Global Electronics Association Knowledge Hub

A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro .. read more

This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eute .. read more

This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does not depend on modifying the chemistry or physical environment of the platin .. read more

The technology for embedding components in PWBs will change the process how PWB are fabricated over the next few years. At the present time,polymer thick film is the most frequently used materi .. read more

Designs of new electronic products show a significant drive for smaller and more complex PWBs. This continuing trend of miniaturization affects components in the same way as for the connecting .. read more

According to Michael Shernerof of Scientific American (Jan. 2002) technology has advanced more in the past one century than in the previous one hundred centuries. Yet it seems from a technical .. read more

Some new alternative PWB surface finishes have been entering the industry over the past few years. In order for any new board surface finish to be accepted for general use,it must be approved b .. read more

This paper addresses the challenges of pre-production engineering,why the engineering department is viewed as a bottleneck in many PCB companies,and how a dedicated software system breaks the i .. read more

Electronic components are being used in increasingly more severe shock environments. This combined with an industry trend of increased component reliability to help reduce electronic system dow .. read more

With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure mechanism is gaining a lot of attention. Smaller geometries make the printed circuit bo .. read more

As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local .. read more

The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor chip design evolves into increasingly finer lines. First,it was studied how fine th .. read more

Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its .. read more

Utilizing continuous lamination techniques,new materials are being developed to meet demanding market requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effectiv .. read more

Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for a particular product. Many programs simply default to a standard test without .. read more

The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. For .. read more

This paper presents a comparison of several resin systems on different support reinforcements including on Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems co .. read more

The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter screening) is a major technological leap. Legend marking on printed circuit b .. read more

The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. T .. read more

The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern plating,because the plated metal height depends on the current density,which .. read more

Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be sev .. read more

This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional chemical mediation of plating processes,this process is electrically medi .. read more

Various requirements have developed for printed wiring boards regarding the minimum spacing between features. Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out .. read more

Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit boards are presented and discussed. Evolution of design guidelines and processing .. read more

A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and implemented by Motorola in partnership with its PWB supply chain. The technology is bas .. read more

The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical fiber into PCBs. .. read more

Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed wiring boards. This paper describes the technology and presents a case study demon .. read more

This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing or observed during manufacturing. Finite element models have been developed .. read more

A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the board. This can lead to difficulties in forming the external circuitry. Typical .. read more

Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis and PWB simulation become nowadays very pressing and key issues. Taking into a .. read more

Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings some interesting new solutions to age-old signal integrity (SI) concerns,and .. read more

In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be contained in smaller circuit areas requires that some of the passive components (re .. read more

Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1 currently dominating over photo defined,plasma etched and mechanically drilled m .. read more

Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper ions into the vias. This mass transport limitation is demonstrated by a rough .. read more

Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with improved dielectric properties. This paper focuses on new laminate materials with po .. read more

The electronics market demands for smaller,faster,more reliable and less costly products continues to fuel major changes in printed wiring board designs. Higher layer counts,increasing circuit .. read more

The combination of high speed and accuracy laser beam deflection,the know-how on wet chemical processes for Printed Circuit Boards (PCB’s),as well as CAD/CAM implementation for Laser direct Str .. read more

There is a contingent in the industry that feels reinforced substrates are needed to meet the performance requirements of HDI microvia technology. Concerns that non-reinforced resin coated foil .. read more

There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integr .. read more

Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities for very high speed applications. The challenge of opto-electronics and integration of ph .. read more

A new thermosetting resin system with modified cyanate ester resins having a loose cross-linked structure and alloyed with polymers was developed to provide low dielectric constant (Dk) and low .. read more

With the printed circuit board becoming increasingly complex,there is an ever-growing need to implement manufacturing standards that ensure high productivity at even higher yields. Factors such .. read more

??Machine Technology designed for the manufacture of Ultra Fine Line product ??Machine design provides clean production environment ??Latest State of the Art,Horizontal Wet Processing Equipment .. read more

Polyimides have proven their performance in electronic applications demanding high strength,increased durability, broader temperature ranges and exceptional chemical resistance. They serve as t .. read more

Prepregs used in the PCB industry possess various properties and need to be handled with care to maintain identical chemo -rheological properties to yield dimensionally stable laminates. A prep .. read more

We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen .. read more

Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding fine line requirements. Advantages for volume production of fine features below 50? .. read more

The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p .. read more

The rapid developments of IT equipment are placing increased demands on printed wiring boards (PWBs) in terms of high efficiency,high-density and lightweight. Industry experience has proven tha .. read more

An optical interconnection technology for multi-layer printed circuit boards is presented. The application of this technology enables onboard data rates of several Gbps whereas at the same time .. read more