Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Oxide Alternative Process Development for High Frequency Bonding Applications
The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid
.. weiterlesen
Innovative Panel Plating for Heterogeneous Integration
The migration to large panel substrates in advanced packaging applications is principally motivated by cost considerations. However, it is occurring at a time when package processing is beco
.. weiterlesen
The Needs for, and Problems Experienced While Developing a Successful Low Palladium Activation System for Electroless Copper Deposition.
The electroless deposition of Copper is widely used within the printed circuit board industry as it offers a simple and reliable method for metallizing holes, which subsequently enable multi
.. weiterlesen
Process Characterization that Results in Acceptable Levels of Flux and Other Residues
Surface Insulation Resistance (SIR) testing is a standard method used to characterize soldering and cleaning processes that result in acceptable levels of flux and other residues. Several di
.. weiterlesen
Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp
.. weiterlesen
Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. weiterlesen
Discrete Event Simulation in Electronics Manufacturing Operations
Every year, billions and billions of products are made and sold across the world. Each of these products, regardless of volume, are made in facilities that follow certain steps to assemble,
.. weiterlesen
Single Device Traceability in Assembly without ECID
Use cases, solutions and standards for single device traceability in the supply chain to enable root case analysis, recall containment, device pairing, yield and reliability improvement and
.. weiterlesen
Bringing AI To The Edge A Collaborative Study Of Defect Detection In Surface Mount Devices
Machine Learning
Edge Computing
Edge AI
Demonstrated using a Case Study on HiP (Head in Pillow) defect detection
.. weiterlesen
Achieving Solder Reliability for LGA Ceramic Image Sensors Through Refinement of SMT Soldering Processes
New product introduction at an Original Equipment Manufacturer (OEM) typically includes reliability testing in the form of thermal cycling. Samplings from the engineering models of a new pro
.. weiterlesen
Temperature Cycling with Bending to Reproduce Typical Product Loads
In automotive applications, electronic products are subject to several loads, among which thermomechanical loads are particularly affecting the product reliability. Temperature cycling tests
.. weiterlesen
System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p
.. weiterlesen
Jet-Dispensed SMT Adhesives for Durable Printed Electronics
Polymer Thick Film(PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry. This pap
.. weiterlesen
Improved Process Yield with Dynamic “real-time” Dual Head Dispensing
Today’s unique assembly challenges are comprised of complex PCB panelization, involving identical PCBs with a goal towards increased production capability, due to a reduced footprint of the
.. weiterlesen
Industrial Beta Deployment of 1st Domestic, High Volume SAP Process for Resolving HDI Technologies Down to 25 Micron Space and...
The drive for miniaturization of both commercial and aerospace/military technologies are not compatible with the current standard United States domestic PCB manufacturing processes at the vo
.. weiterlesen
Advanced Interconnect Process Enables Very High-DensityPCB Structures
The need for increasingly complex electronics combined with the obsolescence of larger component packages is driving innovation to provide alternatives to the traditional subtractive-etch fa
.. weiterlesen
Industry 4.0 - How we transform a Buzzword into Manufacturing Excellence in Electronics: Case Study for Improving the PCB Print...
The competitive pressures that electronics companies experience today are exceptional, even for an industry accustomed to a relentlessly high rate of innovation. Manufacturers are challenged
.. weiterlesen
The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing
The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service o
.. weiterlesen
Optimization of Robotic Soldering Process: A Focus on Solder Spread and Spattering
Robotic soldering is a growing market within the PCB Assembly industry and interest in robotic soldering equipment and applications is increasing every year. This method is more efficient th
.. weiterlesen
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. weiterlesen
Structural Electronics for Automotive Interiors
This paper presents results from a joined R&D project between two companies; Automotive Tier-1 and Technology Provider of structural electronics. Key benefits of structural electronics a
.. weiterlesen
Vibration Testing of Harsh Environment Solder Alloys
Electronic components are exposed to impact loadings and mechanical vibrations during assembly, material handling, and transportation. These loadings might affect the fatigue life of solder
.. weiterlesen
Materials Considerations for Automotive Radar Designs: Increasing Reliability in Automotive Safety Systems
Radio Detection and Ranging (radar) sensors require specialized materials and specific tolerances in order to optimize their function. However, although not new to many markets, such as the
.. weiterlesen
Hot AirBGARework Process Improvement with a Touchless Temperature-Dependent Live-Feedback Process
Commonly used integrated circuits have been increasingly moving from leaded packages that are reworkable with a soldering iron to leadless packages such as BGAs that require complex rework t
.. weiterlesen
Get Rid of the Wooden Pick and Other Neanderthal Approaches for Rework of Underfilled Components
Multiple Electronics Markets are driving the growing need for components with higher performance in smaller form factors with higher pin count and greater reliability.
Ball Grid Ar
.. weiterlesen
An Interesting Approach toYield Improvement
Whilst many forward-thinking companies invest time, effort and cost into up front work to fix snags which would lead to issues with yield during production, this paper shows the efforts of a
.. weiterlesen
Accuracy Validation Finds Hidden Problems Affecting DPMO
If you don't measure, you don't know. These are appropriate words for the application of statistical methods for measuring machine and process capabilities in surface mount technology (SMT)
.. weiterlesen
Pick-and-Place Feeder density within SMT and Electronics Assembly
With the growth of Surface Mount Technology (SMT) driven by new technological innovations and next generation products, machine feeder density becomes extremely important in electronics manu
.. weiterlesen
Impact of PCB Manufacturing, Design, and Material to PCB Warpage
Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards (PCB) in the assembly process. The use of
.. weiterlesen
California Proposition 65 Review
Warning required to be provided for exposing person to a listed chemical, unless “person in the course of doing business” can demonstrate it does not pose “significant risk” •App
.. weiterlesen
Oxide Alternative Process Development for High Frequency Bonding Applications
The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid
.. weiterlesen
Innovative Panel Plating for Heterogeneous Integration
The migration to large panel substrates in advanced packaging applications is principally motivated by cost considerations. However, it is occurring at a time when package processing is beco
.. weiterlesen
The Needs for, and Problems Experienced While Developing a Successful Low Palladium Activation System for Electroless Copper Deposition.
The electroless deposition of Copper is widely used within the printed circuit board industry as it offers a simple and reliable method for metallizing holes, which subsequently enable multi
.. weiterlesen
Process Characterization that Results in Acceptable Levels of Flux and Other Residues
Surface Insulation Resistance (SIR) testing is a standard method used to characterize soldering and cleaning processes that result in acceptable levels of flux and other residues. Several di
.. weiterlesen
Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp
.. weiterlesen
Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. weiterlesen
Discrete Event Simulation in Electronics Manufacturing Operations
Every year, billions and billions of products are made and sold across the world. Each of these products, regardless of volume, are made in facilities that follow certain steps to assemble,
.. weiterlesen
Single Device Traceability in Assembly without ECID
Use cases, solutions and standards for single device traceability in the supply chain to enable root case analysis, recall containment, device pairing, yield and reliability improvement and
.. weiterlesen
Bringing AI To The Edge A Collaborative Study Of Defect Detection In Surface Mount Devices
Machine Learning
Edge Computing
Edge AI
Demonstrated using a Case Study on HiP (Head in Pillow) defect detection
.. weiterlesen
Achieving Solder Reliability for LGA Ceramic Image Sensors Through Refinement of SMT Soldering Processes
New product introduction at an Original Equipment Manufacturer (OEM) typically includes reliability testing in the form of thermal cycling. Samplings from the engineering models of a new pro
.. weiterlesen
Temperature Cycling with Bending to Reproduce Typical Product Loads
In automotive applications, electronic products are subject to several loads, among which thermomechanical loads are particularly affecting the product reliability. Temperature cycling tests
.. weiterlesen
System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p
.. weiterlesen
Jet-Dispensed SMT Adhesives for Durable Printed Electronics
Polymer Thick Film(PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry. This pap
.. weiterlesen
Improved Process Yield with Dynamic “real-time” Dual Head Dispensing
Today’s unique assembly challenges are comprised of complex PCB panelization, involving identical PCBs with a goal towards increased production capability, due to a reduced footprint of the
.. weiterlesen
Industrial Beta Deployment of 1st Domestic, High Volume SAP Process for Resolving HDI Technologies Down to 25 Micron Space and...
The drive for miniaturization of both commercial and aerospace/military technologies are not compatible with the current standard United States domestic PCB manufacturing processes at the vo
.. weiterlesen
Advanced Interconnect Process Enables Very High-DensityPCB Structures
The need for increasingly complex electronics combined with the obsolescence of larger component packages is driving innovation to provide alternatives to the traditional subtractive-etch fa
.. weiterlesen
Industry 4.0 - How we transform a Buzzword into Manufacturing Excellence in Electronics: Case Study for Improving the PCB Print...
The competitive pressures that electronics companies experience today are exceptional, even for an industry accustomed to a relentlessly high rate of innovation. Manufacturers are challenged
.. weiterlesen
The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing
The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service o
.. weiterlesen
Optimization of Robotic Soldering Process: A Focus on Solder Spread and Spattering
Robotic soldering is a growing market within the PCB Assembly industry and interest in robotic soldering equipment and applications is increasing every year. This method is more efficient th
.. weiterlesen
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. weiterlesen
Structural Electronics for Automotive Interiors
This paper presents results from a joined R&D project between two companies; Automotive Tier-1 and Technology Provider of structural electronics. Key benefits of structural electronics a
.. weiterlesen
Vibration Testing of Harsh Environment Solder Alloys
Electronic components are exposed to impact loadings and mechanical vibrations during assembly, material handling, and transportation. These loadings might affect the fatigue life of solder
.. weiterlesen
Materials Considerations for Automotive Radar Designs: Increasing Reliability in Automotive Safety Systems
Radio Detection and Ranging (radar) sensors require specialized materials and specific tolerances in order to optimize their function. However, although not new to many markets, such as the
.. weiterlesen
Hot AirBGARework Process Improvement with a Touchless Temperature-Dependent Live-Feedback Process
Commonly used integrated circuits have been increasingly moving from leaded packages that are reworkable with a soldering iron to leadless packages such as BGAs that require complex rework t
.. weiterlesen
Get Rid of the Wooden Pick and Other Neanderthal Approaches for Rework of Underfilled Components
Multiple Electronics Markets are driving the growing need for components with higher performance in smaller form factors with higher pin count and greater reliability.
Ball Grid Ar
.. weiterlesen
An Interesting Approach toYield Improvement
Whilst many forward-thinking companies invest time, effort and cost into up front work to fix snags which would lead to issues with yield during production, this paper shows the efforts of a
.. weiterlesen
Accuracy Validation Finds Hidden Problems Affecting DPMO
If you don't measure, you don't know. These are appropriate words for the application of statistical methods for measuring machine and process capabilities in surface mount technology (SMT)
.. weiterlesen
Pick-and-Place Feeder density within SMT and Electronics Assembly
With the growth of Surface Mount Technology (SMT) driven by new technological innovations and next generation products, machine feeder density becomes extremely important in electronics manu
.. weiterlesen
Impact of PCB Manufacturing, Design, and Material to PCB Warpage
Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards (PCB) in the assembly process. The use of
.. weiterlesen
California Proposition 65 Review
Warning required to be provided for exposing person to a listed chemical, unless “person in the course of doing business” can demonstrate it does not pose “significant risk” •App
.. weiterlesen