Ball Grid Array (BGA) defects pose significant challenges in circuit board assembly. The IPC guidelines provide a foundational framework for inspection, yet they may not encompass all scenarios effectively. Leveraging the latest advancements in 3D Computed Tomography (CT) technology allows for a detailed examination of each solder ball, facilitating a precise identification of common defects such as voiding, non-wetting, and head-in-pillow phenomena. Through this approach, engineers can conduct a thorough root cause analysis, enhancing the reliability of electronic assemblies.
Join fellow EMS leaders in the region to discuss key performance indicators and share industry pain points and solutions.
Join fellow EMS leaders in the region to discuss key performance indicators and share industry pain points and solutions.
Join fellow EMS leaders in the region to share industry pain points and solutions.
Bring your questions for this expert panel to explore how your organization can mirror these successes and make training a central lever for growth—not just compliance.
Turning Supply Chain Security into Business Value: Only Non-IT Personnel Must Achieve It. IPC-1792 Implementation Guide
Join us for a practical, business-first approach to supply chain security. This webinar explores how involving non-IT stakeholders early in the process leads to smarter investments, fewer missteps, and clearer requirements for IT and security teams.
This webinar, co-hosted by the Global Electronics Association and Anthesis Group, will offer an update on the current state-of-play on emerging circularity policies for electronics to interested stakeholders, from an advocacy, compliance, and standards development perspective.
IPC supports the FY 2021 National Defense Authorization Act (NDAA) provisions that would bolster the resiliency and security of the electronics manufacturing ecosystem, including printed circuit board (PCB) fabrication and printed circuit board assembly (PCBA).
IPC has released IPC-6012EM, Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.