IPC recently made the case for a resilient electronics manufacturing ecosystem and further investments in advanced packaging at the inaugural meeting of the European Commission’s consultation on secure supply chains.

The Consumer Technology Association (CTA), IPC, and Information Technology Industry Council (ITI) coordinated on an industry response to EPA’s proposed compliance date for PIP (3:1)-containing articles.

IPC has issued two new industry intelligence reports today: the December sentiment of the global electronics manufacturing supply chain report and the December economic outlook report.

A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic packaging ecosystem to meet increased production of semiconductor chips, without which the semiconductor supply chain is likely to remain weak and vulnerable. 

To help IPC member companies cut through the noise and confusion surrounding the CMMC update, IPC is hosting a free, one-hour webinar on Thursday, December 9 at 1:00 pm EST.

On November 4, the U.S. Department of Defense (DoD) unveiled a much-anticipated update to its Cybersecurity Maturity Model Certification (CMMC) program — called CMMC 2.0 — and electronics manufacturers will want to take note of the changes.

EPA extends PIP (3:1) compliance date.

IPC Concerned over EEE Criteria in EU Sustainability Regulation

On September 27, IPC submitted comments on a proposed rule from the U.S. Environmental Protection Agency (EPA) on reporting and recordkeeping requirements for per- and polyfluoroalkyl substances (PFAS) under the Toxic Substances Control Act (TSCA).

Themes that IPC's Chief Economist Shawn DuBravac offered last month continue to play out. Global demand remains strong, but the economic environment is softening. We are starting to see some early signs that demand is slowing.