Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Designing for Success: How DFM, DFT, and DFA Impact PCB Production
On January 22, 2025, this webinar introduced key PCB design principles—Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). Attendees learned how applying th
.. weiterlesen
Assessing Electronics with Advanced 3D X-ray Microscopy Techniques
This December 11, 2024 webinar showcased cutting-edge approaches for inspecting electronic assemblies using 3D X-ray microscopy, nanoscale imaging, and deep learning. Attendees learned how t
.. weiterlesen
Stable Model-based & Constrained PCB Design
As cybersecurity threats continue to grow across global supply chains, the November 13, 2024, webinar offered a timely introduction to IPC-1792, the new standard addressing cybersecurity in
.. weiterlesen
Cyber Disaster Recovery Exercises for Electronics Manufacturers
On October 31, 2024, this webinar explored the vital role of frontline response and preparedness in managing cyber threats within electronics manufacturing. Attendees learned how early detec
.. weiterlesen
A Close Look at IPC X-Ray Inspection Guidelines for BGAs
In this informative session held on September 18, 2024, participants explored the latest revisions to IPC-6012 and IPC-A-600—essential standards for the qualification and acceptance of rigid
.. weiterlesen
A View from the Top: Succeeding as Women Engineers in Microelectronics
On August 14, 2024, IPC hosted an inspiring webinar celebrating the accomplishments of two outstanding women in the electronics industry—Cheah Soo Lan, Master IPC Trainer for CID/CID+, and D
.. weiterlesen
Mitigating Hi-Rel Counterfeit Documentation Risks
In advance of his August IPC Counterfeit Electronic Parts Mitigation course, Anthony J. Bryant hosted a focused webinar on July 31, 2024, examining the critical issue of counterfeit document
.. weiterlesen
Understanding PCB Board Fabrication for Engineers
On June 19, 2024, this webinar offered a comprehensive look into the PCB board fabrication process, following the journey of design artwork after it reaches the board shop. Tailored for Elec
.. weiterlesen
Creep Corrosion in Electronics – A Panel Discussion
On May 1, 2024, a panel of industry experts discussed the root causes of creep corrosion in electronics, along with relevant testing methods and effective mitigation strategies. The session
.. weiterlesen
Performance Improvement Through Lean Best Practices
On March 13, 2024, this webinar explored the critical role of solder paste printing in surface mount technology (SMT). The session covered key process factors, common defects, and best pract
.. weiterlesen
Overcoming the Challenges for Implementing IPC-J-STD-001 in Your Factory
On February 7, 2024, this webinar addressed common challenges manufacturers face when implementing IPC-J-STD-001 in their factories. The session shared practical solutions and insights to he
.. weiterlesen
Test Methods to Validate Acceptable Levels of Flux and Other Process Residues on Production Assemblies
On January 10, 2024, this webinar covered best practices for minimizing and managing flux residues in electronics manufacturing. It addressed risks associated with low standoff components, m
.. weiterlesen
First Steps in Manufacturing Cybersecurity for Non-Security Professionals
On December 6, 2023, this webinar provided non-professional cybersecurity specialists with essential information and awareness to better understand today’s cybersecurity landscape—no extensi
.. weiterlesen
Additively Manufactured Electronics Technology
On November 15, 2023, we provided an overview of Additively Manufactured Electronics (AME)—a technology that enables 3D printing of functional circuit boards and advanced electronic devices.
.. weiterlesen
Delivering Engaging Technical Presentations
Held on October 31, 2023, this webinar featured Dr. Bev Christian presenting "Delivering Engaging Technical Presentations." The session offered practical strategies for improving the clarity
.. weiterlesen
Technical Paper Writing: Preparing to Publish Work for a Conference
On September 28, 2023, Stanton Rak, Ph.D., presented a webinar titled "Technical Paper Writing: Industry Best Practices for Conference Manuscripts." In this session, Dr. Rak shared expert gu
.. weiterlesen
Inspection and Failure Analysis of BTCs (Bottom Termination Components
On August 30, 2023, IPC hosted a webinar titled "Inspection and Failure Analysis of Bottom Termination Components", presented by William Graver. The session delved into the challenges associ
.. weiterlesen
Using Technology to Increase Throughput and Reduce Errors in Wire Harness Production
This technical webinar, held on June 27, 2023, explored technologies that help wire harness assemblers reduce errors and improve efficiency. Topics included guided insertion of seal plugs an
.. weiterlesen
Voids in Solder Joints and Their Impact on Assembly Reliability
This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610
.. weiterlesen
CCA SMT Cleaning Processes and Solder-flux Effects For Mil/Aero Applications
Held on April 18, 2023, this webinar explored how surface mount component and package design can impact the effectiveness of cleaning circuit card assemblies (CCAs), especially for Mil/Aero
.. weiterlesen
HDI and Ultra HDI - Critical aspects needed to support IC substrates and Advanced Packaging
The webinar, presented by Mike Carano on March 29, 2023, delved into the essential considerations for implementing High-Density Interconnect (HDI) and Ultra HDI technologies in the context o
.. weiterlesen
Introduction to Machine Data Analytics in the EMS Industry
This webinar, held on March 15, 2023, covered a brief introduction to the types of machine data available in an EMS factory and how to set up an analytics environment using freely available,
.. weiterlesen
Electronic Textile Evaluation Methods for Product Engineers and Designers
On December 14, 2022, Madison Maxey, founder and technical lead of Loomia, shared highlights of her IPC APEX EXPO 2023 professional development course. The course provided a primer for elect
.. weiterlesen
Gold-Aluminum Wire Bonding Process, Quality and Reliability
This webinar, held on December 7, 2022, previewed the IPC APEX EXPO 2023 professional development course, “Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Dr. Syed Sajid Ahmad,
.. weiterlesen
Wired for Change: Electronics Industry Sentiment on Sustainability
In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a
.. weiterlesen
NAVIGATING E-MOBILITY SUSTAINABILITY: EVOLVING COMPLIANCE AND ESG REQUIREMENTS FOR ELECTRONICS SUPPLIERS
This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background abou
.. weiterlesen
Unlocking AI for Automated Optical Inspection
Artificial intelligence (AI) is the theory and development of computer systems able to perform tasks that normally require human intelligence. This includes visual perception and pattern rec
.. weiterlesen
Why Double Materiality Assessments Matter: Compliance and Competitive Advantage
IPC International, Inc. recognizes the challenges and opportunities facing companies in the electronics industry in the evolving practice of sustainability, most notably, the obligations est
.. weiterlesen
AI-BASED DATA CENTERS FOR THE UNITED STATES
As the United States turns to generative artificial intelligence (AI) to drive a wide range of manufacturing applications, it is critical to ensure the strength of assembly capabilities to r
.. weiterlesen
ADVANCED PACKAGING TO BOARD LEVEL INTEGRATION – NEEDS AND CHALLENGES
HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with ex
.. weiterlesen
Designing for Success: How DFM, DFT, and DFA Impact PCB Production
On January 22, 2025, this webinar introduced key PCB design principles—Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). Attendees learned how applying th
.. weiterlesen
Assessing Electronics with Advanced 3D X-ray Microscopy Techniques
This December 11, 2024 webinar showcased cutting-edge approaches for inspecting electronic assemblies using 3D X-ray microscopy, nanoscale imaging, and deep learning. Attendees learned how t
.. weiterlesen
Stable Model-based & Constrained PCB Design
As cybersecurity threats continue to grow across global supply chains, the November 13, 2024, webinar offered a timely introduction to IPC-1792, the new standard addressing cybersecurity in
.. weiterlesen
Cyber Disaster Recovery Exercises for Electronics Manufacturers
On October 31, 2024, this webinar explored the vital role of frontline response and preparedness in managing cyber threats within electronics manufacturing. Attendees learned how early detec
.. weiterlesen
A Close Look at IPC X-Ray Inspection Guidelines for BGAs
In this informative session held on September 18, 2024, participants explored the latest revisions to IPC-6012 and IPC-A-600—essential standards for the qualification and acceptance of rigid
.. weiterlesen
A View from the Top: Succeeding as Women Engineers in Microelectronics
On August 14, 2024, IPC hosted an inspiring webinar celebrating the accomplishments of two outstanding women in the electronics industry—Cheah Soo Lan, Master IPC Trainer for CID/CID+, and D
.. weiterlesen
Mitigating Hi-Rel Counterfeit Documentation Risks
In advance of his August IPC Counterfeit Electronic Parts Mitigation course, Anthony J. Bryant hosted a focused webinar on July 31, 2024, examining the critical issue of counterfeit document
.. weiterlesen
Understanding PCB Board Fabrication for Engineers
On June 19, 2024, this webinar offered a comprehensive look into the PCB board fabrication process, following the journey of design artwork after it reaches the board shop. Tailored for Elec
.. weiterlesen
Creep Corrosion in Electronics – A Panel Discussion
On May 1, 2024, a panel of industry experts discussed the root causes of creep corrosion in electronics, along with relevant testing methods and effective mitigation strategies. The session
.. weiterlesen
Performance Improvement Through Lean Best Practices
On March 13, 2024, this webinar explored the critical role of solder paste printing in surface mount technology (SMT). The session covered key process factors, common defects, and best pract
.. weiterlesen
Overcoming the Challenges for Implementing IPC-J-STD-001 in Your Factory
On February 7, 2024, this webinar addressed common challenges manufacturers face when implementing IPC-J-STD-001 in their factories. The session shared practical solutions and insights to he
.. weiterlesen
Test Methods to Validate Acceptable Levels of Flux and Other Process Residues on Production Assemblies
On January 10, 2024, this webinar covered best practices for minimizing and managing flux residues in electronics manufacturing. It addressed risks associated with low standoff components, m
.. weiterlesen
First Steps in Manufacturing Cybersecurity for Non-Security Professionals
On December 6, 2023, this webinar provided non-professional cybersecurity specialists with essential information and awareness to better understand today’s cybersecurity landscape—no extensi
.. weiterlesen
Additively Manufactured Electronics Technology
On November 15, 2023, we provided an overview of Additively Manufactured Electronics (AME)—a technology that enables 3D printing of functional circuit boards and advanced electronic devices.
.. weiterlesen
Delivering Engaging Technical Presentations
Held on October 31, 2023, this webinar featured Dr. Bev Christian presenting "Delivering Engaging Technical Presentations." The session offered practical strategies for improving the clarity
.. weiterlesen
Technical Paper Writing: Preparing to Publish Work for a Conference
On September 28, 2023, Stanton Rak, Ph.D., presented a webinar titled "Technical Paper Writing: Industry Best Practices for Conference Manuscripts." In this session, Dr. Rak shared expert gu
.. weiterlesen
Inspection and Failure Analysis of BTCs (Bottom Termination Components
On August 30, 2023, IPC hosted a webinar titled "Inspection and Failure Analysis of Bottom Termination Components", presented by William Graver. The session delved into the challenges associ
.. weiterlesen
Using Technology to Increase Throughput and Reduce Errors in Wire Harness Production
This technical webinar, held on June 27, 2023, explored technologies that help wire harness assemblers reduce errors and improve efficiency. Topics included guided insertion of seal plugs an
.. weiterlesen
Voids in Solder Joints and Their Impact on Assembly Reliability
This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610
.. weiterlesen
CCA SMT Cleaning Processes and Solder-flux Effects For Mil/Aero Applications
Held on April 18, 2023, this webinar explored how surface mount component and package design can impact the effectiveness of cleaning circuit card assemblies (CCAs), especially for Mil/Aero
.. weiterlesen
HDI and Ultra HDI - Critical aspects needed to support IC substrates and Advanced Packaging
The webinar, presented by Mike Carano on March 29, 2023, delved into the essential considerations for implementing High-Density Interconnect (HDI) and Ultra HDI technologies in the context o
.. weiterlesen
Introduction to Machine Data Analytics in the EMS Industry
This webinar, held on March 15, 2023, covered a brief introduction to the types of machine data available in an EMS factory and how to set up an analytics environment using freely available,
.. weiterlesen
Electronic Textile Evaluation Methods for Product Engineers and Designers
On December 14, 2022, Madison Maxey, founder and technical lead of Loomia, shared highlights of her IPC APEX EXPO 2023 professional development course. The course provided a primer for elect
.. weiterlesen
Gold-Aluminum Wire Bonding Process, Quality and Reliability
This webinar, held on December 7, 2022, previewed the IPC APEX EXPO 2023 professional development course, “Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Dr. Syed Sajid Ahmad,
.. weiterlesen
Wired for Change: Electronics Industry Sentiment on Sustainability
In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a
.. weiterlesen
NAVIGATING E-MOBILITY SUSTAINABILITY: EVOLVING COMPLIANCE AND ESG REQUIREMENTS FOR ELECTRONICS SUPPLIERS
This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background abou
.. weiterlesen
Unlocking AI for Automated Optical Inspection
Artificial intelligence (AI) is the theory and development of computer systems able to perform tasks that normally require human intelligence. This includes visual perception and pattern rec
.. weiterlesen
Why Double Materiality Assessments Matter: Compliance and Competitive Advantage
IPC International, Inc. recognizes the challenges and opportunities facing companies in the electronics industry in the evolving practice of sustainability, most notably, the obligations est
.. weiterlesen
AI-BASED DATA CENTERS FOR THE UNITED STATES
As the United States turns to generative artificial intelligence (AI) to drive a wide range of manufacturing applications, it is critical to ensure the strength of assembly capabilities to r
.. weiterlesen
ADVANCED PACKAGING TO BOARD LEVEL INTEGRATION – NEEDS AND CHALLENGES
HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with ex
.. weiterlesen