Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Anzeige
New Laminates for High Reliability Printed Circuit Boards
The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer
temperatures; faster clock cycles and higher bandwidths; higher component density
.. weiterlesen
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. weiterlesen
Vacuum Soldering and Void-Free,Lead Free Solder Joints
Vacuum-condensation soldering is a new process,developed to combine the advantages of condensation soldering and
vacuum soldering. The lecture introduces the results of the project development,
.. weiterlesen
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. weiterlesen
Running Lead Free Reflow Profiles Without Nitrogen
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward reflow profiles that are
considerably longer than those used for lead-bearing products. This is due to
.. weiterlesen
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder
One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives
to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead-
.. weiterlesen
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. weiterlesen
The Use of Liquid Isopropyl Alcohol and Hydrogen Peroxide Gas Plasma to Biologically Decontaminate Spacecraft Electronics
Legitimate concern exists regarding sending spacecraft and their associated hardware to solar system bodies where they could
possibly contaminate the body’s surface with terrestrial microorgani
.. weiterlesen
Closed-Loop Process Control in the Solder Paste Printing Process
Over the last several years there has been a great deal of advancement in post-print inspection technology. The capability to
inspect printed solder paste deposits immediately after the printin
.. weiterlesen
X-ray Inspection of Voids in BGA Joints with Respect to the IPC-7095A Specification
With the introduction of Lead-free solder,voiding within BGA joints is potentially a major issue during PCBA manufacture.
With BGA components sometimes costing hundreds or even thousands of US
.. weiterlesen
What’s Process Control Good For? Real Data from Real Sites
This paper presents data collected from a set of electronics manufacturers using an automated optical inspection post-place
system for the purpose of both defect detection and process-control a
.. weiterlesen
The Thermal and Thermo-Mechanical Properties of Carbon Composite Laminate
Carbon Composite raw material property comparison are summarized below:
-Thermal Conductivity – Watts per meter ? Kelvin.
The core material can spread up to 620.0 W/m?K.
-CTE – parts per millio
.. weiterlesen
Profile-Free Copper Foil for High Density Wiring and High Frequency Application
Nowadays,the growth of electronic industry is remarkable. All electronic devices are getting smaller with higher performance and data
transmission speed. Therefore,we have developed a new profi
.. weiterlesen
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. weiterlesen
Lead Free Implementation - A Case Study Correlating the Thermal Profile and Laboratory Analysis
The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are
scheduled to ban Pb alloys in July 2006. China is in process of preparin
.. weiterlesen
Implementing Pb-Free Process
European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These
regulations have a great impact on the Electronic Packaging and Interconnect
.. weiterlesen
Are Scandinavian Companies Ready for Production of Lead Free PCBs?
For more than two years,experts,authorities and sales people in the electronic industry have talked about WEEE and
RoHS. In most cases,it has been theoretical and few companies in Scandinavia h
.. weiterlesen
JCAA/JG-PP No-Lead Solder Project: -20°C to +80°C Thermal Cycle Test
Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint
Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The J
.. weiterlesen
JCAA/JG-PP No-Lead Solder Project: -55ºC to +125ºC Thermal Cycle Testing Status Report
The use of conventional tin-lead (Sn/Pb) solder in circuit board manufacturing is under ever-increasing political scrutiny due
to environmental issues and new regulations concerning lead,such a
.. weiterlesen
JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined Environments Test
A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention
Lead free Solder project. The purpose of the project was to validate and
.. weiterlesen
Accuracy Improvements for the Dispensing Operation
Technology requirements within the electronics industry are rapidly driving the miniaturization of and increasing component
densities on the printed circuit board. As a result,assembly equipmen
.. weiterlesen
Dispensing Solder Paste Micro-Deposits to 0.2mm – A Process Solution
Solder paste dispensing is not a new process. However,today’s microelectronics present a daunting array of technical
challenges to meet deposit size requirements. The need for better paste form
.. weiterlesen
Jetting- a New Paradigm in Dispensing
Today’s advanced packages for electronics are required to meet a wide range of requirements for reliability,size and cost.
Surface mount technology still prevails in low cost electronics (telev
.. weiterlesen
Solution Processed High Capacitance Nanocomposite Dielectric for Printed Electronics Applications
Since early last decade,scientists had succeeded in applying printing-related technologies to create organic field
effect transistors (OFETs) with micron-sized features. This has led to a wide-
.. weiterlesen
Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration
Many articles have been published on the benefit of thin substrates for use as embedded capacitor layers as well as thin film
resistive material for embedded resistors. Until now the utilizatio
.. weiterlesen
An Analytical Analysis of the Discharge of a Buried Sheet Capacitor Using a LCR Analogy
Buried sheet capacitance has been used for sometime in sophisticated PCB designs. The ZBC 2000TM patented by the
Sanmina Corporation is a familiar example. Conceptually,this product consists of
.. weiterlesen
Embedded Passives Go for It!
The trend towards miniaturization has been with us for quite a while,with marketing departments pressuring for ever-smaller
dimensions for everything. A question that arises frequently in this
.. weiterlesen
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. weiterlesen
Comparison of Types III,IV and V Solder Pastes
A brand name Pb-free solder paste made with three different sizes of solder paste spheres was studied. The soldering ability
of Types III,IV and V solder paste in terms of opens,shorts,solder s
.. weiterlesen
Understanding Stencil Requirements for a Lead Free Mass Imaging Process
Many words have been written about the impending lead free transition,during this period of frantic discovery lots has
been communicated about the reflow and alloy concerns; But the print proce
.. weiterlesen
New Laminates for High Reliability Printed Circuit Boards
The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer
temperatures; faster clock cycles and higher bandwidths; higher component density
.. weiterlesen
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. weiterlesen
Vacuum Soldering and Void-Free,Lead Free Solder Joints
Vacuum-condensation soldering is a new process,developed to combine the advantages of condensation soldering and
vacuum soldering. The lecture introduces the results of the project development,
.. weiterlesen
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. weiterlesen
Running Lead Free Reflow Profiles Without Nitrogen
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward reflow profiles that are
considerably longer than those used for lead-bearing products. This is due to
.. weiterlesen
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder
One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives
to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead-
.. weiterlesen
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. weiterlesen
The Use of Liquid Isopropyl Alcohol and Hydrogen Peroxide Gas Plasma to Biologically Decontaminate Spacecraft Electronics
Legitimate concern exists regarding sending spacecraft and their associated hardware to solar system bodies where they could
possibly contaminate the body’s surface with terrestrial microorgani
.. weiterlesen
Closed-Loop Process Control in the Solder Paste Printing Process
Over the last several years there has been a great deal of advancement in post-print inspection technology. The capability to
inspect printed solder paste deposits immediately after the printin
.. weiterlesen
X-ray Inspection of Voids in BGA Joints with Respect to the IPC-7095A Specification
With the introduction of Lead-free solder,voiding within BGA joints is potentially a major issue during PCBA manufacture.
With BGA components sometimes costing hundreds or even thousands of US
.. weiterlesen
What’s Process Control Good For? Real Data from Real Sites
This paper presents data collected from a set of electronics manufacturers using an automated optical inspection post-place
system for the purpose of both defect detection and process-control a
.. weiterlesen
The Thermal and Thermo-Mechanical Properties of Carbon Composite Laminate
Carbon Composite raw material property comparison are summarized below:
-Thermal Conductivity – Watts per meter ? Kelvin.
The core material can spread up to 620.0 W/m?K.
-CTE – parts per millio
.. weiterlesen
Profile-Free Copper Foil for High Density Wiring and High Frequency Application
Nowadays,the growth of electronic industry is remarkable. All electronic devices are getting smaller with higher performance and data
transmission speed. Therefore,we have developed a new profi
.. weiterlesen
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. weiterlesen
Lead Free Implementation - A Case Study Correlating the Thermal Profile and Laboratory Analysis
The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are
scheduled to ban Pb alloys in July 2006. China is in process of preparin
.. weiterlesen
Implementing Pb-Free Process
European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These
regulations have a great impact on the Electronic Packaging and Interconnect
.. weiterlesen
Are Scandinavian Companies Ready for Production of Lead Free PCBs?
For more than two years,experts,authorities and sales people in the electronic industry have talked about WEEE and
RoHS. In most cases,it has been theoretical and few companies in Scandinavia h
.. weiterlesen
JCAA/JG-PP No-Lead Solder Project: -20°C to +80°C Thermal Cycle Test
Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint
Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The J
.. weiterlesen
JCAA/JG-PP No-Lead Solder Project: -55ºC to +125ºC Thermal Cycle Testing Status Report
The use of conventional tin-lead (Sn/Pb) solder in circuit board manufacturing is under ever-increasing political scrutiny due
to environmental issues and new regulations concerning lead,such a
.. weiterlesen
JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined Environments Test
A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention
Lead free Solder project. The purpose of the project was to validate and
.. weiterlesen
Accuracy Improvements for the Dispensing Operation
Technology requirements within the electronics industry are rapidly driving the miniaturization of and increasing component
densities on the printed circuit board. As a result,assembly equipmen
.. weiterlesen
Dispensing Solder Paste Micro-Deposits to 0.2mm – A Process Solution
Solder paste dispensing is not a new process. However,today’s microelectronics present a daunting array of technical
challenges to meet deposit size requirements. The need for better paste form
.. weiterlesen
Jetting- a New Paradigm in Dispensing
Today’s advanced packages for electronics are required to meet a wide range of requirements for reliability,size and cost.
Surface mount technology still prevails in low cost electronics (telev
.. weiterlesen
Solution Processed High Capacitance Nanocomposite Dielectric for Printed Electronics Applications
Since early last decade,scientists had succeeded in applying printing-related technologies to create organic field
effect transistors (OFETs) with micron-sized features. This has led to a wide-
.. weiterlesen
Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration
Many articles have been published on the benefit of thin substrates for use as embedded capacitor layers as well as thin film
resistive material for embedded resistors. Until now the utilizatio
.. weiterlesen
An Analytical Analysis of the Discharge of a Buried Sheet Capacitor Using a LCR Analogy
Buried sheet capacitance has been used for sometime in sophisticated PCB designs. The ZBC 2000TM patented by the
Sanmina Corporation is a familiar example. Conceptually,this product consists of
.. weiterlesen
Embedded Passives Go for It!
The trend towards miniaturization has been with us for quite a while,with marketing departments pressuring for ever-smaller
dimensions for everything. A question that arises frequently in this
.. weiterlesen
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. weiterlesen
Comparison of Types III,IV and V Solder Pastes
A brand name Pb-free solder paste made with three different sizes of solder paste spheres was studied. The soldering ability
of Types III,IV and V solder paste in terms of opens,shorts,solder s
.. weiterlesen
Understanding Stencil Requirements for a Lead Free Mass Imaging Process
Many words have been written about the impending lead free transition,during this period of frantic discovery lots has
been communicated about the reflow and alloy concerns; But the print proce
.. weiterlesen