The Global Electronics Association announced today the May 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.60.
The Global Electronics Association announced today the May 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.36
The Global Electronics Association has released IPC-1401B, Environmental, Social and Governance (ESG) Management System Standard, an updated industry standard that gives manufacturers a practical, scalable framework to demonstrate ESG performance to customers, investors, and regulators.
The Global Electronics Association announces Fundamentals and Best Practices for E-Textile System Development, a new next-generation guideline that provides a structured framework for the design, testing and deployment of e-textiles systems.
The Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more. The Association's upcoming conferences and tradeshows connect leaders, engineers, and technologists with the solutions and insights they need most.
The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, Calif.
As advanced electronic packaging becomes increasingly important to enabling next-generation semiconductor innovation, including chiplet architectures, 3D integration, and advanced substrate technologies, the Global Electronics Association announced the appointment of Jeffrey ChangBing Lee as Technology Solutions Lead Expert for Advanced Electronic Packaging (AEP) – Taiwan.
The global electronics industry will gather in Paris this September to help shape the standards that define how electronics are designed, built, tested and trusted worldwide.
The Global Electronics Association hosted the Hand Soldering Competition Vietnam 2026 in conjunction with VIMF 2026 and NEPCON ASIA Vietnam 2026, with the Southern Regional Round held June 17–18 in Ho Chi Minh City and the Northern Regional Round held August 5–7 in Hanoi, Vietnam.
The Global Electronics Association announced today the June 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.49.