The Global Electronics Association announces Fundamentals and Best Practices for E-Textile System Development, a new next-generation guideline that provides a structured framework for the design, testing and deployment of e-textiles systems.
The Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more. The Association's upcoming conferences and tradeshows connect leaders, engineers, and technologists with the solutions and insights they need most.
The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, Calif.
The Wiring Harness Manufacturer’s Association (WHMA), a council of Global Electronics Association, will host its 2027 Annual Global Leadership Summit, February 3–5, 2027, bringing together executives from wire harness manufacturers, OEMs and suppliers serving the wire harness and cable assembly industry.
The Global Electronics Association today announced the relaunch of its Double Materiality Assessment (DMA) Toolkit for the Electronics Industry, an updated resource designed to help organizations navigate double materiality assessment planning amid changing sustainability and corporate reporting expectations.
Europe is one of the world’s three largest markets for AI data centres. However, most of the value created by that demand accrues to companies and supply chains outside of the EU. Today, the Global Electronics Association released From Chips to Systems: Building an End-to-End EU Strategy for Data Centre, Cloud Infrastructure and AI, a joint report with DECISION Études & Conseil that quantifies that gap, layer by layer, and offers a practical policy roadmap to close it.
At Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
The Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing.
The Global Electronics Association today announced Yossi Sheffi, Ph.D., best-selling author, entrepreneur and Massachusetts Institute of Technology (MIT) professor, will deliver the opening keynote address at APEX EXPO 2027 on Tuesday, April 6, focused on the forces reshaping the global electronics industry.
The Global Electronics Association announced today the August 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.29.