Global Electronics Association Knowledge Hub

New packaging technologies are making higher demands on components and also jointing techniques. The application of polymer electronics as well as the integration of optical components into the .. read more

Mixed leaded and lead-free processing requires that reflow ovens change temperature. Cooling a modern oven can take a long time,even longer than an older oven because modern ovens are more insu .. read more

The flux management system for a reflow oven is highly critical to the quality,cost,and yield of a reflow process. Flux accumulation and dripping inside the oven not only requires frequent main .. read more

In recent years,various studies have been issued on cleaning under low standoff components; most however,with incomplete information. It is essential to revisit and describe the latest challeng .. read more

One of the most popular pieces of equipment in the PCB fabrication industry is the inline processor. These machines are used for a variety of tasks including resist removal,etching and cleaning .. read more

Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean .. read more

This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of .. read more

Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct .. read more

Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in .. read more

Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other components and enabling tailored interconnect topology. This technology needs .. read more

This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles for z-axis interconnections, especially as it relates to package level fabrication,integration,and .. read more

SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol .. read more

The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D .. read more

Flexible electronics is the future trend of the worldwide electronic industry. The RFID tag is one of the main applications in flexible electronics currently. This paper presents a flexible HF .. read more

The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed .. read more

A series of advanced screen-printing processes have been developed to build functional high density flexible electronic circuits. Not only do the single layer circuits have fine conductor trace .. read more

Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product .. read more

As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to .. read more

Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol .. read more

Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean .. read more

More and more circuit board designs require signals paths that can handle multi-gigahertz frequencies. The challenges for organic circuit boards,in meeting these electrical requirements,include .. read more

As designers strive to extract ever more performance from high speed transmission lines on FR4 substrates and their high speed derivatives,a requirement has arisen for a practical and robust “G .. read more

Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f .. read more

Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi .. read more

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics .. read more

Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s .. read more

Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach .. read more

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technolog .. read more

Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used .. read more

All things corrode,and the rate of corrosion among electronics devices is accelerating. Electronic devices are being used in more places than ever before. They are finding more uses,they're mor .. read more

Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f .. read more

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The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize solder joint integrity. Many standards exist to evaluate the long ter .. read more

Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream converting operations; therefore,the benefits of plasma treatment are well r .. read more

The complexity of the electronic assembly manufacturing environment increases with the miniaturization,low standoff components,and solder alloy advancements. Past history suggests that the clea .. read more

There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the fluxes are not fully complexed (not fully heat activated) there .. read more

As the entire electronic manufacturing industry braced for the July 1,2006 deadline,it has been reevaluating the entire production process. Likewise,the precision cleaning industry must also .. read more

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Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common .. read more

insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering and hand assembly processes must all be optimized carefully to insure go .. read more

C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol .. read more

With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when soldering RoHS compliant through-hole devices. Many contract electroni .. read more

Due to the ever-aggressive miniaturization program that is rolling through the electronics industry,the next component that is fast approaching this horizon is the 0.3mm CSP • This paper will r .. read more

As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more sensitive to mechanical vibrations. Alignment,positional and pick & place acc .. read more

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