The Global Electronics Association invites designers, engineers, researchers, and product‐development leaders to attend the 2nd Pan-European Electronics Design Conference (PEDC), taking place 21-22 January 2026 in Prague.
The Global Electronics Association welcomes the swift conclusion and approval of the Omnibus package on the Corporate Sustainability Reporting Directive (CSRD) and Corporate Sustainability Due Diligence Directive (CSDDD) by the European Parliament earlier today.
The Global Electronics Association today announced the appointment of Hisashi Kitajima as its Japan Representative, effective January 1, 2026.
The Global Electronics Association announced today the November 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.17.
The Global Electronics Association announced today the November 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.12.
The Global Electronics Association has partnered with Altium LLC, a global leader in electronics design software and solutions, to launch two new industry-recognized certification programs for printed circuit board (PCB) design.
The Global Electronics Association has officially released IPC-6921, Requirements and Acceptance for Organic IC Substrates.
To further reinforce its engagement in Thailand, the Global Electronics Association has appointed Raj Tiwari as Country Manager – Thailand.
India continues its acceleration as a global electronics manufacturing hub. At the heart of this momentum is Integrated Electronics Manufacturing & Interconnections (IEMI) 2026, the flagship industry platform of the Global Electronics Association.
Electronics engineers, technologists, and industry leaders have a strategic advantage at this year’s Advanced Electronic Packaging Conference, the premier technical conference at APEX EXPO 2026.