IPC announced today the April 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.06.

IPC announced today the April 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.42.

Leaders of IPC member companies descended on Washington, D.C. on Wednesday, May 15 for the first IPC Impact Day of 2024. IPC Impact Days are a chance for industry executives to speak directly with government officials on policies that are crucial to our industry, including investments in domestic PCBs and advanced packaging under the Defense Production Act; the need for a “silicon-to-systems” approach to the CHIPS and Science Act; and incentives for workforce training and industry certifications.

Sentiment among electronics manufacturers fell this month, after hitting a new high in April. Despite the decline, sentiment remains historically high according to IPC’s May Sentiment of the Global Electronics Manufacturing Supply Chain Report.

USPAE and IPC would like to invite you to participate in an IC substrate workshop planned for May 16, 2024, in Washington, D.C. The workshop will further IPC’s work on a U.S. Department of Defense-funded project to study and recommend approaches to addressing the country’s lack of IC substrate manufacturing capabilities.

According to IPC’s April Sentiment of the Global Electronics Manufacturing Supply Chain, April 2024 marked the third consecutive month of sentiment growth among electronics manufacturers.

Today, IPC delivered a letter to Congress signed by 49 industry executives urging them to sustain current investments in the electronics industrial base or risk putting the United States even further behind the global competition.

The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is again conducting a study on behalf of the Department of Defense to understand the issues and hurdles manufacturers face when adopting smart manufacturing technologies. That information then helps inform development of solutions to overcome those challenges and help manufacturers become more successful. You can read last year’s results here: Smart-Manufacturing-Study.pdf (auburn.edu). 

IPC announced today the March 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.31.

Today, March 27, is the first anniversary of U.S. President Joe Biden’s “presidential determination” (PD) on printed circuit boards (PCBs), advanced packaging, and IC substrates – a milestone action by the U.S. government that has paved the way to U.S. government investments in these technologies under Title III of the Defense Production Act (DPA).