On First Anniversary of Biden Action on Defense Electronics, Cautious Optimism

Today, March 27, is the first anniversary of U.S. President Joe Biden’s “presidential determination” (PD) on printed circuit boards (PCBs), advanced packaging, and IC substrates – a milestone action by the U.S. government that has paved the way to U.S. government investments in these technologies under Title III of the Defense Production Act (DPA).

Electronics Industry Sentiment Rises in March

Sentiment among electronics manufacturers remains positive, with demand reaching the highest level in a year, according to IPC’s March Sentiment of the Global Electronics Manufacturing Supply Chain Report.

North American EMS Industry Up 4.1 Percent in February

IPC announced today the February 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.22.

North American PCB Industry Sales Down 11.6 Percent in February

IPC announced today the February 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.07.

Biden’s State of the Union Address Touches on Issues of Importance to Electronics Manufacturing

Although politics and theater may have permeated President Joe Biden’s State of the Union address on Thursday night, there were several points when the substantive interests of the electronics manufacturing industry were mentioned, from the CHIPS program to Buy American to the skilled workforce and corporate taxes.

IPC Welcomes EU R&I Focus on Advanced Materials for the Future of Electronics

The European Commission published on 27 February its Communication on advanced materials. The Communication sets out the proposed approach to develop industrial leadership from Research and Innovation (R&I) through deployment. Electronics is one of the preliminary priority sectors in terms of potential use.

Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies

IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.

North American PCB Industry Sales Down 3.9 Percent in January

IPC announced today the January 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.93.

North American EMS Industry Up 2.6 Percent in January

IPC announced today the January 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.20.

Demand Remains Positive Among Electronics Manufacturers, Labor Costs Index at Highest Level in Six Months

Sentiment among electronics manufacturers remains positive, despite minor setbacks during January, according to IPC’s February Sentiment of the Global Electronics Manufacturing Supply Chain Report.