More than 200 representatives from companies such as Huawei, CRRC, NASA, Foxconn, Vayo and JWI Software gathered in Shenzhen, China for IPC CEMAC 2019. This year’s theme, “Intelligent Future Driven by Data,” provided attendees insight into Industry 4.0, the Internet of Things (IoT), electronic component 3D digital design, the use of data to drive intelligent manufacturing and the demand for high quality/highly reliable products.
The third annual M-EXPO Wire Processing Technology event held in Ciudad Juárez, México at the Cuatro Siglos Convention Center on October 9-11, 2019, exceeded expectations. This event was co-located with the ninth annual EXPO-MRO. These two events hosted more than 6,500 attendees.
Robert Cooke, NASA aerospace engineer and electronics industry subject matter expert, will deliver a technical education workshop, “The Evolution of IPC’s Cable & Wire Harness Documents: IPC-D-620, IPC/WHMA-A-620 and IPC-HDBK-620 at the WHMA 27th Annual Wire Harness Conference, February 18, 2020, in Las Vegas, Nevada.
IPC announces industry programs to support implementation and full utilization of IPC Connected Factory Exchange–IPC CFX. IPC CFX enables any manufacturing facility, large or small, to achieve Industry 4.0, IIoT and smart factory objectives. IPC CFX is a single-source, plug-and-play system supported by IPC-2591, Connected Factory Exchange (CFX), an open international standard developed by industry for industry. IPC CFX uses a secure license-free communication protocol that can reduce/eliminate reliance on middleware -- a constant source of headaches in smart factory implementation.
IPC – Association Connecting Electronics Industries® today announced it will offer an association health plan to IPC/WHMA members, extending affordable health care to small and medium-sized manufacturing companies in approved states. In states where the association health plan is not available, IPC will connect manufacturers with available small-group options in their states.
IPC announces the addition of Alison James as senior director, Europe.
IPC APEX EXPO was recognized on November 16 by the Tradeshow News Network (TSNN) as the fastest-growing association show for attendance in the United States for years 2016-2018.
IPC announced today the February 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales and orders both experienced solid year-over-year growth in February and the book-to-bill ratio strengthened to 1.06. Based on revised data from the industry, January business results made a much stronger showing than originally reported.
IPC -- Association Connecting Electronics Industries® announces the addition of Clay Ervine as senior director of member success to its staff at IPC headquarters in Bannockburn (Chicago), Ill.
IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.