Global Electronics Association Knowledge Hub

Shrinking profits and overcapacity have forced Electronics Manufacturers to squeeze every last penny out of Site Operations. To reduce conversion costs in a short timeframe,some facilities have .. read more

The slowdown in the electronics industry has allowed the management of electronics products manufacturers to dedicate time to reconsider their manufacturing strategy. For most of these companie .. read more

The economic environment in the electronics industry has changed dramatically over the last two years. The focus on the production floor has moved from increasing capacity to improving the yiel .. read more

For test engineers and managers,automated optical inspection (AOI) systems have emerged as a countermeasure to the growing threats of lost physical or electrical access to assembled PCB. AOI sy .. read more

The goal of SMT production is a zero-defect process in which flawed materials never get to the customer; however, in the ideal scenario,zero-defect production would mean that no flawed products .. read more

With the US military now committed to the phasing out of lead-containing solders via the Joint Group on Pollution Prevention (JG-PP) the electronics industry has moved beyond debate about wheth .. read more

This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental results for the optimization of a lead free SMT process for use in an Automotive Elect .. read more

Much of the environmental emphasis is currently on elimination of undesirable elements and compounds such as lead or halogens. The unintended consequences are huge in terms of diversion of reso .. read more

Circuit pack assembly involves the use of numerous materials and processes of environmental concern,including electronic components and associated assembly operations. It is necessary to be abl .. read more

The energy consumed during the reflow assembly of printed wiring board assemblies is expected to be environmentally significant within the solder product life-cycle. Wide differences in the mel .. read more

In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto .. read more

With the increasing demands of complex functions in a single chipset or microprocessor,the development of large size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year .. read more

Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC package terminals in terms of solder wetting ability. Current industrial .. read more

Electronic package size reduction and demand for increased functions within less board space make a challenge for the PCB designer to find smaller footprint components that will out perform lar .. read more

To meet the complex design requirements of the electronics industry,there is an increased need for large size high I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+ .. read more

In both the server and portable electronic markets,monotonic mechanical overstress has become a primary issue in manufacturing and field usage. Appropriate test methods,including four point ben .. read more

The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact heating technique is ideal for components that require careful handling whic .. read more

Wave and reflow soldering are well known,successfully proven mass soldering techniques. They offer the ability to solder printed circuit boards in high volumes quickly with low defect levels,pr .. read more

Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not provide enough clearance between SMT components and through-hole components to a .. read more

SMT rework machines are vital tools to many production engineers. They can be used to correct process errors and repair test failures. They can also be used to service and upgrade products retu .. read more

Surface Mount Rework systems have evolved into sophisticated thermal processing tools with the ability to accurately mimic original reflow oven profiles at a localized rework site. Features suc .. read more

Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little regard for flux deposition amounts. This use has led to the investigation of fluxes u .. read more

Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true whether one looks at the individual processes,such as stencil printing or plac .. read more

Yield and defect levels in the manufacturing of high-complexity and high-reliability Printed Circuit Board Assemblies (PCBAs) are extremely sensitive to variations in the process,component qual .. read more

The IPC 2501 Web Service Definition for the exchange of XML data provides an XML middleware integration environment that enables the deployment of IPC Computer Aided Manufacturing using XML (CA .. read more

All manufacturers in the printed circuit board (PCB) industry have experienced lack of reliability,maintenance,and performance problems with their machines. These challenges decrease manufactur .. read more

The Final assembly and packaging area experiences similar integration issues as the Printed Wiring Board – PWB manufacturing industry. Communications between production equipment is based on di .. read more

This paper discusses some of the new challenges associated with MSD Control in PCB assembly plants and offers a solution to reduce manufacturing costs and improve quality by automating this cri .. read more

All areas of manufacturing worldwide are impacted by the lead free initiative; none more than the reflow process. The higher melt temperatures and soak duration of leadless solder formulas requ .. read more

The Information and Electronic Warfare Systems business of BAE SYSTEMS Information and Electronic Systems Integration,Inc. (“BAE SYSTEMS IEWS”),a subsidiary of BAE SYSTEMS North America,is invo .. read more

During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of microelectronic assemblies. As an example the use of Flip Chips in advanced product .. read more

With the advent of hard die coated microelectronic assemblies; the ability to perform visual inspections for quality control and failure analysis has been seriously hindered. Analysts have had .. read more

The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of high-density packages using lead-free solder. The design,material,and assembly pr .. read more

The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa .. read more

Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL,NiAu, and OSP finishes are investigated in this study. Emphasis is placed on the determ .. read more

Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a .. read more

Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A typical construction includes the polyimide substrate,a thin vacuum deposited .. read more

Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester and epoxy based substrates because of the low temperature tolerance of th .. read more

A new oxide chemistry has been developed which solves many of the annoying properties of the currently available alternate oxides. The process is simple to operate,even simpler to maintain,requ .. read more

Multiple soldering assembly steps are essentially standard for PWBs based on current technologies and needs. A variety of tests are currently in use to evaluate the performance of finished PWBs .. read more

There are a number of organic,inorganic,and hybrid inorganic waveguide materials that are currently being used for a wide variety of optical interconnect applications. Depending upon the approa .. read more

The information age has arrived. A growing percentage of the Earth’s population now has access to pagers,cellular phones,computers,personal digital assistants (PDA’s),and a host of other electr .. read more

The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process capability panel designs,and a database that details the manufacturing capability, .. read more

BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the BGAs,which results in a TCE Mismatch between the components. If such an assembl .. read more

Copper migration such as conductive anodic filaments (CAF) has become a serious problem for printed wiring boards (PWBs). As the relation between CAF and matrix resin properties is not clear,th .. read more

This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ .. read more

In the best selling book “Who Moved My Cheese”, author Spencer Johnson tells the story of four characters—mice named Sniff,Scurry,Hem and Haw--who are in search of cheese within a maze. Once th .. read more

Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be used as the base materials for the printed wiring boards (PWBs) in el .. read more

Combination grid-prober (CGP) testing is being employed with increasing frequency as the density of SMD lands on boards continues to increase. A number of factors are at work. Grid testers,as a .. read more

In order to evaluate the relative merits of halogenated and alternative flame-retardants used in PWB’s,a comparison between several different PWB’s each having different flame-retardant package .. read more