integrated ecosystem.

Mexico has become a vital production hub and re-export platform for electronics, making tariff-free access essential to our competitiveness. Canada contributes world-class R&D, semiconductor and aerospace capabilities, and deep integration with U.S. defense and clean-energy manufacturing. More than half of electronics imports from Canada go directly into U.S. production of finished goods.

This is a partnership that makes the United States — and North America — stronger. As the Trump Administration considers next steps on North American trade policy, the Association urge them to:

• Maintain tariff-free access for USMCA-compliant trade.
• Ensure workable rules of origin for complex, high-value production. Electronics components often cross the U.S. border multiple times before reaching the final customer.
• Focus enforcement on stopping circumvention—without disrupting legitimate, integrated production.
• Invest jointly with Mexico and Canada in workforce, innovation, and infrastructure to strengthen our shared competitiveness.

The stakes could not be higher. If the 2026 review goes off-course, billions in investment, tens of thousands of jobs, and North America’s technological leadership could be put at risk. That’s why I was proud to work with small and large companies across North America’s electronics industry to present a clear and constructive industry position to the Commission at this critical moment.

The Global Electronics Association will continue working closely with our member companies and the governments of all three countries to strengthen the ecosystem that keeps innovation, jobs, and manufacturing leadership anchored in North America.

View full testimony. 

Welcome to Industry Intelligence Insights, your monthly briefing on the trends, risks, and opportunities shaping the global electronics manufacturing ecosystem. I’m Thiago Guimarães, Director of Industry Intelligence at the Global Electronics Association, and I’m pleased to share this end-of-year edition.

First, this month’s market analysis from Chief Economist Dr. Shawn DuBravac shows that economic momentum is softening across major regions and maps a world moving into a late-cycle slowdown.

Also in this issue, you’ll find the newest PCB and EMS Book-to-Bill results, fresh sentiment data from our monthly Global Survey, and insights into how manufacturers are navigating inflation, tariffs, power constraints, and shifting production footprints. 
We also highlight new resources, including the Double Materiality Assessment Toolkit, plus a recap of the latest EMS & The Economist episode.
Read on for a data-driven look at how the electronics industry is adapting to a slowing but still opportunity-rich global environment.

Thiago Guimarães 
Director of Industry Intelligence, Global Electronics Association

Market Analysis from Global Electronics Chief Economist Shawn DuBravac

Economic momentum is clearly slowing across major regions, with elevated inflation, geopolitical pressures, and policy uncertainty shaping conditions. The United States remains above water but is cooling, Europe is expanding only modestly with clear manufacturing weakness, and Asia shows a widening split between a contracting Northeast Asia and still-robust South and Southeast Asia.

UNITED STATES

The United States entered the shutdown period on reasonably solid footing, but the 43-day federal closure has added new friction to an economy that was already slowing. President Trump signed a funding bill on November 12 that ended the longest shutdown in U.S. history. CBO estimates that a disruption of this scale trims about 1.5 percentage points from Q4 growth, then adds back roughly 2.2 percentage points in Q1 2026, while leaving a permanent $11 billion dent in real GDP. The impact is small relative to a $30 trillion economy but still represents a self-inflicted drag. Although data releases have resumed, many remain delayed, making the near-term picture less clear.
Before the shutdown began, growth appeared resilient. The BEA cancelled its usual October 30 advance Q3 GDP estimate, but the Atlanta Fed’s GDPNow model, as of December 1, projects real GDP growth of about 3.9% for Q3 at an annual rate, pointing to a still solid expansion heading into the fall.

Monetary policy has shifted toward a gentler stance. The Fed has already cut rates twice and markets expect a third cut at the December 9–10 FOMC meeting. With inflation still above target, the Fed is moving cautiously, but the overall stance has transitioned from higher for longer to early-stage easing. The Fed also ended balance-sheet runoff on December 1, which helps ease long-term financing conditions by taking pressure off yields and credit spreads.

Labor-market data show a gradual cooling. The delayed September jobs report, released November 20, showed payrolls rising by 119,000 while the unemployment rate edged up to 4.4%, the highest in nearly four years. Hiring remains concentrated in health care, social assistance, and leisure and hospitality. Manufacturing continues to weaken, shedding 6,000 jobs in September and marking its fifth consecutive monthly decline.

Households are becoming more cautious. The Conference Board Consumer Confidence Index fell for the fourth straight month in November to 88.7, the lowest since April. Retail spending is softening as well: September sales rose only 0.2% after stronger gains in July and August. High-income households are still spending, with restaurant sales up about 0.7%, but lower-income households are pulling back as food, rent, and tariff-related price increases tighten budgets.

Manufacturing activity remains under pressure. The ISM Manufacturing PMI stayed in contraction in November at 48.2, the ninth straight month below 50. Regional Fed surveys present a mixed but not uniformly negative picture: Kansas City and Texas report signs of renewed output growth, while Richmond and Philadelphia continue to struggle with weak demand and soft orders.

Inflation remains stubbornly high. CPI through September shows prices up about 3% year over year and 0.3% month over month, with producer prices also rising 0.3% on the month, largely due to energy. Core PCE, the Fed’s preferred gauge, is running around 2.9% year over year, and the delayed September reading due December 5 is likely to show similar levels. Persistent inflation justifies gradual rate cuts rather than aggressive easing.

Taken together, the U.S. economy remains above water and continues to grow, but the backdrop looks increasingly late-cycle. Inflation is stuck near 3%, the labor market is softening, and both consumers and manufacturers are turning more cautious. The combined effects of tariffs and the record shutdown have added uncertainty, even as the Fed begins to ease policy in a steady and deliberate way.

EUROPE

Europe continues to grow, but only slowly, and the labor market remains relatively solid. In the euro area, GDP rose 0.2% quarter on quarter in Q3 (0.3% in the EU) and 1.4% year on year (1.6% in the EU), a slight pickup from Q2. Employment also increased modestly, rising 0.1% q/q and 0.5% y/y in the euro area, with similar or slightly stronger gains across the EU. The region remains in a slow-growth rather than recession regime, which helps explain why the ECB is not rushing into further rate cuts despite persistent manufacturing weakness.

Policy has been deliberately steady. On October 30, the ECB left all three key policy rates unchanged, noting that inflation is now close to its 2% medium-term target and that growth has been modest but resilient. The central bank is signaling a steady-for-longer stance that supports planning and financing conditions, but it also means manufacturers should not expect quick rate cuts as a backstop.

Manufacturing, however, continues to soften. The HCOB Eurozone manufacturing PMI fell to 49.6 in November from 50.0 in October, slipping back below the 50 “no change” line and hitting a five-month low. New orders and export orders declined again, and factories cut jobs at the fastest pace in about seven months while running down inventories.

These pressures are concentrated in the region’s two largest economies, both still in outright manufacturing recession. Germany’s manufacturing PMI fell to 48.2 in November from 49.6, a nine-month low, with new orders declining at the fastest pace in ten months and export demand weak across Asia, Europe, and North America. France’s PMI dropped to 47.8 from 48.8, extending a long stretch of shrinking factory orders, with output falling faster and manufacturing employment declining for the first time since April.

Hard data offer a slightly more mixed signal. Euro area industrial production rose 0.2% m/m in September and 1.2% y/y after a sharp August drop, while EU-wide output increased 0.8% m/m and 2.0% y/y, suggesting a tentative stabilization. In Germany, the real stock of manufacturing orders rose 0.6% in September after an even stronger August increase, although survey data still point to softening demand, indicating the recent improvement in hard data may be fragile.

Inflation dynamics provide some relief. Eurostat’s flash estimate puts euro area HICP inflation at 2.1% in October, down from 2.2% in September and essentially back at the ECB’s target. Producer prices fell 0.1% m/m in September and were 0.2% lower than a year earlier, with energy prices down sharply. Input cost pressures for manufacturers have eased significantly relative to the energy-crisis peak, giving factories breathing room even as orders soften.

Energy markets reinforce that relief. Benchmark TTF natural gas prices are around €28/MWh, down roughly 11% over the past month and more than 40% from a year ago, reaching their lowest levels since mid-2024. Europe remains the main destination for record U.S. LNG exports, and high storage levels are keeping prices contained. Compared with 2022, European industry is now operating with far more normal energy costs, an important tailwind for energy-intensive sectors even in a weak demand environment.

ASIA

China’s recovery lost momentum in late fall, with both manufacturing and services slipping back into contraction. The official manufacturing PMI edged up to 49.2 in November but stayed below the 50 threshold for the eighth straight month. The Caixin/S&P Global manufacturing PMI, which reflects smaller, private, and export-oriented firms, also slipped just under 50 as orders and output weakened. Taken together, the data point to a broad but shallow contraction that confirms China remains the main drag on Asian manufacturing.

Price indicators reinforce this picture of weak demand. Headline CPI finally turned positive at 0.2% year over year in October after months of mild deflation, and core CPI held at 1.2%. But producer prices were still down 2.1% year over year, a narrower decline but still signaling weak pricing power at the factory gate. Conditions remain challenging for heavy industry and exporters that face both soft global demand and ongoing tariff pressures.

Activity data also cooled. Industrial output and retail sales in October grew at their slowest pace in more than a year, and officials explicitly cited weak domestic demand as the primary constraint. The combination of soft consumer spending, fragile corporate margins, and external headwinds continues to weigh on overall momentum.

Even so, the slowdown is not uniform. Output in equipment manufacturing rose 8.0% year over year in October, and high-tech manufacturing grew 7.2%, both outpacing overall industrial growth. The PMI for high-tech manufacturing remained slightly above 50 for the tenth consecutive month, indicating continued expansion in segments aligned with China’s strategic industrial priorities.

Despite softer October data and fading base effects, China is still broadly on track to meet its “around 5%” growth target for 2025, although the risks are tilted to the downside given weak demand, persistent price pressures, and ongoing trade frictions.

Across the rest of Asia, manufacturing conditions have improved markedly, but the region continues to run at two speeds. The aggregate S&P Global Asia manufacturing PMI rose to about 53.0 in November, the highest in thirty-eight months, signaling broad expansion. Yet this strength is uneven. China, Japan, South Korea, and Taiwan remain below 50 and still in contraction, while India and much of Southeast Asia are firmly in growth territory.

Southeast Asia remains the standout performer. The S&P Global ASEAN Manufacturing PMI (covering Indonesia, Malaysia, Myanmar, the Philippines, Singapore, Thailand, and Vietnam) climbed to 53.0 in November, up from 52.7 and the third-highest reading in the series’ history. New orders and output are among the strongest on record, although export orders are softer and firms remain cautious about hiring. Rising backlogs and firmer cost pressures point to capacity being stretched. ASEAN continues to be the primary manufacturing beneficiary of supply-chain diversification and tariff-driven reshoring out of China.

India also remains a major driver of regional momentum, although its pace has cooled slightly. GDP grew around 8.2% year on year in the July–September quarter, keeping India at the top of the global growth rankings. The November manufacturing PMI eased to 56.6 from 59.2, a nine-month low, as new U.S. tariffs weighed on export orders. Activity remains solidly expansionary but clearly off earlier highs. Industrial output rose just 0.4% year on year in October, with manufacturing nearly flat and electricity production declining; November power generation also fell year on year for a second month, an unusual pattern outside a major weather shock.

The data show an Asia-Pacific region gaining momentum overall, but with persistent weakness in Northeast Asia contrasting sharply with the continued expansion across India and ASEAN. This divergence is becoming a defining feature of the regional cycle, with supply chain realignment, tariff pressures, and domestic demand dynamics pulling the region in different directions.

The global economy is still expanding, but with less conviction than earlier in the year. As policy shifts and demand cools, the next few months will show whether this late-cycle slowdown stabilizes or deepens.

Book to Bill

PCB: October PCB Shipments Surge 24% as Bookings Soar 41%, Marking Strong Start to Q4

October PCB activity showed a major rebound, with shipments surging 24% year-over-year and bookings jumping 41%, signaling solid momentum as the industry enters Q4.

EMS: October EMS Trends Show Stabilizing Market and Building Momentum for 2026

October EMS activity points to a stabilizing market, with bookings outpacing shipments and a strong 1.26 book-to-bill ratio signaling improving demand visibility heading into 2026.

Global Sentiment

The Current Sentiment of the Global Electronics Manufacturing Supply Chain

The November 2025 Global Sentiment Report shows that while input-cost pressures remain elevated, overall sentiment is cautiously optimistic, with many EMS firms anticipating stabilization and improved demand over the coming months.

Recent Reports

Double Materiality Assessment Toolkit

The Global Electronics Association launches Double Materiality Assessment Toolkit to help companies efficiently navigate the complex reporting requirements of the Corporate Sustainability Reporting Directive (CSRD).

Articles 

Strengthening North America’s Electronics Backbone
By Chris Mitchell, Vice President, Global Government Relations

Three Top Reads from the Global Electronics Association’s Chief Communications Officer
By Carrie Sessine, Chief Communications Officer

Tariffs Will Not Solve America’s Copper Problem, Smarter Recycling Will
By John Mitchell, CEO & President, Global Electronics Association

EMS & The Economist

EMS & The Economist (November 2025) - Shutdown Shockwaves And Smarter Supply Chains

The latest EMS & The Economist episode breaks down how the record U.S. government shutdown distorted official data just as industry metrics, book-to-bill ratios, easing backlogs, and resilient defense demand, offered a clearer read on market conditions.

Social Media

The broader U.S. manufacturing sector lost 12,000 jobs in August 2025, highlighted in the latest Industry Intelligence Insights from Chief Economist Shawn DuBravac.

The U.S. electronics sector makes a bigger impact than many people realize. It adds $1.8 trillion to the economy and supports more than 5 million American jobs. These numbers demonstrate the significant impact this industry has on the country's growth and competitiveness.

Most goods moving across the border stay within the same companies and supply chains, and in electronics, those links are even stronger. Nearly all major manufacturers operate on both sides of the border, sharing production, parts, and even talent.

Upcoming Events:

• December 5, 2025 — EMS & Beyond 2025, Tallinn, Estonia: The Global Electronics Association’s Christoph Solka and Anastasia Ederer will deliver key presentations on “The Difficult Developments in the EMS Industry in Europe” and “The EMS Industry in the Baltic States,” offering data-driven insight into regional market dynamics and emerging challenges.
• March 16–19, 2026 — APEX EXPO, Anaheim, California: The Global Electronics Association’s flagship event will feature keynote addresses from IBM Quantum’s David Lokken-Toyli, futurist Zack Kass, and Association President & CEO John W. Mitchell, offering bold insights on quantum computing, artificial intelligence, and the future of global electronics innovation. Register HERE 

By Carrie Sessine, Chief Communications Officer

Work – that’s what I’ve been contemplating the last few weeks for this Top 3 Reads. Over a lifetime, people spend approximately 90,000 hours working, equivalent to just over 15 years. The day I walked across the stage, grinning and waving that diploma, I had no idea what a terrific – and challenging – “ride” working would be… the places I’ve gone, people I’ve met, and oh, the many things I’ve learned. 

For me, though, the last decade+ has been completely transformative. Think of the digital tools and applications, the speed of those, and for the last nearly three years, the introduction and uptake of AI. I’m thinking of how those 90,000 hours of work shift with increased use of robotics, autonomous systems, and AI. Read on for more: 

ISF Voices 2025: Preparing for the Robotics Workforce: Offered via the Special Cooperative Studies Project, this essay explores how humanoid robots are reshaping the future of work worldwide. 

What Factories in America Look Like: A picture’s worth 10,000 words. The Economist shows just how much the factory floor has changed, the precision, the spotless machinery, and fewer people. From the article, “…pictures are a corrective for anyone whose image of manufacturing is tinted in sepia. The factories are well-lit and clean. With its bright white rooms full of busy technicians in head-to-toe gowns, a microchip fabrication plant resembles a medical facility or the futuristic lair of a James Bond villain.”

Lifelong Learning: The Jan. 2025 report from the World Economic Forum highlighted the need for lifelong learning with the combination of technical and human-centric skills to keep up with the pace of change. 

By Matt Kelly, CTO & VP Standards & Technology, and Devan Iyer, Chief Strategist, Advanced Electronic Packaging, Global Electronics Association

On November 12, 2025, more than 200 industry leaders, including government officials, regional domestic companies, multinational companies, and academic experts, gathered at the Olive Tree Hotel in Penang for the Advanced Electronic Packaging (AEP) Workshop, organized by the Global Electronics Association. With 15 expert speakers, three technical tracks, three expert panel discussions, and strong ecosystem participation, the workshop highlighted why advanced electronic packaging is central to the future of Malaysia’s semiconductor industry.

Why Advanced Electronic Packaging Matters to Malaysia’s Semiconductor Growth

Advanced electronic packaging is now a foundational enabler for many of today’s most advanced technologies, including AI systems, 5G/6G infrastructure, electric and autonomous vehicles, IoT, and sensor fusion platforms. As performance demands increase, traditional packaging approaches are no longer sufficient for meeting power density, data transmission, thermal efficiency, miniaturization, and reliability requirements. 

This shift has accelerated the adoption of chiplet architectures, heterogeneous integration, and 2.5D/3D packaging. For Malaysia, a global hub for assembly and test, these developments represent a major strategic opportunity. The nation has built many decades of semiconductor packaging manufacturing capabilities and capacities, especially in analog & mixed signal (AMS) and power packaging technologies. This foundation positions Malaysia to expand its footprint in next-generation AMS and power packaging, while also leveraging high-performance computing (HPC) opportunities driven by AI servers, accelerators, and advanced memory technologies.

A Crucial Moment for Malaysia’s Electronics Ecosystem

Malaysia’s semiconductor landscape is shifting toward deeper technology integration and system-level innovation. Applications like EV power modules, mmWave radar, LIDAR, and AI accelerators require coordinated advances in both Component-Level Packaging (CLP) and System-Level Packaging (SLP).

As these developments accelerate, the need for new industry guidelines and globally aligned standards grows rapidly. Protecting intellectual property remains essential, but shared industry challenges require common frameworks.

New guidelines and standards are critical to:

• Strengthen supply-chain continuity and reduce disruptions
• Improve interoperability across suppliers and partners
• Ensure consistent, scalable, and reliable manufacturing
• Help maintain competitive cost structures

Malaysia’s expansion into both AMS, Power, and HPC packaging amplifies the importance of developing such standards locally and globally.

Why the AEP Workshop in Penang Was So Important

The workshop delivered deep technical insight across topics, including:

• Chip & interposer design for High Bandwidth Memory (HBM) packaging
• Chiplet and heterogeneous integration
• 2.5D/3D packaging for AI, HPC and HBM packaging
• AI-enabled assembly, inspection, and automation

Participants emphasized the value of the event’s “silicon-to-systems” approach, which mirrors the realities of today’s integrated electronics architectures, and reinforces the need for updated industry standards to support this evolution.

Strengthening Collaboration Through the MAPC Consortium

A major milestone of the event was the launch of the Malaysia Advanced Packaging Consortium (MAPC). This consortium unites government, regional domestic companies, MNCs, and R&D partners to:

• Accelerate advanced packaging capability in Malaysia
• Share R&D priorities, common challenges, best practices and strengthen ecosystem alignment
• Shape the guidelines and standards the industry urgently needs

Looking Ahead

As global technology advances, advanced electronic packaging and strong industry standards will define the next era of electronics manufacturing. The Penang AEP Workshop showcased Malaysia’s willingness to lead, building on decades of packaging strength while expanding into AMS, Power, and HPC opportunities.

The Global Electronics Association remains committed to supporting this journey through knowledge sharing, the development of guidelines and standards, and community building.