Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Evaluation of Novel Thermosetting Stretchable Conductive Inks and Substrates for "Stretchtronics" Applications
Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf
.. weiterlesen
Washability of E-Textile Materials
E-textiles,also known as electronic textiles,smart textiles,smart clothing,smart garments,or smart fabrics,are fabrics with electronic components and sensors embedded in them. Key components of
.. weiterlesen
Overview of XR in a Manufacturing Environment
The Augmented Reality and Virtual Reality market is expected to cross $44 billion by the year 2025 according to various industry experts. This exciting new technology is not exactly new,but has
.. weiterlesen
Full Material Declarations: Removing Barriers to Environmental Data Reporting
Since the European Directives,RoHS (Restriction of Hazardous Substances) and REACH (Registration,Evaluation,Authorization and Restriction of Chemicals),entered into force in 2006-7,the number o
.. weiterlesen
Reaching Across Data Silos in the Electronics Supply Chain to Achieve Parts-Per-Billion Quality Levels
With the dramatic increase in connected devices in the IoT era,it is becoming imperative to do much more to ensure the quality of all electronic components,especially for devices in mission-cri
.. weiterlesen
Identifying and Combatting Counterfeiters
This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu
.. weiterlesen
Identifying and Combatting Counterfeiters
This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu
.. weiterlesen
Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards
There are numerous techniques to singulate printed circuit boards after assembly including break-out,routing,wheel cutting and now laser cutting. Lasers have several desirable advantages such a
.. weiterlesen
How Detrimental Production Concerns Related to Solder Mask Residues Can be Countered by Simple Operational Adaptations
The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective
.. weiterlesen
Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used
.. weiterlesen
Effects of Temperature Uniformity on Package Warpage
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfa
.. weiterlesen
Bond Strength Optimization of Silicone Thermally Conductive Adhesives for Heatsink Attachment
Silicone thermal interface materials (TIM) are used to bond heatsinks on many critical components in server card assemblies in typical industry systems. Silicone TIMs have excellent high temper
.. weiterlesen
Fill the Void IV: Elimination of Inter-Via Voiding
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to “Fill the Void.
.. weiterlesen
Voids in SMT Solder Joints - Myths Revisited
Since the introduction of lead-free soldering technology,voids in solder joints have been a topic of intensive investigations and discussions. One issue of detailed investigations is the format
.. weiterlesen
Residue Analysis of Masking Alternatives for Advanced Electronics
Prior to any conformal or chemically vapor deposited coating process,specific areas and components-often called “keep out zones”-on the printed circuit board (PCB) assembly are generally masked
.. weiterlesen
The Effect of a Nitrogen Reflow Environment on the Electrical Reliability of Rosin Based No-Clean Solder Paste Flux Residues
Rosin-based no-clean solder pastes are the most widely used solder pastes in the world and dominate consumer electronics assembly. The most common rosin-based no-clean solder paste reflow envir
.. weiterlesen
Correlations of Salt Composition and Surface Insulation Resistance Results
Sixteen simple inorganic salts were separately dissolved in water to a specific concentration,applied to separate Surface Insulation Resistance (SIR) coupons,dried and then the coupons were sub
.. weiterlesen
A Comparison of Registration Errors Amongst Suppliers of Printed Circuit boards
Misregistration of holes is the maximum amount of variation between the centerlines of all terminal pads within one plated through hole in a printed circuit board. The impacts of misregistratio
.. weiterlesen
SLP+
As the IoT market demands higher data rates and processing,the PCB technology is driving for smaller form factors,higher signal densities,and advanced material solutions. Miniaturization has be
.. weiterlesen
Embedded Inductors with Laser Machined Gap
This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. Design calculations are presented for a test coupon of
.. weiterlesen
Derivation of Equation on Thermal Life Prediction of Plated Through Hole for Printed Wiring Board
Printed wiring boards(PWBs) have recently been experiencing higher thermal stress in car electronics and high current equipment,etc. In this study, the effects of structural fa
.. weiterlesen
Thermo-mechanical Characterization of Next Generation Substrate Like Printed Circuit Board (SLP) Materials
Internet of Things (IoT) adoption pushes the boundaries of Printed Circuit Board (PCB) miniaturization and speed employing more hybrid stack-ups. The complexity of PCB stack up designs,material
.. weiterlesen
Examination of Glass/Epoxy Interfaces in Printed Circuit Boards
Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w
.. weiterlesen
Investigating the Influence of Corner Radius within Rectangular Aperture Designs
The mobile and consumer market is the driving force of the electronics assembly sector,this sector historically has been associated with early adopters of leading edge surface mount technology
.. weiterlesen
Stencil Nano-Coatings - Do They Improve Repeatability and Uniformity in the Print Process
Over the past few years,studies have shown that Nano-coatings can improve solder paste release and reduce underside cleaning in the print process. Many of these studies have focused on print vo
.. weiterlesen
RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad
.. weiterlesen
Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the creeping of the copper corrosion products across the PCB surfaces to the extent that they may e
.. weiterlesen
Surviving 3K Thermal Cycles with Variable Void Levels
Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh
.. weiterlesen
Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra
.. weiterlesen
Practical Considerations for PCB Impedance Measurements
It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically
.. weiterlesen
Evaluation of Novel Thermosetting Stretchable Conductive Inks and Substrates for "Stretchtronics" Applications
Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf
.. weiterlesen
Washability of E-Textile Materials
E-textiles,also known as electronic textiles,smart textiles,smart clothing,smart garments,or smart fabrics,are fabrics with electronic components and sensors embedded in them. Key components of
.. weiterlesen
Overview of XR in a Manufacturing Environment
The Augmented Reality and Virtual Reality market is expected to cross $44 billion by the year 2025 according to various industry experts. This exciting new technology is not exactly new,but has
.. weiterlesen
Full Material Declarations: Removing Barriers to Environmental Data Reporting
Since the European Directives,RoHS (Restriction of Hazardous Substances) and REACH (Registration,Evaluation,Authorization and Restriction of Chemicals),entered into force in 2006-7,the number o
.. weiterlesen
Reaching Across Data Silos in the Electronics Supply Chain to Achieve Parts-Per-Billion Quality Levels
With the dramatic increase in connected devices in the IoT era,it is becoming imperative to do much more to ensure the quality of all electronic components,especially for devices in mission-cri
.. weiterlesen
Identifying and Combatting Counterfeiters
This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu
.. weiterlesen
Identifying and Combatting Counterfeiters
This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu
.. weiterlesen
Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards
There are numerous techniques to singulate printed circuit boards after assembly including break-out,routing,wheel cutting and now laser cutting. Lasers have several desirable advantages such a
.. weiterlesen
How Detrimental Production Concerns Related to Solder Mask Residues Can be Countered by Simple Operational Adaptations
The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective
.. weiterlesen
Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used
.. weiterlesen
Effects of Temperature Uniformity on Package Warpage
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfa
.. weiterlesen
Bond Strength Optimization of Silicone Thermally Conductive Adhesives for Heatsink Attachment
Silicone thermal interface materials (TIM) are used to bond heatsinks on many critical components in server card assemblies in typical industry systems. Silicone TIMs have excellent high temper
.. weiterlesen
Fill the Void IV: Elimination of Inter-Via Voiding
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to “Fill the Void.
.. weiterlesen
Voids in SMT Solder Joints - Myths Revisited
Since the introduction of lead-free soldering technology,voids in solder joints have been a topic of intensive investigations and discussions. One issue of detailed investigations is the format
.. weiterlesen
Residue Analysis of Masking Alternatives for Advanced Electronics
Prior to any conformal or chemically vapor deposited coating process,specific areas and components-often called “keep out zones”-on the printed circuit board (PCB) assembly are generally masked
.. weiterlesen
The Effect of a Nitrogen Reflow Environment on the Electrical Reliability of Rosin Based No-Clean Solder Paste Flux Residues
Rosin-based no-clean solder pastes are the most widely used solder pastes in the world and dominate consumer electronics assembly. The most common rosin-based no-clean solder paste reflow envir
.. weiterlesen
Correlations of Salt Composition and Surface Insulation Resistance Results
Sixteen simple inorganic salts were separately dissolved in water to a specific concentration,applied to separate Surface Insulation Resistance (SIR) coupons,dried and then the coupons were sub
.. weiterlesen
A Comparison of Registration Errors Amongst Suppliers of Printed Circuit boards
Misregistration of holes is the maximum amount of variation between the centerlines of all terminal pads within one plated through hole in a printed circuit board. The impacts of misregistratio
.. weiterlesen
SLP+
As the IoT market demands higher data rates and processing,the PCB technology is driving for smaller form factors,higher signal densities,and advanced material solutions. Miniaturization has be
.. weiterlesen
Embedded Inductors with Laser Machined Gap
This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. Design calculations are presented for a test coupon of
.. weiterlesen
Derivation of Equation on Thermal Life Prediction of Plated Through Hole for Printed Wiring Board
Printed wiring boards(PWBs) have recently been experiencing higher thermal stress in car electronics and high current equipment,etc. In this study, the effects of structural fa
.. weiterlesen
Thermo-mechanical Characterization of Next Generation Substrate Like Printed Circuit Board (SLP) Materials
Internet of Things (IoT) adoption pushes the boundaries of Printed Circuit Board (PCB) miniaturization and speed employing more hybrid stack-ups. The complexity of PCB stack up designs,material
.. weiterlesen
Examination of Glass/Epoxy Interfaces in Printed Circuit Boards
Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w
.. weiterlesen
Investigating the Influence of Corner Radius within Rectangular Aperture Designs
The mobile and consumer market is the driving force of the electronics assembly sector,this sector historically has been associated with early adopters of leading edge surface mount technology
.. weiterlesen
Stencil Nano-Coatings - Do They Improve Repeatability and Uniformity in the Print Process
Over the past few years,studies have shown that Nano-coatings can improve solder paste release and reduce underside cleaning in the print process. Many of these studies have focused on print vo
.. weiterlesen
RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad
.. weiterlesen
Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the creeping of the copper corrosion products across the PCB surfaces to the extent that they may e
.. weiterlesen
Surviving 3K Thermal Cycles with Variable Void Levels
Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh
.. weiterlesen
Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra
.. weiterlesen
Practical Considerations for PCB Impedance Measurements
It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically
.. weiterlesen