Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences Topic/Category: Factory of the Future OR Emerging Technologies
It has been demonstrated it is possible to combine design, process, and metrology information to create machine learning models that accurately predict the behavior of individual products in
.. weiterlesen
Reliability Validation of Direct-Write Printed RF Devices
Additive manufacturing (AM) methods to fabricate and repair printed hybrid electronic (PHE) components and interconnect systems create compelling opportunities in 3D curvilinear architecture
.. weiterlesen
The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly
Lower temperature soldering has been regarded as one of the most effective ways to reduce warpage risk. Use of lower-temperature solders, including a BiSnAgCu eutectic and two In-containing,
.. weiterlesen
Liquid Metal Patterning for Electronic Circuits and Thermal Management
Gallium-based liquid metals have remarkable properties: melting points below room temperature, wide conductivity, water-like viscosity, low toxicity, and effectively zero vapor pressure (the
.. weiterlesen
Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - a Revealing Round Robin Study
Voiding and solder coverage in SMT solder joints remain a matter of (sometimes emotional) debate in automotive electronics. Meanwhile voiding/solder coverage requirements have been introduce
.. weiterlesen
Research on High-speed Material Insertion Loss in Server Platform
At present, with the rapid change of the server market, Eagle Stream platform chipset, which changes the traditional practice of Whiley platform material selection and stack mode compared wi
.. weiterlesen
Achieving a Successful ENEPIG Finished PCB under Revision A of IPC-4556
The 4-14F IPC Standards Committee are close to finalizing (at the time of writing) a revision to the IPC 4556 specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPI
.. weiterlesen
Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management Applications
Continued microelectronic miniaturization has resulted in higher power density, increasing the need for high performance thermal management. One solution for board-level thermal management i
.. weiterlesen
New Solutions for Inclusion-free Copper Filling Of Through Vias for Latest Generation Substrate Designs
In advanced printed circuit board and IC substrate production, the metallization for blind vias and through vias (also called through holes – TH) is essential for the build-up of the PCB or
.. weiterlesen
Optimizing the Interconnect: Laser Drilling and Plating Chemistry Synergies for Via Formation
In HDI (high density interconnect) PCB (printed circuit board) and IC Substrate (integrated circuit substrate), a successfully formed and plated laser via is crucial to the overall system an
.. weiterlesen
Maximize Throughput with Innovative Laser/Optics Configuration, Precision Pulse Shaping, and Steering Designed for ABF Materials
Flip chip ball grid array (FCBGA) package substrate components provide the critical building blocks for electronic devices and high-performance computers. They will enable the future of supe
.. weiterlesen
Strategies for Enhanced Reliability in the Cleaning of Vented Components
The need for cleaning circuit card assemblies is well understood for achieving optimum reliability; contamination present on assemblies can lead to detrimental effects, including dendritic g
.. weiterlesen
On-Demand Manufacture of Small Satellites through Advancements in Direct Digital Manufacturing
Direct Digital Manufacturing (DDM) is a growing field in which Additively Manufactured Electronics (AMEs) are manufactured on a single machine through a variety of additive and subtractive t
.. weiterlesen
Optimizing Performance and Reliability: Key Factors for Cleaning in Immersion-Cooling Applications
Thorough cleaning processes are necessary due to their critical role in ensuring optimal system performance. Residual contaminants can significantly compromise printed circuit card assemblie
.. weiterlesen
Implementation of 3D Printed Near Chip-Scale Interposers into X-Band Dual Channel MMIC Assembly
Additive Manufacturing (AM) offers numerous benefits over traditional manufacturing methods, such as realization of unique form factors, decreased waste in material, decreased cost and lead
.. weiterlesen
Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators
At millimeter-wave frequencies, considerations of electrical performance and PCB durability may often lead to contradictory requirements with respect to copper foil materials and chemical pr
.. weiterlesen
Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly
As the electronics industry continually strives for innovation and efficiency in assembly and rework processes, the exploration of low temperature (LT) solder alloys has gained significant a
.. weiterlesen
Development and Enhancement of Low Temperature Soldering Solution for SMT
The global interest in reducing CO2, as demonstrated by carbon neutrality, is growing in order to achieve a low-carbon society. Electronic packaging industry is seeing the importance of SnBi
.. weiterlesen
Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes for Complex Electronics Assemblies
Solder paste jetting is a popular and innovative method for applying solder paste in electronic assembly, especially for modern, miniaturized, and complex electronic assemblies. This techniq
.. weiterlesen
Laser depaneling is a relatively clean separation process but nevertheless the knowledge of potential influence factors on the technical cleanliness...
Continuous pursuits for higher data rate, larger network capacity, lower latency communication, and better energy efficiency have motivated the rapid development of high-frequency communicat
.. weiterlesen
Technical Cleanliness of FR4 Substrates and its Influence Factors for Laser Depaneling
Laser depaneling is a relatively clean separation process but nevertheless the knowledge of potential influence factors on the technical cleanliness is of central importance to find the opti
.. weiterlesen
Research On Influence Factors Of Expansion And Shrinkage Compensation For Multilayer PCB
The multilayer PCB is prone to poor expansion and shrinkage due to the influence of high temperature and high pressure during lamination process, which may cause risk of abnormal quality. Th
.. weiterlesen
Study of Copper Thickness Distribution in Through Hole at the Early Stage of Copper Filled Plating
In laptop and tablet CPU/GPU applications, package thickness tends to be thinner since it brings lighter weight, lower product thickness, and shorter interconnection distance. To decrease pa
.. weiterlesen
Reflow Soldering Performance Improvement of Polymer Aluminum Electrolytic Capacitor
The reflow soldering performance of polymer aluminum electrolytic capacitors have a direct impact on their electrical performance. By analyzing the mechanism of capacitor bulges, improve the
.. weiterlesen
Effect of Soft Touch Caused by Manual Handling on Substrate Warpage
Flip chip BGA, interconnect with semiconductor chips and mainboards, to serve the interconnection of electronic products. This paper is about the study of one of the important warpage modula
.. weiterlesen
Advanced Ferric Sulfate Differential Etching: Meeting the Challenges of Electronics Miniaturization
In the pursuit of ever finer lines and spaces to advance technology's power and efficiency, the substrate and substrate-like production processes must adapt to meet these demands while caref
.. weiterlesen
The Surface Treatment for Semiconductor Substrate Using Low-Temperature Synthesis of Few Layer Graphene
The protection of metallic substrates from reactive environments is necessary for semiconductor packages, which are mainly made of copper metal. Conventionally, plating with novel metals suc
.. weiterlesen
Fill the Void VII: A Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints
This study is part of a series of papers on mitigation of voids in solder joints. Voiding is an ongoing concern for printed circuit board assembly (PCBA) manufacturers. As bottom terminated
.. weiterlesen
The study of TCNCP solder joint quality with flip chip ETS
ETS (Embedded Trace Substrate) is one of advanced substrate design that enable to make fine width and space. The Cu trace open defect on ETS layer (L01) revealed by this OSP micro etching is
.. weiterlesen
Warpage Estimation of Organic Interposer for HPC Application
The explosion of data in the 4th Industrial Revolution has increased the importance of high-performance computing (HPC). HPC requires high-density I/O count to be formed in small area, but t
.. weiterlesen
Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences Topic/Category: Factory of the Future OR Emerging Technologies
It has been demonstrated it is possible to combine design, process, and metrology information to create machine learning models that accurately predict the behavior of individual products in
.. weiterlesen
Reliability Validation of Direct-Write Printed RF Devices
Additive manufacturing (AM) methods to fabricate and repair printed hybrid electronic (PHE) components and interconnect systems create compelling opportunities in 3D curvilinear architecture
.. weiterlesen
The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly
Lower temperature soldering has been regarded as one of the most effective ways to reduce warpage risk. Use of lower-temperature solders, including a BiSnAgCu eutectic and two In-containing,
.. weiterlesen
Liquid Metal Patterning for Electronic Circuits and Thermal Management
Gallium-based liquid metals have remarkable properties: melting points below room temperature, wide conductivity, water-like viscosity, low toxicity, and effectively zero vapor pressure (the
.. weiterlesen
Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - a Revealing Round Robin Study
Voiding and solder coverage in SMT solder joints remain a matter of (sometimes emotional) debate in automotive electronics. Meanwhile voiding/solder coverage requirements have been introduce
.. weiterlesen
Research on High-speed Material Insertion Loss in Server Platform
At present, with the rapid change of the server market, Eagle Stream platform chipset, which changes the traditional practice of Whiley platform material selection and stack mode compared wi
.. weiterlesen
Achieving a Successful ENEPIG Finished PCB under Revision A of IPC-4556
The 4-14F IPC Standards Committee are close to finalizing (at the time of writing) a revision to the IPC 4556 specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPI
.. weiterlesen
Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management Applications
Continued microelectronic miniaturization has resulted in higher power density, increasing the need for high performance thermal management. One solution for board-level thermal management i
.. weiterlesen
New Solutions for Inclusion-free Copper Filling Of Through Vias for Latest Generation Substrate Designs
In advanced printed circuit board and IC substrate production, the metallization for blind vias and through vias (also called through holes – TH) is essential for the build-up of the PCB or
.. weiterlesen
Optimizing the Interconnect: Laser Drilling and Plating Chemistry Synergies for Via Formation
In HDI (high density interconnect) PCB (printed circuit board) and IC Substrate (integrated circuit substrate), a successfully formed and plated laser via is crucial to the overall system an
.. weiterlesen
Maximize Throughput with Innovative Laser/Optics Configuration, Precision Pulse Shaping, and Steering Designed for ABF Materials
Flip chip ball grid array (FCBGA) package substrate components provide the critical building blocks for electronic devices and high-performance computers. They will enable the future of supe
.. weiterlesen
Strategies for Enhanced Reliability in the Cleaning of Vented Components
The need for cleaning circuit card assemblies is well understood for achieving optimum reliability; contamination present on assemblies can lead to detrimental effects, including dendritic g
.. weiterlesen
On-Demand Manufacture of Small Satellites through Advancements in Direct Digital Manufacturing
Direct Digital Manufacturing (DDM) is a growing field in which Additively Manufactured Electronics (AMEs) are manufactured on a single machine through a variety of additive and subtractive t
.. weiterlesen
Optimizing Performance and Reliability: Key Factors for Cleaning in Immersion-Cooling Applications
Thorough cleaning processes are necessary due to their critical role in ensuring optimal system performance. Residual contaminants can significantly compromise printed circuit card assemblie
.. weiterlesen
Implementation of 3D Printed Near Chip-Scale Interposers into X-Band Dual Channel MMIC Assembly
Additive Manufacturing (AM) offers numerous benefits over traditional manufacturing methods, such as realization of unique form factors, decreased waste in material, decreased cost and lead
.. weiterlesen
Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators
At millimeter-wave frequencies, considerations of electrical performance and PCB durability may often lead to contradictory requirements with respect to copper foil materials and chemical pr
.. weiterlesen
Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly
As the electronics industry continually strives for innovation and efficiency in assembly and rework processes, the exploration of low temperature (LT) solder alloys has gained significant a
.. weiterlesen
Development and Enhancement of Low Temperature Soldering Solution for SMT
The global interest in reducing CO2, as demonstrated by carbon neutrality, is growing in order to achieve a low-carbon society. Electronic packaging industry is seeing the importance of SnBi
.. weiterlesen
Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes for Complex Electronics Assemblies
Solder paste jetting is a popular and innovative method for applying solder paste in electronic assembly, especially for modern, miniaturized, and complex electronic assemblies. This techniq
.. weiterlesen
Laser depaneling is a relatively clean separation process but nevertheless the knowledge of potential influence factors on the technical cleanliness...
Continuous pursuits for higher data rate, larger network capacity, lower latency communication, and better energy efficiency have motivated the rapid development of high-frequency communicat
.. weiterlesen
Technical Cleanliness of FR4 Substrates and its Influence Factors for Laser Depaneling
Laser depaneling is a relatively clean separation process but nevertheless the knowledge of potential influence factors on the technical cleanliness is of central importance to find the opti
.. weiterlesen
Research On Influence Factors Of Expansion And Shrinkage Compensation For Multilayer PCB
The multilayer PCB is prone to poor expansion and shrinkage due to the influence of high temperature and high pressure during lamination process, which may cause risk of abnormal quality. Th
.. weiterlesen
Study of Copper Thickness Distribution in Through Hole at the Early Stage of Copper Filled Plating
In laptop and tablet CPU/GPU applications, package thickness tends to be thinner since it brings lighter weight, lower product thickness, and shorter interconnection distance. To decrease pa
.. weiterlesen
Reflow Soldering Performance Improvement of Polymer Aluminum Electrolytic Capacitor
The reflow soldering performance of polymer aluminum electrolytic capacitors have a direct impact on their electrical performance. By analyzing the mechanism of capacitor bulges, improve the
.. weiterlesen
Effect of Soft Touch Caused by Manual Handling on Substrate Warpage
Flip chip BGA, interconnect with semiconductor chips and mainboards, to serve the interconnection of electronic products. This paper is about the study of one of the important warpage modula
.. weiterlesen
Advanced Ferric Sulfate Differential Etching: Meeting the Challenges of Electronics Miniaturization
In the pursuit of ever finer lines and spaces to advance technology's power and efficiency, the substrate and substrate-like production processes must adapt to meet these demands while caref
.. weiterlesen
The Surface Treatment for Semiconductor Substrate Using Low-Temperature Synthesis of Few Layer Graphene
The protection of metallic substrates from reactive environments is necessary for semiconductor packages, which are mainly made of copper metal. Conventionally, plating with novel metals suc
.. weiterlesen
Fill the Void VII: A Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints
This study is part of a series of papers on mitigation of voids in solder joints. Voiding is an ongoing concern for printed circuit board assembly (PCBA) manufacturers. As bottom terminated
.. weiterlesen
The study of TCNCP solder joint quality with flip chip ETS
ETS (Embedded Trace Substrate) is one of advanced substrate design that enable to make fine width and space. The Cu trace open defect on ETS layer (L01) revealed by this OSP micro etching is
.. weiterlesen
Warpage Estimation of Organic Interposer for HPC Application
The explosion of data in the 4th Industrial Revolution has increased the importance of high-performance computing (HPC). HPC requires high-density I/O count to be formed in small area, but t
.. weiterlesen