The Global Electronics Association announced today the October 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026.
Chris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the United States-Mexico-Canada Agreement (USMCA) Review Hearing on Thursday, December 4
The Global Electronics Association invites designers, engineers, researchers, and product‐development leaders to attend the 2nd Pan-European Electronics Design Conference (PEDC), taking place 21-22 January 2026 in Prague.
The Global Electronics Association today announced the appointment of Hisashi Kitajima as its Japan Representative, effective January 1, 2026.
The Global Electronics Association announced today the November 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.17.
The Global Electronics Association announced today the November 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.12.
The Global Electronics Association has partnered with Altium LLC, a global leader in electronics design software and solutions, to launch two new industry-recognized certification programs for printed circuit board (PCB) design.
PC is applauding leaders in the U.S. House and Senate for finalizing the FY2019 National Defense Authorization Act (NDAA) and including a provision on military electronics backed by IPC.Reflecting IPC’s collaboration with Senator Joe Donnelly (D-IN), Section 845 of the bill calls on the Secretary of Defense, in consultation with the Executive Agent for Printed Circuit Board and Interconnect Technology (based at the Naval Surface Warfare Center in Crane, Indiana) and the Director of the Office of Management and Budget (OMB), to prepare a report to Congress by January 2019 on the health of the U.S. defense electronics industrial base. The report will include an examination of the Department’s partnerships with industry and a plan to formalize the long-term resourcing of the Executive Agent.
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on August 30 at IPC’s SummerCom Standards Development Committee Meetings in Milwaukee, Wis. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.