Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
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Event
IPC APEX EXPO 2013
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
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Event
IPC APEX EXPO 2013
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
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Event
IPC APEX EXPO 2013
EOS Exposure of Components in Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in
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Event
IPC APEX EXPO 2013
Cleaning Of Assembled PCBs A Crucial Way of Enhancing Product Reliability and Avoiding Problems in the Field
Over the last years more and more International newspapers reported in Europe / USA and Japan: “Tunnel train got stuck under the Channel – thousands of people stranded “Recall of thousands of c
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Event
IPC APEX EXPO 2013
High Reliability and Low Variability Results with Benchtop PCB Cleaning
The purpose of this study is to determine whether or not aerosol benchtop cleaning can consistently and reliably clean reworked boards. Different variables that play a role in the effectiveness
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Event
IPC APEX EXPO 2013
In Situ Recycling of Cleaning and Rinsing Fluids to Meet Lean & Green Cleaning Process Targets
Recycling cleaning and rinsing fluids in the manufacturing process is becoming very popular for many reasons. Competitiveness is the key issue as the electronics industry ages. In our golden ye
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Event
IPC APEX EXPO 2013
Predicting the Lifetime of the PCB - From Experiment to Simulation
Two major drivers in electronic industry are electrical and mechanical miniaturization. Both induce major changes in the material selection as well as in the design. Nevertheless,the mechanical
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Event
IPC APEX EXPO 2013
Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased driving a
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Event
IPC APEX EXPO 2013
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
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Event
IPC APEX EXPO 2013
Taking the LED Pick and Place Challenge
For the past few years there has been a shift in the Lighting Industry that has carried over to the surface mount technology assembly line. What is this shift you may ask? Well it is the LED re
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Event
IPC APEX EXPO 2013
MICROSYSTEMS ENABLED PV
Microsystems Enabled PV:
•Technology benefits
•Process flow/assembly examples
•Cost analysis
•From R&D to commercialization
•3DIC/hybrid assembly and new functionality
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Event
IPC APEX EXPO 2013
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
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Event
IPC APEX EXPO 2013
PCB Surface Finishes for Low Temperature Solder Processing
Low temp solders are a viable solution and their
performance can be enhance thought final finish
selection.
Initial data suggest that an organic metal final finish
in combination with a low tem
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Event
IPC APEX EXPO 2013
Low Temperature SMT Process Implementation
Low Temperature Conversion
•Substantial cost savings over regular processes
•Savings can outweigh paste cost differences
•Can be mechanically stronger if done right
•Involves more than just cha
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Event
IPC APEX EXPO 2013
Jet Printing of Low Temperature Solder Paste
•Jet printing introduction
•Industry challenges
•Jet printing low temperature paste
–Collaboration Alpha-MYDATA
–Rheology
–Results
•Low temperature paste offers a production solution for advanc
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Event
IPC APEX EXPO 2013
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
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Event
IPC APEX EXPO 2013
Automating the Rework Process: Technology Advancement Replaces Manual Method
Automated Optical Rework (AOR) is a new method of reworking shorts by using a fully automated fine laser beam to ablate
any excess copper in fine-line PCB patterns. This includes shorts,protrus
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Event
IPC APEX EXPO 2013
Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process
Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l
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Event
IPC APEX EXPO 2013
The Evolution of ICT: PCB Technologies,Test Philosophies,and Manufacturing Business Models Are Driving In-Circuit Test Evolution and Innovations
Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e
.. read more
Event
IPC APEX EXPO 2013
Improving Product Reliability through HALT and HASS Testing of Electronics and PCB’s
HALT & HASS technology uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages (often at board level),improving product reliability and c
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Event
IPC APEX EXPO 2013
Mechanical Reliability – A New Method to Forecast Drop Shock Performance
In light of the recent technological trends within PCB manufacturing industry,there is an increasing degree of interest in understanding the influence factors of mechanical stress on the durabi
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Event
IPC APEX EXPO 2013
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r
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Event
IPC APEX EXPO 2013
Material Selection and Parameter Optimization for Reliable TMV Pop Assembly
The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga
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Event
IPC APEX EXPO 2013
Failure Modes in Wire bonded and Flip Chip Packages
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce
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Event
IPC APEX EXPO 2013
JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste
1.Obtain suggestions from the solder manufactures
Low-Ag SAC Paste
•Increase in reflow temp
•Impact on thermal fatigue and wetting
Sn-Bi low-temp Paste
•Impact on shock strength
•Creep fatigue
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Event
IPC APEX EXPO 2013
Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders
SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs
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Event
IPC APEX EXPO 2013
Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
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Event
IPC APEX EXPO 2013
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
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Event
IPC APEX EXPO 2013
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part I
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were possible,either with solvent or by using wa
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Event
IPC APEX EXPO 2013
Liquid Flux Selection and Process Optimization for Selective Soldering Applications
There has been a rapid increase in the use of selective soldering equipment for PCB assembly
–Lower equipment costs
–Smaller equipment footprint
–Lower solder “inventory” cost (smaller pots)
–D
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Event
IPC APEX EXPO 2013
Halogen Free Solder Paste
•What is a halogen?
•Impact on the environment
•Halides and halogens
•Halides in electronics
•Halogens in electronics
•Definition of halogen free
•Technical challenges to remove halogen
•Curren
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Event
IPC APEX EXPO 2013
Lead-free Nanosolders and Nanowire Joining for Microelectronics/Nanoelectronics Assembly and Packaging
- Nanosolder on multi-segment nanowires have been successfully fabricated by electrodeposition method;
- Flux assisted environment enhanced reflow result and micron scale solder spheroids forme
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Event
IPC APEX EXPO 2013
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
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Event
IPC APEX EXPO 2013
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
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Event
IPC APEX EXPO 2013
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
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Event
IPC APEX EXPO 2013
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
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Event
IPC APEX EXPO 2013
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
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Event
IPC APEX EXPO 2013
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
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Event
IPC APEX EXPO 2013
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
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Event
IPC APEX EXPO 2013
Embedded Passive Technology
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology ha
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Event
IPC APEX EXPO 2013
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
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Event
IPC APEX EXPO 2013
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
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Event
IPC APEX EXPO 2013
Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
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Event
IPC APEX EXPO 2013
Embedded System Access - a Paradigm Shift in Electrical Test
Throughout a product’s life cycle it may need to be tested various times. New product designs need to be validated during the prototyping phase,manufacturing defects need to be detected and dia
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Event
IPC APEX EXPO 2013
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
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Event
IPC APEX EXPO 2013
Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow,Opens,and Shorts with Dual Full-Field 3D Surface Warpage Data Sets
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally bee
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Event
IPC APEX EXPO 2013
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
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Event
IPC APEX EXPO 2013
Online Databse of Materials for Printed Electronics
Materials Registry for Printed Electronics
- WMU’s CAPE received an award from FlexTech Alliance to create an online database for accessing technical information on functional materials used in
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Event
IPC APEX EXPO 2013