IPC announced today the February 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.52.
IPC is now accepting abstracts for technical paper presentations, technical posters, and professional development courses for IPC APEX EXPO 2023. The technical conference will be held January 21-26, 2023, and professional development courses will take place January 24-26, 2023, at the San Diego Convention Center in San Diego.
Global Supply Chains Feeling Impacts of Russia-Ukraine War
In cooperation with InnoElectro, IPC hosted its popular Hand Soldering Competition (HSC), on March 29-31. Skilled competitors demonstrated their expertise in hand soldering printed circuit boards while competing for cash prizes.
IPC has announced the March 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.44.
IPC has announced the March 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.05.
Newly Appointed IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2023 Participation
The newly appointed IPC APEX EXPO Technical Program Committee is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2023.
IPC has announced the July 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
IPC — Association Connecting Electronics Industries® announced today the March 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.15.
The 4th Annual M-EXPO Wire Processing Technology event, produced by WHMA/IPC, has been postponed due to COVID-19 and the uncertainty of the situation in the fall. The October 14-16, 2020 event will take place next fall, 2021 in Ciudad Juárez, Chihuahua, Mexico, pending improved conditions.