What does “advanced packaging” mean in the context of semiconductors and electronics manufacturing? And why is it so important to the future of the world? Those are the questions answered in simple language and imagery in a new 90-second video released by IPC.

In this webinar, we will dive into the Ecodesign for Sustainable Products Regulation (ESPR) and Digital Product Passports (DPPs), providing a clear explanation of what they are and how they work.

Industry sentiment in the electronics sector declined significantly in September due to rising cost concerns and weakening demand according to IPC’s September Sentiment of the Global Electronics Manufacturing Supply Chain Report.

The latest EU Competitiveness Report, authored by former European Central Bank President Mario Draghi and released this month, is a compelling call to action that should serve as a framework for policy action in Brussels and capitals across Europe.

On a news-filled day at the Department of Commerce, IPC CEO John W. Mitchell hosted the agency’s chief export enforcement officer to speak candidly with members.

IPC announced today the August 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.

IPC announced today the August 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.27.

Last week, IPC, ITI, and the Anthesis Group partnered to host an informative one-hour webinar aimed to demystify the complexities of the EU Corporate Sustainability Due Diligence Directive (CSDDD) for the electronics manufacturing industry.

IPC announced today the July 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.

IPC announced today the July 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.21.