Global Electronics Association Knowledge Hub

The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). Once the Customer’s needs are fulfilled (de .. read more

This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more .. read more

SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. Typical A typical SMT line .. read more

The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u .. read more

Polymeric conformal coatings are used to improve and extend the reliability of printed circuit boards against environmental conditions. There is high interest in using light-curable conforma .. read more

In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad .. read more

IPC J-STD-004B standard prescribes general requirements for the classification and testing of soldering flux for high qualify interconnections. This standard defines the classification of so .. read more

Crimped electrical contact reliability is controlled through strict manufacturing processes and verifications, including pull force testing. Cable and wire harness assemblies’ standards prov .. read more

Today’s electronics industry is grappling with increasing demand for more customized products, shorter development cycles, supply chain disruptions, and tighter margins. In the PCB manufactu .. read more

The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a sol .. read more

An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being .. read more

There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been dem .. read more

In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma .. read more

The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result .. read more

Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivabi .. read more

This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it .. read more

Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world u .. read more

Raytheon Missiles and Defense, formed a L-Lead (Pb) to LF-Lead-free focus group to understand the metallurgical and manufacturing challenges to transition to a “pure” Pb-free metallurgical s .. read more

Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co .. read more

In recent years, Neural-Network based deep learning models has demonstrated high accuracy in object detection and classification in digital image processing. Manufacturing industry has succe .. read more

Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga .. read more

For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h .. read more

Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec .. read more

High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and .. read more

Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This .. read more

Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in .. read more

This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final .. read more

The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges .. read more

Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi .. read more

Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising .. read more

The search for novel adhesion promoters (AP) for inner-layer bonding of printed circuit boards that meet the requirements of high-frequency applications is driving the surface treatment indu .. read more

An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy .. read more

Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal .. read more

The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and p .. read more

Heterogeneous integration has become one of the most important approaches in the semiconductor technology world. The process nodes are constantly shrinking from 16nm to 5nm and lower, with C .. read more

The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical s .. read more

Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. Today, laser depanelin .. read more

IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th .. read more

Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To .. read more

In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold .. read more

This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR .. read more

Direct Digital Manufacturing (DDM) combines additive and subtractive manufacturing methods to fully fabricate Printed Circuit Structures (PCS). Harnessing the flexibility of additive methods .. read more

High reliable lead-free alloys are suitable for high operating temperatures and longer temperature-cycling time. The Innolot alloy,for example, is based on the tin-silver-copper (SAC) metall .. read more

When evaluating solder paste for use, mechanical reliability is one feature of interest. The performance of an electronic assembly in a vehicle, for example, may hinge on a solder alloy’s re .. read more

For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a .. read more

The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on .. read more

Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of th .. read more

During the past few years, it has become increasingly difficult to physically rework printed circuit board (PCB) assemblies. Such mundane operations as soldering, desoldering and component r .. read more

Highly reliable and high-yield prototyping in the early stages of development is crucial for innovations in next generation microelectronic systems to demonstrate the results of research. Th .. read more

Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation. The larg .. read more