Global Electronics Association Knowledge Hub

As we progress in the 21st century,electronics manufacturing will need more and more precision. Parts will get more complex since more components have to be assembled in smaller spaces. Circuit .. read more

Round Robin Reliability Evaluation “Revival” Proposal 1.TR-579 2.IST( IPC-9151/TM 2.6.26) 3.HATS (IPC-9151) 4.CITC(EIT) 5.TS(TM650-2.6.7.2B,MIL31032/1C) 6. Application(Odometer ) .. read more

We describe the design of a novel test structure,to which we have given the name “HD”,that will facilitate the evaluation of blind and buried microvias in printed circuit boards,in comparison w .. read more

What We Achieved: Current Proposed OTC Model Rule Modifications • Vapor degreasing exempted from 25 g/L limit – NESHAP-like equipment & controls • 150 g/L VOC maximum for electronics assemblies .. read more

Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative .. read more

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component .. read more

Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds .. read more

As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s .. read more

- Hot nitrogen technology for local inerting system of wave soldering machines has proved to give significant advantages with Tin Lead or Lead free solders: - Better heat transfer on the PCBs,e .. read more

Solid tantalum capacitors were introduced to the market more than five decades ago and continue to be widely used. Reliability issues arise when tantalum capacitors are exposed to excessive the .. read more

Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire bonded interconnects. . These leadless components provide an advanced pac .. read more

Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d .. read more

This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat .. read more

The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and focused on specialized applications in the military and high end comp .. read more

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Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed circuit boards (PCB) have prompted market demand for HFR-free computer sy .. read more

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In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free) within the Client Market space (Desktop and Notebook computers) iNEMI init .. read more

Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on .. read more

Board-level drop test performance was evaluated and compared for the following four different solder combinations in BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti .. read more

This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th .. read more

The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m .. read more

With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho .. read more

Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons: .. read more

As the need for electronics,electronic components and printed circuit boards becomes more important; the testing of products for these industries becomes a critical component. New materials,new .. read more

Functional circuit test (FCT) of circuit boards and end products in a high volume (>1000 units per day) production environment presents challenging technical,logistic and cost obstacles that ar .. read more

The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec .. read more

The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications. Copper surface roughness h .. read more

Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an .. read more

For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came .. read more

Silicone contamination is known to have a negative impact on assembly processes such as soldering,adhesive bonding,coating,and wire bonding. In particular,silicone is known to cause de-wetting .. read more

Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials,water soluble salts,organic materials,and a sma .. read more

- DD Detector is State of the Art - Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material - Traceability and Reproducibility .. read more

•What is Digital Printing •Ink Jet Technology •Printing SM using Ink Jet - Highlights - Zero clearance technology - Product improvements - PCB shops,end users and designers .. read more

The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin .. read more

With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer powder mesh sizes for package-on-package (PoP) assemblies has become imper .. read more

Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev .. read more

The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: “faster and smaller” it is necessary to place components with different .. read more

Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled,un-powered,vectorless in-circu .. read more

Testing DDR memories on Printed Circuit Boards has steadily gotten more difficult. Most such memories do not have any on-chip Design-for-Test features. Adequate test access is a disappearing lu .. read more

Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field failures and huge losses,which annually total several billion U.S. doll .. read more

Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In this study,the majo .. read more

With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th .. read more

As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest .. read more

The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes,are commonly fil .. read more

Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not d .. read more

- What is Pad Cratering? - Pad Craters - Pad Cratering… Opens Circuits - How is the Electronics Industry dealing with this Defect Mode? - What does this have in common with a Pad Cratering solu .. read more

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space .. read more

Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem .. read more

Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball these components w .. read more