Controlling ionic contamination is a long‑established element of electronic assembly reliability. In automotive electronics manufacturing, ROSE (Resistivity of Solvent Extract) testing is widely used and is generally regarded as sufficient once a manufacturing process has been qualified through electrical testing under damp-heat conditions. At the same time, ionic chromatography (IC) offers far greater analytical resolution, prompting discussion of its potential benefits and drawbacks.
Building on a recent technical session at AEPC 2026, this panel examines the role, limitations, and appropriate use of IC analysis in ECU manufacturing.
Join the world’s leading environmental regulatory experts at IPC and ITI’s virtual 2021 Critical Environmental Requirements for Electronics Conference for updates on the latest environmental requirements that could impact your product’s design, manufacturing, supply chain management, and technology innovation.
Focusing only on the cool technology in design limits product success. Having a broad knowledge of the entire product life cycle – from cradle to grave – dramatically improves product quality, reliability, and even productivity.
Design for Excellence (DfX) is based on the concept that optimizing a product starting early in design is far more effective than fixing problems later. In this webinar, we’ll explain how to use the DfX concepts of Design for Reliability, Design for Manufacturability, Design for Environment, Design for Testability, etc., to not only reduce research and development costs but also improve quality and decrease time to market. Understanding DFX concepts is critical for anyone who wants to design and build robust, profitable products. We’ll also discuss a few common barriers and mistakes along with some practices you can implement right away.
Finally, our new book, Design for Excellence in Electronics Manufacturing, offers detailed help covering everything from product ideation to field use. The book shares valuable lessons learned from the real experience including how to select materials for the environment, where to get guidance, and how to use modeling tools to predict product performance. It also helps people spend their test budgets in the best possible way.
Can't make the live session? No problem! Register and you will receive a recording this presentation via email.
Data-driven manufacturing is revolutionizing the industry, improving quality, productivity and agility, while also decreasing production costs and ordering lead-times. In sectors requiring a very high degree of security within manufacturing and of product data, the adoption of Smart Manufacturing solutions has been severely limited. As a result, many companies in the electronics manufacturing industry, especially those in high-security sectors, are left with an increasing gap in terms of competitiveness, leading to relatively increased costs and a lack of flexibility.
IPC Connected Factory Exchange (IPC-CFX), an open industry standard for shop floor communication, provides a whole new mechanism of secure data transfer, as well as the ability to securely bridge the “air-gap” between the operational shop floor and secure business systems.
In this webinar, we will explain the issues around internal factory security and how any company can leverage the secure encryption and standardized equipment messaging of IPC-CFX in security-critical manufacturing environments to support Smart Industry 4.0 initiatives and data collection and analysis, without risk of compromise.
Can't make the live session? No problem! Register and you will receive a recording this presentation via email.
This webinar will provide an overview of the new one-time EPA reporting rule on PFAS under the Toxic Substances Control Act. The new rule will have a significant impact on electronics producers and importers, because of (a) the widespread use of PFAS within the electronics supply chain; (b) the very expansive definition of PFAS in the rule, which includes commonly used polymers; and (c) EPA’s decision to include imported articles within the scope of the rule.
IPC has developed an annual international networking forum in India RegionIntegrated Electronics Manufacturing & Interconnections (IEMI). The two-day, two-city event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services
IPC has developed an annual international networking forum in India Region Integrated Electronics Manufacturing & Interconnections (IEMI). Event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services
Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.
This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.
Skilled soldering experts will be competing for 60 minutes on a complex circuit board assembly to win the 2024 National title, and earn a cash prize and a chance to compete at the IPC Hand Soldering World Championship.