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North American EMS Orders Outpace Shipments in August as Bookings Rise 53.5% Year-Over-Year

The Global Electronics Association announced today the August 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.39.

IPC Standards Support Professional Assessment for the Electronics Competition at WorldSkills Shanghai 2026

The 48th WorldSkills Competition was held in Shanghai from September 22 to 27. According to the official competition results, Wu Tong of China won the gold medal in the Electronics competition, marking China’s fourth consecutive gold medal in this category.

Global Electronics Association Names Jason Palmi Chief Financial Officer

The Global Electronics Association today announced that Jason Palmi has joined the organization as Chief Financial Officer.

Global Electronics Association and Purdue University Establish Strategic Partnership to Advance Electronics Innovation

The Global Electronics Association and Purdue University have signed a memorandum of understanding establishing a strategic partnership to advance innovation, workforce development and industry collaboration across the electronics ecosystem.

Global Electronics Association Releases IPC-1783-CO2E Standard for Product Carbon Footprint Data

The Global Electronics Association today announced the release of IPC-1783-CO2E, International Standard for Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions for the Electronics Manufacturing Supply Chain, a new global standard designed to bring greater consistency, credibility and comparability to product carbon footprint data across the electronics industry.

High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method

High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

IPC’s PCB Technology Trends Study Details How PCB Manufacturers Meet Current and Future Technology Demands

PCB Technology Trends 2018, a new global study published by IPC is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2023 that will affect the whole industry. Based on data from 74 companies worldwide, the 213-page report presents data on PCB technology and OEMs’ PCB requirements as of 2018, as well as OEMs’ use of emerging technologies.

Engineer Connects Education, Industry and IPC

By Corey Lynn, Marketing Manager, Education As the IPC Education Foundation establishes student chapters, we have partnered with individuals in the electronics industry and academia. Sometimes we get lucky and find someone involved in both. Kris Moyer, lead engineer at Williams International, is an IPC veteran who chairs and participates in several IPC Standards Committees.

Export Controls in Flux

By Ken Schramko, senior director, North American government relations U.S.

United States Increases Tariffs on More Chinese Products

The U.S. Trade Representative (USTR) has published the official Federal Register notice increasing tariffs from 10 percent to 25 percent on another $200 billion worth of Chinese products, effective at 12:01 a.m. on Friday.

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