Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Development and Enhancement for Low Temperature Wave Soldering Solution
Sn-58Bi lead-free low-temperature solder (LTS) is regarded as a candidate for low-temperature assembly of electronics components, but its usage field is limited in Surface Mount Technology (
.. weiterlesen
Research on electroplating capability of multi-layer interconnected deep microvia PCB based on simulation model
Deep microporous crab legs and abnormal crystallization of coating are common defects in the electroplating process, which have a significant impact on the reliability of PCB products. In th
.. weiterlesen
Acid Copper Plating Additive Improving Flexibility of Wiring Design for High Current Density
Chiplet technology is rapidly applied to the latest devices as high performance of semiconductor devices is required. As chiplet becomes vibrant, IC packaging substrates become bigger and mo
.. weiterlesen
Tuning the Dielectric Constant (Dk) of Electronic Materials to Meet the Demands of Any Application
Applications for dielectric materials are becoming ever more demanding and complex, requiring careful planning & material selection by original equipment manufacturer (OEM) designers tha
.. weiterlesen
Advanced Heat Removal, An Electronics Overmolding Advantage
The growing demand for high-performance and compact electronic devices has led to increasing power densities, resulting in thermal challenges that impact packaging, performance, and reliabil
.. weiterlesen
Can Assembly Materials Help You Achieve Your Sustainability Objectives?
Today, the evaluation of circuit board assembly materials extends beyond their technical performance. An increasingly important aspect of this evaluation centers on whether the material help
.. weiterlesen
High Sustainable Content PC/ABS with Improved Environmental Stress Cracking Resistance
Polycarbonate/Acrylonitrile butadiene styrene (PC/ABS) blends are widely used engineering thermoplastic materials in electronic applications for TV frames, computer peripherals, phone housin
.. weiterlesen
Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage
Thermal-aging induced crack formation of fiber-reinforced polymer composites in printed circuit boards (PCBs) is a major failure mode affecting the reliability of electronic control units as
.. weiterlesen
Robust Quality Assurance Methodology for High-speed Channel Electrical Characterization
As the data rate is getting faster with the development of applications such as High Performance Computing (HPC), Data Center, and Artificial Intelligence (AI), it is found via stubs are aff
.. weiterlesen
Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks
Solder voids affect the thermal and electrical properties of solder joints, reducing their reliability. The main test for solder voids is non-destructive testing using X-ray transmission ima
.. weiterlesen
Investigation of Factors Influencing SR/Cu Interface Adhesion
Solder resist (SR) is applied to the outermost layer of printed circuit boards (PCBs) for surface protection and electrical insulation. It is crucial for the reliability of PCBs to ensure ro
.. weiterlesen
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing
Metals have long been used as thermal interface materials (TIMs). Due to their high reliability and thermal conductivity, metal TIMs are excellent solutions for heat dissipation in electroni
.. weiterlesen
A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
There is a global consensus that the environmental impact of electronics needs to be reduced. The first step towards this goal is identifying the environmental hotspots in electronics manufa
.. weiterlesen
Development of Flux for Fine Bump Array by Controlling Rheological Properties
Flux which facilitates fine bump development and bump pitch was developed. The purpose was to achieve fine bump and bump pitch by securing rheological properties that are similar to, or an i
.. weiterlesen
Research on the Performance and Recycling of a Novel Halogen-free Degradable Copper Clad Laminate
Thermosetting epoxy resin is widely used in electronic materials for its excellent insulation, heat resistance, mechanical properties, chemical resistance and processability. However, the no
.. weiterlesen
Advanced Package Substrate Embedding Thin Non-Silicon Substrates of Fine Lines
2.5D is representative advanced packaging technologies that combine multiple integrated circuit dies into one package using silicon interposer. And 2.1D bridge technology, which inserts high
.. weiterlesen
Electronic Essentials 101: What You Think You Know - and More
The July 23rd webinar, “Electronic Essentials 101: What You Think You Know – and More,” presented by Greg Merrill, offered a practical refresher on core electronics concepts like voltage, cu
.. weiterlesen
iNEMI 2023 Board Assembly++CPU Socket Technology Roadmap
This article is a series of studies on a new generation of CPU socket challenges and component interconnect technology for high-end computer product applications. These products encompass co
.. weiterlesen
Achieving Equipment Orchestration Through Equipment Integration
In modern manufacturing, the seamless coordination and efficient control of Surface Mount Technology (SMT) production lines rely significantly on strong communication and interoperability am
.. weiterlesen
High Speed Material Asymmetric Mixed Pressure Warping Analysis of Server Motherboard
When the traditional server motherboard is designed in laminated structure, in order to ensure the symmetry of laminated structure, each layer is designed with the same material. With the up
.. weiterlesen
QFN Assembly Reliability Under a New HALT Test Method
This paper first presents a summary of cycles-to-failures (CTFs) test data based on Weibull plots and failure analysis generated for small to large Quad Flat No-Lead (QFN) packages, which we
.. weiterlesen
Research on the Laminating Technology of Embedded Optical Fiber Array PCB
Optical fiber array can realize multi-channel optical signal transmission. In the process of embedded PCB, the difficulty lies in laminating. The structure of the optical fiber array determi
.. weiterlesen
Development of Ring Ferrite Embedded PCB with High Precision Inductance
Embedding the magnetic core into the PCB can reduce the occupation of PCB area by some inductive devices, but there is often a risk of magnetic core fragmentation and PCB delamination. This
.. weiterlesen
Sustainable Smart Surfaces
The scope of this paper is sustainability of in-mold electronics. This technology has many benefits, such as decreasing material usage, using additive manufacturing processes and simplifying
.. weiterlesen
Understanding PCB Microsection Preparation and Analysis 101
On June 18, 2025, industry expert William Graver led an informative session on the fundamentals of PCB microsection preparation and analysis. This introductory webinar covered essential tech
.. weiterlesen
News from Your Global Electronics Association
June 23, 2025 began a new chapter for IPC as it officially became the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “B
.. weiterlesen
Preventing Manufacturing Defects & Product Failures
This session, held on November 15, 2022, introduced the major updates in IPC/WHMA-A-620 Revision D. Attendees reviewed key changes, clarified acceptance criteria, and explored how the revisi
.. weiterlesen
Troubleshooting SMT Yield Problems and Failure Analysis
On November 2, 2022, this webinar covered essential best practices for wire harness manufacturing, offering practical insights to improve quality, efficiency, and reliability. Topics include
.. weiterlesen
A Deep Dive of Applying AI in Electronic Manufacturing
With AI rapidly transforming smart manufacturing, the May 14, 2025 webinar examined how electronics manufacturers can effectively integrate Computer Vision AI and Generative AI to boost qual
.. weiterlesen
The AI Advantage in PCB Design: Techniques and Trends
This February 12, 2025 webinar, led by John Watson, explored the growing role of artificial intelligence in revolutionizing PCB design. The session demonstrated how AI is improving speed, pr
.. weiterlesen
Development and Enhancement for Low Temperature Wave Soldering Solution
Sn-58Bi lead-free low-temperature solder (LTS) is regarded as a candidate for low-temperature assembly of electronics components, but its usage field is limited in Surface Mount Technology (
.. weiterlesen
Research on electroplating capability of multi-layer interconnected deep microvia PCB based on simulation model
Deep microporous crab legs and abnormal crystallization of coating are common defects in the electroplating process, which have a significant impact on the reliability of PCB products. In th
.. weiterlesen
Acid Copper Plating Additive Improving Flexibility of Wiring Design for High Current Density
Chiplet technology is rapidly applied to the latest devices as high performance of semiconductor devices is required. As chiplet becomes vibrant, IC packaging substrates become bigger and mo
.. weiterlesen
Tuning the Dielectric Constant (Dk) of Electronic Materials to Meet the Demands of Any Application
Applications for dielectric materials are becoming ever more demanding and complex, requiring careful planning & material selection by original equipment manufacturer (OEM) designers tha
.. weiterlesen
Advanced Heat Removal, An Electronics Overmolding Advantage
The growing demand for high-performance and compact electronic devices has led to increasing power densities, resulting in thermal challenges that impact packaging, performance, and reliabil
.. weiterlesen
Can Assembly Materials Help You Achieve Your Sustainability Objectives?
Today, the evaluation of circuit board assembly materials extends beyond their technical performance. An increasingly important aspect of this evaluation centers on whether the material help
.. weiterlesen
High Sustainable Content PC/ABS with Improved Environmental Stress Cracking Resistance
Polycarbonate/Acrylonitrile butadiene styrene (PC/ABS) blends are widely used engineering thermoplastic materials in electronic applications for TV frames, computer peripherals, phone housin
.. weiterlesen
Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage
Thermal-aging induced crack formation of fiber-reinforced polymer composites in printed circuit boards (PCBs) is a major failure mode affecting the reliability of electronic control units as
.. weiterlesen
Robust Quality Assurance Methodology for High-speed Channel Electrical Characterization
As the data rate is getting faster with the development of applications such as High Performance Computing (HPC), Data Center, and Artificial Intelligence (AI), it is found via stubs are aff
.. weiterlesen
Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks
Solder voids affect the thermal and electrical properties of solder joints, reducing their reliability. The main test for solder voids is non-destructive testing using X-ray transmission ima
.. weiterlesen
Investigation of Factors Influencing SR/Cu Interface Adhesion
Solder resist (SR) is applied to the outermost layer of printed circuit boards (PCBs) for surface protection and electrical insulation. It is crucial for the reliability of PCBs to ensure ro
.. weiterlesen
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing
Metals have long been used as thermal interface materials (TIMs). Due to their high reliability and thermal conductivity, metal TIMs are excellent solutions for heat dissipation in electroni
.. weiterlesen
A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
There is a global consensus that the environmental impact of electronics needs to be reduced. The first step towards this goal is identifying the environmental hotspots in electronics manufa
.. weiterlesen
Development of Flux for Fine Bump Array by Controlling Rheological Properties
Flux which facilitates fine bump development and bump pitch was developed. The purpose was to achieve fine bump and bump pitch by securing rheological properties that are similar to, or an i
.. weiterlesen
Research on the Performance and Recycling of a Novel Halogen-free Degradable Copper Clad Laminate
Thermosetting epoxy resin is widely used in electronic materials for its excellent insulation, heat resistance, mechanical properties, chemical resistance and processability. However, the no
.. weiterlesen
Advanced Package Substrate Embedding Thin Non-Silicon Substrates of Fine Lines
2.5D is representative advanced packaging technologies that combine multiple integrated circuit dies into one package using silicon interposer. And 2.1D bridge technology, which inserts high
.. weiterlesen
Electronic Essentials 101: What You Think You Know - and More
The July 23rd webinar, “Electronic Essentials 101: What You Think You Know – and More,” presented by Greg Merrill, offered a practical refresher on core electronics concepts like voltage, cu
.. weiterlesen
iNEMI 2023 Board Assembly++CPU Socket Technology Roadmap
This article is a series of studies on a new generation of CPU socket challenges and component interconnect technology for high-end computer product applications. These products encompass co
.. weiterlesen
Achieving Equipment Orchestration Through Equipment Integration
In modern manufacturing, the seamless coordination and efficient control of Surface Mount Technology (SMT) production lines rely significantly on strong communication and interoperability am
.. weiterlesen
High Speed Material Asymmetric Mixed Pressure Warping Analysis of Server Motherboard
When the traditional server motherboard is designed in laminated structure, in order to ensure the symmetry of laminated structure, each layer is designed with the same material. With the up
.. weiterlesen
QFN Assembly Reliability Under a New HALT Test Method
This paper first presents a summary of cycles-to-failures (CTFs) test data based on Weibull plots and failure analysis generated for small to large Quad Flat No-Lead (QFN) packages, which we
.. weiterlesen
Research on the Laminating Technology of Embedded Optical Fiber Array PCB
Optical fiber array can realize multi-channel optical signal transmission. In the process of embedded PCB, the difficulty lies in laminating. The structure of the optical fiber array determi
.. weiterlesen
Development of Ring Ferrite Embedded PCB with High Precision Inductance
Embedding the magnetic core into the PCB can reduce the occupation of PCB area by some inductive devices, but there is often a risk of magnetic core fragmentation and PCB delamination. This
.. weiterlesen
Sustainable Smart Surfaces
The scope of this paper is sustainability of in-mold electronics. This technology has many benefits, such as decreasing material usage, using additive manufacturing processes and simplifying
.. weiterlesen
Understanding PCB Microsection Preparation and Analysis 101
On June 18, 2025, industry expert William Graver led an informative session on the fundamentals of PCB microsection preparation and analysis. This introductory webinar covered essential tech
.. weiterlesen
News from Your Global Electronics Association
June 23, 2025 began a new chapter for IPC as it officially became the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “B
.. weiterlesen
Preventing Manufacturing Defects & Product Failures
This session, held on November 15, 2022, introduced the major updates in IPC/WHMA-A-620 Revision D. Attendees reviewed key changes, clarified acceptance criteria, and explored how the revisi
.. weiterlesen
Troubleshooting SMT Yield Problems and Failure Analysis
On November 2, 2022, this webinar covered essential best practices for wire harness manufacturing, offering practical insights to improve quality, efficiency, and reliability. Topics include
.. weiterlesen
A Deep Dive of Applying AI in Electronic Manufacturing
With AI rapidly transforming smart manufacturing, the May 14, 2025 webinar examined how electronics manufacturers can effectively integrate Computer Vision AI and Generative AI to boost qual
.. weiterlesen
The AI Advantage in PCB Design: Techniques and Trends
This February 12, 2025 webinar, led by John Watson, explored the growing role of artificial intelligence in revolutionizing PCB design. The session demonstrated how AI is improving speed, pr
.. weiterlesen