Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Anzeige
IPC/IMEC/ESA Microvia TV CITC Test Results
IPC/IMEC/ESA Microvia TV CITC Outline
CITC Coupon and Test Plan Overview
CITC Test Introduction
Temperature Coefficient of Resistance (TCR) Test and Resul
.. weiterlesen
Process Improvement Strategies for Weak Microvia Interfaces
The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c
.. weiterlesen
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. weiterlesen
Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. weiterlesen
Technology Verification for Reliable Smart Surfaces
The Company has developed and industrialized an advanced technology of plastic-integrated structural electronics. Key benefits are 3-dimensional shapes, reduced thickness and weight as well
.. weiterlesen
Addressing the Changing Landscape of Automotive Electronic Designs: Improving Performance and Robustness Through Proper Material Choice
The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the a
.. weiterlesen
Reliability of Solder Alloys Depending on Different Substrate Characteristics (Type and Surface Finish)
Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend
.. weiterlesen
Comparative Corrosion: Engineered Aqueous Cleaner vs. Ph Neutral -Round 1
The corrosion mechanism in the aqueous cleaning process is poorly understood. Much of the prior work is theoretical, based solely on Pourbaix Diagrams. These diagrams are based on the thermo
.. weiterlesen
Solder Mask and Low Standoff Component Cleaning – A Connection?
Today, printed circuit boards used within electronic assemblies for high reliability applications are typically subjected to cleaning or defluxing processes. As assembly complexity has incre
.. weiterlesen
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. weiterlesen
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With
.. weiterlesen
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v
.. weiterlesen
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke
.. weiterlesen
Cure Temperature Impact on Silicone Properties
Most dispensable thermosetting products are supplied as blends of monomers or pre-polymers. Curing involves a complicated chemical “dance” with a precise sequence of polymerization of one or
.. weiterlesen
High Performance Light and Moisture Dual Curable Encapsulant
Light-curable materials can provide significant benefits over conventional technologies, including very fast tack free curing, lower operating costs driven by lower labor needs, space saving
.. weiterlesen
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect
.. weiterlesen
01005 Rework – Barricades and Technological Processes
Chip components are important elements in electronic production since surface mount technology was introduced. Over the years, package size has constantly decreased. The small resistors and
.. weiterlesen
PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. weiterlesen
The Keys to 100% Effective Reliability Testing and Failure Analysis of HDI/Microvias
The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even
.. weiterlesen
High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. weiterlesen
Lessons Learned While Investigating Microvia Reliability Failures.
Micro vias, be they mechanically, or more typically laser drilled have revolutionized the technical capabilities of today PCBs. Their high hit rate, and low-cost during manufacture, in combi
.. weiterlesen
Functional Testing of Complex Circuits with Automatic Test Equipment in Manufacturing and Support
Automatic Test Equipment (ATE) in the form of in-circuit and manufacturing defects analyzers have been used successfully for finding catastrophic flaws that occur during production and assem
.. weiterlesen
A Method to Investigate Printed Circuit Board Supplier Rework Processes and Best Practices
Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an
.. weiterlesen
Testing and Implementation of Direct Imaging and Direct Jetting of Solder Mask
Printed circuit board manufacturers are continually challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. This trend is mot
.. weiterlesen
Detect PCB Stack-up Error with Machine Learning Methods
In manufacturing multilayer printed circuit boards (PCBs), the PCB layer stack-up usually includes multiple plies of various types of prepreg along with the inner layer core material. Most o
.. weiterlesen
The IPC CFX Standard as it Applies to Reflow Soldering
The advent of the Industry 4.0 Revolution and Internet of Manufacturing (IoM) has started to yield Smart factories, intelligent machines and networked processes, that have brought us improve
.. weiterlesen
Optimizing Throughput and Cost with Manufacturing Simulation
Electronics assembly can be delivered at competitive market prices only as long as the manufacturing process is continuously improved. Manufacturing companies are mastering with the help of
.. weiterlesen
Interfacing Machines with Manufacturing Software: What Exactly Does It Entail and Is It Worth the Hassle?
With the ascent of Industry 4.0, the urgency of connecting to equipment on a manufacturing line is increasing. This article focuses on the electronics industry and summarizes what that inter
.. weiterlesen
A Hybrid Sintering Technology for High-power Density Devices Used in Aerospace Applications
Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power
.. weiterlesen
Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat
.. weiterlesen
IPC/IMEC/ESA Microvia TV CITC Test Results
IPC/IMEC/ESA Microvia TV CITC Outline
CITC Coupon and Test Plan Overview
CITC Test Introduction
Temperature Coefficient of Resistance (TCR) Test and Resul
.. weiterlesen
Process Improvement Strategies for Weak Microvia Interfaces
The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c
.. weiterlesen
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. weiterlesen
Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. weiterlesen
Technology Verification for Reliable Smart Surfaces
The Company has developed and industrialized an advanced technology of plastic-integrated structural electronics. Key benefits are 3-dimensional shapes, reduced thickness and weight as well
.. weiterlesen
Addressing the Changing Landscape of Automotive Electronic Designs: Improving Performance and Robustness Through Proper Material Choice
The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the a
.. weiterlesen
Reliability of Solder Alloys Depending on Different Substrate Characteristics (Type and Surface Finish)
Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend
.. weiterlesen
Comparative Corrosion: Engineered Aqueous Cleaner vs. Ph Neutral -Round 1
The corrosion mechanism in the aqueous cleaning process is poorly understood. Much of the prior work is theoretical, based solely on Pourbaix Diagrams. These diagrams are based on the thermo
.. weiterlesen
Solder Mask and Low Standoff Component Cleaning – A Connection?
Today, printed circuit boards used within electronic assemblies for high reliability applications are typically subjected to cleaning or defluxing processes. As assembly complexity has incre
.. weiterlesen
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. weiterlesen
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With
.. weiterlesen
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v
.. weiterlesen
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke
.. weiterlesen
Cure Temperature Impact on Silicone Properties
Most dispensable thermosetting products are supplied as blends of monomers or pre-polymers. Curing involves a complicated chemical “dance” with a precise sequence of polymerization of one or
.. weiterlesen
High Performance Light and Moisture Dual Curable Encapsulant
Light-curable materials can provide significant benefits over conventional technologies, including very fast tack free curing, lower operating costs driven by lower labor needs, space saving
.. weiterlesen
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect
.. weiterlesen
01005 Rework – Barricades and Technological Processes
Chip components are important elements in electronic production since surface mount technology was introduced. Over the years, package size has constantly decreased. The small resistors and
.. weiterlesen
PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. weiterlesen
The Keys to 100% Effective Reliability Testing and Failure Analysis of HDI/Microvias
The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even
.. weiterlesen
High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. weiterlesen
Lessons Learned While Investigating Microvia Reliability Failures.
Micro vias, be they mechanically, or more typically laser drilled have revolutionized the technical capabilities of today PCBs. Their high hit rate, and low-cost during manufacture, in combi
.. weiterlesen
Functional Testing of Complex Circuits with Automatic Test Equipment in Manufacturing and Support
Automatic Test Equipment (ATE) in the form of in-circuit and manufacturing defects analyzers have been used successfully for finding catastrophic flaws that occur during production and assem
.. weiterlesen
A Method to Investigate Printed Circuit Board Supplier Rework Processes and Best Practices
Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an
.. weiterlesen
Testing and Implementation of Direct Imaging and Direct Jetting of Solder Mask
Printed circuit board manufacturers are continually challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. This trend is mot
.. weiterlesen
Detect PCB Stack-up Error with Machine Learning Methods
In manufacturing multilayer printed circuit boards (PCBs), the PCB layer stack-up usually includes multiple plies of various types of prepreg along with the inner layer core material. Most o
.. weiterlesen
The IPC CFX Standard as it Applies to Reflow Soldering
The advent of the Industry 4.0 Revolution and Internet of Manufacturing (IoM) has started to yield Smart factories, intelligent machines and networked processes, that have brought us improve
.. weiterlesen
Optimizing Throughput and Cost with Manufacturing Simulation
Electronics assembly can be delivered at competitive market prices only as long as the manufacturing process is continuously improved. Manufacturing companies are mastering with the help of
.. weiterlesen
Interfacing Machines with Manufacturing Software: What Exactly Does It Entail and Is It Worth the Hassle?
With the ascent of Industry 4.0, the urgency of connecting to equipment on a manufacturing line is increasing. This article focuses on the electronics industry and summarizes what that inter
.. weiterlesen
A Hybrid Sintering Technology for High-power Density Devices Used in Aerospace Applications
Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power
.. weiterlesen
Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat
.. weiterlesen