Global Electronics Association Knowledge Hub

HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment. Graping minimization recommendations are given with data driven suggestions. .. read more

ITO nanoparticles were successfully printed on glass with the AccuPress Gravure System •A wide range of sheet resistivity values was achieved with different engraving resolutions of the gravure .. read more

Printed & Flexible Electronics • Development Waves – 1st,2nd,and 3rd • Essentials • Products and Applications • Technology and Infrastructure Development • Printed & Flexible Electronics Pipeli .. read more

With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho .. read more

As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look .. read more

The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco .. read more

MultiChip Module Status •It isn’t a new idea since back in the 1980’s everyone was trying to combine different components into a single package •It started with Hybrids then different forms of .. read more

Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a .. read more

The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing s .. read more

Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility need .. read more

During the production of Lead-Free Hot Air Solder Leveling (LF HASL),non-wetting issues in several components were found including BGA pad. The common visual aspect of the suspicious pads was t .. read more

The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of .. read more

This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was .. read more

Nanotechnology is a key enabling technology for printed electronics. Low temperature reactivity,reaction speeds,flexibility and fine pitch considerations dictate that nanomaterials should be gi .. read more

•Photonic curing uses high-intensity flash lamps to selectively heat target materials. •The PulseForge tools are based on the patented use of photonic curing and are designed for use in develop .. read more

•Developments of Printed FPCs - PE resist for long FPCs - Flexible Touch Sensor Panel(TSP) application - Single-sided Printed FPCs - Double-sided Printed FPCs - Smart Printed FPCs .. read more

With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contam .. read more

High pressure capillary IC allows you to: Lower operational costs – water,waste,consumables “Always Ready” Improved system and analytical performance Convenience Rush samples Enables high-resol .. read more

For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not .. read more

CO2 technology offers electronic device manufacturers a robust platform for a variety of precision cleaning and machining applications. Surface and substrate contamination such as flux residues .. read more

When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reli .. read more

The Printed Circuit Board (PCB) builds get ever more complex. With this the layer counts climb but the overall thickness remains the same. From this the cores of the build are reduced and the d .. read more

The Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole,SM .. read more

For centuries,the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates,from cloth material .. read more

The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t .. read more

1.Conventional Flex 2.Basic Materials 3.Failure Modes 4.HDI Flex Summary,conventional builds Cautions in Design •Average or above Design Expertise Required –PTH to close to edge of part –Panel .. read more

Electroless plating processes are popular because of their performance,reliability and cost effectiveness. The process combines unique deposit properties such as uniform plating build up regard .. read more

Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging .. read more

The structures of electronic components become smaller and smaller. 5 volts or smaller voltage of an electrostatic charge are enough to damage or change the structures in small electronic compo .. read more

The next generation miniaturised SMT devices waiting to make their mark will require the assembly community to re think their processes and toolsets. The feature sizes that are involved in this .. read more

Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en .. read more

Although QFN devices present a challenge to the SMT assembly process with proper stencil design,proper stencil technology selection (Laser,Electroform,Nano-Coat),and proper PCB solder mask layo .. read more

The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f .. read more

•Two primary failure modes from trapped moisture: •Premature resin decomposition from incomplete resin cross-linking. •Explosive vaporization during high temperature thermal exposure. .. read more

Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Using standard subtractive printed circuit board proces .. read more

In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results .. read more

•Voiding of QFN a concern due to large thermal pad,low standoff,and many thermal via •Divided thermal pad preferred,with SMD better than NSMD •This work focus on systematic study on effect of S .. read more

Eutectic god-tin (Au80Sn20) is widely used as the die-attach material for making radio-frequency (RF) and microwave devices. The metallic bonding is typically achieved by soldering using a gold .. read more

Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult t .. read more

The thermal stability of silicone polymers,fluids and resins has been well documented and studied extensively. The high temperature performance of silicone adhesives and sealants used for elect .. read more

The use of plasma processing in the manufacture of electronics is growing as we discover more and more applications for this technology. It is now common for plasma etching and cleaning to be u .. read more

The portable electronics market has driven steep-slope growth for over a decade and continues to deliver amazing handheld electronic devices; manufacturers of these products are facing challeng .. read more

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Multi-layer organic laminates which make up over 90% of the present types of interconnecting substrates in today’s electronics can develop a loss of insulation resistance between two biased con .. read more

A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a .. read more

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Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is even more crucial in today’s packaging,due to the high ratio of passive components .. read more

Examination of historical data for a defunct electronics manufacturing plant in Ontario,Canada has allowed the determination of the potential global warming contribution by the plant for the ye .. read more

Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo .. read more

The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performan .. read more