Global Electronics Association Knowledge Hub

Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile .. read more

Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv .. read more

Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very .. read more

As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage, .. read more

As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly .. read more

This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. In almost any modern vehicle there are numerous hi .. read more

In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as .. read more

The viscosity of conformal coatings is critical in producing consistent and reliable applications of coating onto a printed circuit board (PCB). A conformal coating that has experienced mois .. read more

A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive .. read more

As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented, .. read more

As the manufacturing sector is under constant pressure to satisfy customers’ demands in a competitive market by applying complex processes to meet manufacturing cost and schedule goals, the .. read more

To ensure the highest possible quality standards in automotive electronics production, an extensive implementation of testing and inspection systems throughout production is mandatory. In SM .. read more

The key challenge for industry in adopting AI into their manufacturing processes surrounds the accessibility of their data. Many manufacturing industries, especially electronics manufacturin .. read more

Neural network based deep learning models increasingly demonstrates high accuracy in object detection and image classification in digital image processing. The manufacturing industry is adap .. read more

Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidus temperature using radiati .. read more

IPC-HERMES-9852 as the smart replacement for the long-used IPC-SMEMA-9851 provides machine-to-machine (M2M) communication that ensures consistency of each PCB and its individual data while t .. read more

With the advancement of emerging technologies such as AI, Cloud and Block Chain, the electronics manufacturing industry is entering a new era of smart manufacturing. More and more Electronic .. read more

The Factory of the Future or a Lights out Factory will require significant automation, including many functions that are challenging and are still performed manually due to the complexity an .. read more

The IPC Connected Factory Exchange (IPC-CFX) standard provides genuine plug-and-play IIoT data exchange between machines and supervisory systems across the shop floor. To realise the benefit .. read more

With the Industry 4.0 transformation going full steam ahead, analytics have transformed the industry from being process-driven to now data-driven, where data speaks for itself. Conventionall .. read more

This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. The goal was for the .. read more

Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, includ .. read more

Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu .. read more

Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical .. read more

In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. Those materia .. read more

In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5 .. read more

Light weight, conformal and portable standalone power solutions are becoming increasingly important for powering wearable electronics including .. read more

Wearable devices for biomedical applications have become more popular due to the increasing demand on health monitoring for both consumer and medical fields. In this work, we describe a nove .. read more

SINTEC is the project name for a Liquid metal alloy technology with the goal of creating flexible and stretchable electronics.  These stretchable electronics are applicable to wearable .. read more

Textile-based touch sensing offers a novel solution towards creating flexible and robust tactile interfaces that fit within an existing manufacturing ecosystem.  Current fabric-based to .. read more

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The research presented in this slide show utilizes E-Textiles.  The applications include: Physiological Status Monitoring Cognitive Status Monitor .. read more

The DoD conducted a survey of PCB companies and the effects of COVID19.  The survey results showed that: Some U.S PrCB manufacturing facilities were significantly impa .. read more

Indiana Integrated Circuits has developed "Quilted" modular PCBs.  They consist of multiple small "boardlets" with traces or pads on rough edges of the boards.  These rough edges f .. read more

The Dod Executive Agent For Printed Circuit Board and Interconnect Technology (PrCB EA) has a vested interest in the state of the electronics industrial base and its ability to sustain and i .. read more

This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the boa .. read more

To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decre .. read more

This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives.  The component use cases and typical challenges are ex .. read more

The lack of material provenance in today’s supply-chain allows the undetected ingress of counterfeit materials to increase at alarming levels. Chemicals, components, including critical ICs, .. read more

One of the most important aspects of the IPC Digital Twin standard, is the enablement of interoperability between many digital twin-based solutions across many facets of the holistic manufac .. read more

The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. The co .. read more

DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe .. read more

Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ .. read more

Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where .. read more

This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi .. read more

This Slide Show Utilizes the Cover Paper from the session.   This slide show discusses the use Power harvesting in conjunction with a typical battery and the efforts .. read more

This slide show discusses inverters and power electronics for Heavy Machinery.  There is discussion of Wide Band Gap Powered Devices.  The purpose is increased efficiency gains.&nb .. read more

This Paper utilizes the introduction from the session as its paper then discusses Wide Bandgap Power Electronics    All electronics products need a power source .. read more

All electronics products need a power source. Thereby power electronics has a fundamental impact on their design and integration, from materials and device up to systems and the applications .. read more

Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec .. read more