Global Electronics Association Knowledge Hub

Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as .. read more

Design workflow is the core to your design team?s competitive advantage; it?s the conduit by which you turn your team?s expertise and ideas into manufacturable products. And yet,all engineering .. read more

Total cost of ownership is a financial estimate designed to help consumers and enterprise managers assess direct and indirect costs commonly related to software or hardware. It is a form of ful .. read more

Kitting is the first step in printed circuit board assembly. It is initiated well in advance of actual production start to be able to prepare and deliver the kit on time. Kitting involves gathe .. read more

The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari .. read more

Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l .. read more

Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon .. read more

Repairing a PCB with a defective BGA,uBGA,or QFN is often a difficult and tedious task. The conventional method is to remove the defective device from the PCB; clean the pads on the PCB,then pr .. read more

Wire soldering operations are still widely accepted in the electronics assembly industry. When a product or the parts within cannot withstand the heat of oven reflow,the localized heat provided .. read more

Currently little data exists on temperature repeatability of BGA/CSP rework machine equipment. This is an issue especially for lead-free rework as the temperatures during lead-free BGA/CSP rewo .. read more

There has been a global trend towards legislation meant to encourage sustainable manufacturing and minimize the environmental impact of product manufacturing. In the global economy,with its dis .. read more

Companies not only need to understand the reliability issues with environmental compliance,but also how to comply with the various regulations from the business end. China is the second jurisdi .. read more

More and more political bodies (countries,states,and unions) are enacting legislation designed to protect the environment from the impact of manufacturing. One category of restrictive legislati .. read more

Emerging technologies in the printed circuit board industry including smaller holes,higher aspect ratios,three-dimensional features,fine pitch,blind via holes,and new lead free materials contin .. read more

An electrochemical device has been developed that deposits non adherent copper metal powder at the cathode,and generates chlorine gas at the anode. The chlorine is contained within the system,a .. read more

We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an .. read more

The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial .. read more

The proper grounding of all conductive items in the production workplace is an essential element of ESD (electrostatic discharge) management. ESD damage to components and assemblies in manufact .. read more

In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag .. read more

As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact .. read more

This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin .. read more

It is known that pure tin will undergo an allotropic transformation below 13°C where it becomes a semiconductor with a 26% [1,2] volume increase,and in appearance turns from a bright shiny m .. read more

Concerns There are some areas that must be accepted if planning to run the newest SENIG process: - Slower plating rate in nickel (to get 150µ“ it will take 20 minutes) - It works better at hig .. read more

Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra .. read more

Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc .. read more

For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo .. read more

Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon .. read more

We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv .. read more

The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f .. read more

In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req .. read more

The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable .. read more

When trying to achieve 40 microns of placement spacing,bridges and tombstones may occur due to the variation of the component dimensions,equipment accuracy and pickup position variations. Hawse .. read more

The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s .. read more

In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature, .. read more

With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper .. read more

Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa .. read more

Organic Solderability Preservative (OSP) coatings feature among the leading surface finish options in the printed circuit board (PCB) industry because of their excellent solderability,lead-free .. read more

Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo .. read more

CSP underfill commonly acts to protect solder bumps of fine pitch CSP and enhances the reliability. This paper presents four snap curing underfills (=2min@150?or=5min@120?),tested on SnPb assem .. read more

As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi .. read more

In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m .. read more

As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu .. read more

To better evaluate CAF (Conductive Anodic Filament) growth we have developed a Test Printed circuit board (PCB) with narrow pitch through holes. (THs) This test PCB can evaluate anti-CAF proper .. read more

Designers of high performance electronics continue to have system requirements that necessitate the implementation of embedded resistors in microelectronic package and multilayer printed circui .. read more

When planning a trip for the first time there is usually a significant amount of planning and preparation involved. First,the destination is chosen that meets the objective (e.g. Las Vegas for .. read more

The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20% .. read more

This paper discusses laser micromachining of thin films. In particular,recent developments on high capacitance,large area,thin,flexible/rollable embedded capacitors are highlighted. A variety o .. read more

The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of .. read more

The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable handset markets. Consumers? expectations are that each new generation of pr .. read more

Increased functionality and smaller devices are significant drivers in innovative packaging designs. One of the newer package types to be introduced into the market place in the past few years .. read more