Electronics industry sentiment improved during November with demand sentiment also taking a solid step up over the last 30 days per IPC’s November 2023 Global Sentiment of the Electronics Supply Chain Report.
PCB Technology Trends 2018, a new global study published by IPC is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2023 that will affect the whole industry.
IPC announced today the November 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.97.
IPC announced today the November 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.23.
IPC APEX EXPO 2024 will feature Paul Bailey, mixed-media artist, technologist and vice president and general manager of AOA West, a design, production and project management company in Burbank, Calif.
Electronics industry sentiment took a dip in December with New Order, Shipment, and Backlog Indices falling, with only Capacity Utilization Index holding steady. Despite the dip, overall demand sentiment remained in positive territory, per IPC’s December 2023 Global Sentiment of the Electronics Supply Chain Report.
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis.
IPC announces a pivotal opportunity for California employers under the Employment Training Panel (ETP) program. This initiative provides significant financial support for customized job skills training, reducing costs and enhancing the competencies of the workforce in today's challenging market.
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
IPC’s statistical programs for the global electronics manufacturing services (EMS), assembly equipment and solder industries are now open to new participants for 2019. The deadline for IPC members to sign up is April 1. Participating companies receive quarterly market data at no cost. Participation is free to IPC-member companies as a benefit of membership.