Global Electronics Association Knowledge Hub

Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of printed circuit boards requires an improved quality of the dielectric in terms of cleanl .. read more

Predicting printed circuit board (PCB) thickness has not historically been a difficult task. With lower layer count boards you can afford for the prediction per layer to be wrong by a relativel .. read more

Horizontal conveyorized spray processing is the most prevalent method for the production of circuit panels in the industry today. However,as line and space requirements fall below 4 mils (100µm .. read more

Various Ag-filled epoxies were subjected to a current carrying capability study in which current was applied to the epoxies at temperatures of up to 170°C for 1008 hours. Test devices with Ag e .. read more

In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of cross-sectional area,current level and conductor temperature rise. These char .. read more

Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderabl .. read more

There are many board finishes in use today and the EMS provider must learn to use many,if not all of them. However,all board finishes do not perform the same during assembly and test operations .. read more

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The increased need for smaller,faster,and cheaper electronics has led the microelectronics industry to explore a number of new enabling technologies. Embedding passive components into multi-lay .. read more

Several factors are driving the need for buried passive components in printed circuit boards and chip carriers. Increasing frequency increases the difficulty in quieting noise by the use of sur .. read more

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The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with whi .. read more

Increasing component density and the requirements of higher performance electronic devices are driving the development of embedded passive devices in the printed circuit board (PCB). The benefi .. read more

As CPUs increase in performance,the number of passive components on the surface of the boards are increasing dramatically. To reduce the number of components,as well as improve the electrical p .. read more

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The last 10 years have seen the rise of lasers used in the interconnect industry to a point where their use is almost becoming ‘main stream’. As line width and spacing requirements become small .. read more

For faster,smaller,and high performance integrated circuits the new concept of buried bump interconnect substrates is required. We have developed B2itTM (buried bump interconnection technology .. read more

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The need for the high density provided by Build-up PWB installed in the mobile communication products requires the general trend towards a gradually smaller hole diameter. For the micro via dri .. read more

The evolution of interconnection systems for Printed Circuit Boards has been extremely interesting. The first connections were those generated in a copper foil on the surface of a single sided .. read more

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Despite the strong increase in demand for high-density circuit boards,very few manufacturers are offering microvia architectures in high volume. Current microvia technologies require significan .. read more

Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. Mic .. read more

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With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u .. read more

The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev .. read more

With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u .. read more

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In today's world of electronics the keywords are smaller,faster and cheaper. With more and more circuitry going onto existing circuit boards,the designers are searching for ways to contain this .. read more

Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp .. read more

It is becoming impossible to realize the latest mobile phones and other mobile equipment without Chip Size Packages (CSP) and other high-density semiconductor package technology. At present,the .. read more

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The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit .. read more

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With the advent of digitisation,networking,broadband telecommunication,and miniaturization in electronic set products,electronic devices are essentially required to deliver high electrical and .. read more

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Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio .. read more

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All-aromatic polyester,one of the super engineering plastics,is highly regarded as a base material of electronic circuit for its environmental compatibility,moisture resistance,dimensional stab .. read more

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A growing need is developing in the high-speed digital arena (backpanels,motherboards,line cards etc) for materials offering sufficient signal integrity for applications up to 10 Gbps. One solu .. read more

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Lead-free manufacturing is becoming an industry initiative for environmental and legislative reasons. Lead-Free processing is rather new to the industry and the development of a successful asse .. read more

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There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB). .. read more

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The texture of a tin deposit has been described as a key factor influencing whisker growth. Based on X-ray diffraction (XRD) and whisker growth data,this paper intends to show one possible mech .. read more

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