Technical Session on Hand Soldering
IPC Day EMS Europe - Gdansk, Poland - Wednesday, 25 September 2024
We are delighted to welcome expert panelists to discuss what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top 3 challenge areas beyond current regulatory reporting and what may be coming next.
We are delighted to welcome Brian O'Leary of Indium to discuss the impact of the Software Defined Vehicle on hardware design and manufacture.
We are delighted to welcome Dr. Habib Mustain of Hereaus to discuss power electronic substrate types, requirements, and challenges for today's EV applications.
In conjunction with Electronics Manufacturing Expo Asia (EMAX) 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Penang, Malaysia July 24-26, 2024. The competition welcomed 36 contestants from 14 well-known electronics companies, and one institution in Malaysia.
Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue. Following a presentation on the current EMS market and revenue tiers in the industry, participants will discuss how to reach the next level and grow their business. The discussion will pull from direct experience, questions, and ideas. From there, the conversation goes where you, the leaders, take it. Every roundtable ends with unique takeaways.
From July 8-10, the 2024 IPC Masters Competition China was successfully held in Pudong, Shanghai. This year’s competition, was the largest in the history of the Greater China region, bringing nearly 400 electronics industry elites from 18 provinces and municipalities. The event covered diverse industry sectors, including aerospace, automotive electronics, rail transit, consumer electronics, energy, and industrial manufacturing.
Discover the newest innovations and hear from the best minds in the electronics manufacturing industry. IPC APEX EXPO 2025 will be our industry’s largest event in North America featuring a world-class trade show, professional development courses taught by industry experts, non-stop networking and more! Join us in Anaheim, California, March 15-20, 2025.
The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.