IPC announced today the June 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.39.
From factory of the future advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO 2020 provided the education and networking connections that helped 8,516 visitors (attendee and exhibitor personnel) from 61 countries address today’s business challenges and prepare for the future.
IPC announced today the June 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.
IPC's Validation Services Program has awarded and renewed an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC). TUC is an electronics materials manufacturing company headquartered in Jhubei, Hsinchu County, Taiwan. TUC was the first manufacturer worldwide to gain QPL listing for copper-clad laminates and prepregs in February 2017. TUC successfully renewed and completed an intensive second audit based on IPC's foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
The U.S. electronics manufacturing industry is applauding the U.S. Senate for taking bipartisan action on legislation that will, if enacted, spur a new era of innovation, manufacturing and investment within the electronics industry.
IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.
IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication and assembly/EMS markets.
IPC issued a news statement from President and CEO John Mitchell on today’s passage of the “CHIPS+” legislation in the U.S. House of Representatives, which follows Senate approval and paves the way to U.S. President Joe Biden’s signature.
IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Fabrication Technologies Inc./IGM Solutions (FabTech-IGM) located in Libertyville, Ill. FabTech-IGM is a leader in contract manufacturing, engineering, fabrication and integration of electronic and metal products. Following the top down approach, a customer encouraged the company to seek the IPC certification to assist with their internal continuous improvement projects. FabTech-IGM successfully completed an intensive audit, based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assem