Global Electronics Association Knowledge Hub

As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh .. read more

BGA component removal and replacement are required during product development and repair operations. In general,a single rework on specific location is permitted without causing excessive damag .. read more

A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been .. read more

Wafer bumping using thin electroformed nickel stencils with ultra fine powder solder paste continues to gain popularity as a cost effective alternative to ball drop and electroplated technologi .. read more

The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res .. read more

Our industry is slowly coming to the realization that many fluxes containing low molecular weight carboxylic acids cannot be adequately tested for surface insulation resistance and electrochemi .. read more

With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a .. read more

This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and .. read more

During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer .. read more

For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me .. read more

As the electronics assembly industry adjusts to building boards with 0201 components,the next level of shrinkage for chip components is just around the corner with the emergence of 01005s. A ke .. read more

This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca .. read more

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l .. read more

This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr .. read more

Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav .. read more

This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit .. read more

Tin whiskers are needle-like crystals of tin growing from pure tin or high-tin alloy surfaces,which may grow long enough to cause electrical shorts. Conformal coatings provide some protection a .. read more

The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and .. read more

The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref .. read more

Mechanically drilled through holes in PWBs form interconnects between copper layers through the use of copper pads. These pads are larger than the drill diameter to account for such factors as .. read more

Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req .. read more

The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed .. read more

fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require .. read more

This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of .. read more

Increased electronic functionality can be achieved through the development of more complex silicon integration but that course generally requires a great deal of capital resources and an excess .. read more

Since the beginning of the digital printing era,methods have been sought to employ this knowledge for use in an elegant approach for producing circuitry. As long ago as the early 80s,companies .. read more

The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl .. read more

Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is .. read more

As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl .. read more

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The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl .. read more

The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHs directive. Certification to the QC 080000,the IECQ HSPM Specification, addresses the other 5 Haza .. read more

Companies are refining their processes to better ensure their compliance with environmental regulations evolving around the world. These processes reflect internal use models and collaborative .. read more

The Restriction of Hazardous Substances (RoHS) directive is requires companies to change the way they design, manufacture,track,and bring new products into the market. In order to provide the n .. read more

Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) and its predecessor WEEE directiv .. read more

In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al .. read more

New ROHS standards are forcing the electronics industry to find a replacement for leaded surface finishes. Even more rapidly than the legislative decision to move away from lead,electronics wer .. read more

A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints. Components,with leads finished with nickel-palladium-gold (NiPdAu) .. read more

There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These include electroplating,solder paste printing,evaporation and the direct a .. read more

Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c .. read more

The industry is in full transition towards lead-free assembly. Due to the different physical,mechanical and chemical properties of lead-free solder alloys,transitioning lead-free soldering with .. read more

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Nitrogen inerting has been widely reported to reduce defects in lead-free reflow soldering. However,many solder pastes available claim that they either do not need nitrogen or work equally well .. read more

The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f .. read more

Many existing and some new laminate material test methods that are being proven useful for determining a laminate material's suitability for use in higher temperature lead-free assembly process .. read more

A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per .. read more

The implementation of both RoHS and WEEE Directives by the European Union (EU) mandate that electrical and electronic products put on the market within the EU shall contain restrictive amounts .. read more

With the transition to high tin solders,and 100% tin finishes,some concerns have been raised about the possible occurrence of “Tin Pest”. This paper reviews the historical and recent data colle .. read more

This paper had as an aim to correlate the degree of voiding with reliability. Here the a purpose designed test vehicle was used,in which seven different solder pastes from three manufacturers w .. read more

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