Presentation on Best Practices of Electronics Assembly
IPC skills competition will be upgraded to IPC Electronic Assembly Masters, namely IPCMasters Competition China 2023.
Using the IPC APEX EXPO Technical Conference as a model, this webinar will provide an overview of best practices for preparing technical data to write a high-quality manuscript suitable for conference presentation and publication. This tutorial is designed for anyone who wants to build their technical writing skills and share their innovations and research with a technical audience, and will have a special focus on the electronics industry. The session will highlight important advanced preparations prior to submitting an abstract or paper that should be considered by the author and their management. Using the style guideline created for ECWC16/IPC APEX EXPO 2024, attendees will receive an overview of the mechanics, format, and outlines used for an effective technical paper and presentation. Also covered will be how to avoid commercialism and common pitfalls that lead to inefficiencies and reduced quality. Time will be made available at the end of the presentation for questions and answers. IPC encourages anyone interested in writing technical papers to attend this free webinar.
The wire harness industry is constantly evolving with new technology and practices. The 2024 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this fast-changing landscape. WHMA's Annual Global Leadership Summit (formerly the WHMA Annual Conference) is a networking event for executives representing wire harness manufacturers, OEMs and suppliers for companies that build wiring harnesses and cable assemblies.
Electrical Wire Processing Technology Expo (EWPTE)
Produced by WHMA/IPC, the ONLY trade association exclusively representing the cable and wire harness manufacturing industry including manufacturers, their suppliers and customers, EWPTE is where the industry comes together with more than 3,000 attendees and nearly 200 exhibitors to find solutions to challenging wire problems through training and education and for the opportunity to network with industry leaders and subject matter experts. Attendees at all career stages can expect to Harness the Future through:
Bottom termination components (BTCs) are becoming increasingly common in assemblies due to their low cost and high performance. There are varying types of BTCs in the electronics industry, such as QFN, SOIC, and LGA, all of which are typical on assemblies. The defining characteristic of these components is that the terminations are flat on the bottom, therefore relying on solder paste to make the component to board connection. This means that the height of the solder is primarily determined by the volume of solder paste and the finished assembly might not have visible solder joints to inspect. As you can imagine, this makes BTCs very challenging to inspect, often leading to X-ray analysis for process control.
Are you using BTCs on your assembly?
Looking to understand the inspection process of BTCs?
Having trouble inspecting your BTC?
In this webinar we will take a deep dive into the inspection of Bottom Termination Components utilizing visual, X-ray and cross section analysis.
IPC Day France: Aerospace Electronics is an aerospace-focused networking event featuring prominent industry experts aimed at manufacturing, quality, and design engineers, specialists, and practitioners to meet, exchange knowledge, and learn about the latest industry trends.
IPC Day Netherlands: Aerospace Electronics is an aerospace-focused networking event featuring prominent industry experts aimed at manufacturing, quality, and design engineers, specialists, and practitioners to meet, exchange knowledge, and learn about the latest industry trends.
IPC CEMAC 2023 will invite industry experts, scholars, and representatives from leading companies to share and discuss IPC standards, automotive electronics, advanced packaging, the factory of the future, talent cultivation & sustainability, and innovative products & solutions. CEMAC 2023 will be the most comprehensive, professional, and cutting-edge industry event in the industry.
IPC Day Romania: Build Electronics Better with Standards and Solutions, Powered by Flex, is a conference providing unique opportunities to learn about the latest advancements in electronics manufacturing, participate in industry discussions, and network with a community of professionals dedicated to building electronics better.